Package case
Latest Plus Meditech Co., Ltd. Patents:
Description
The differently lined areas indicate surfaces of the package case with contrasting appearances.
The broken lines in the figures represent unclaimed environment only and form no part of the claimed design.
Claims
The ornamental design for package case, as shown and described.
Referenced Cited
U.S. Patent Documents
Patent History
Patent number: D726004
Type: Grant
Filed: Dec 30, 2013
Date of Patent: Apr 7, 2015
Assignee: Plus Meditech Co., Ltd. (Tainan)
Inventor: Yueh-Hua Chiang (Taipei)
Primary Examiner: Joel Sincavage
Assistant Examiner: Rhea Shields
Application Number: 29/478,020
Type: Grant
Filed: Dec 30, 2013
Date of Patent: Apr 7, 2015
Assignee: Plus Meditech Co., Ltd. (Tainan)
Inventor: Yueh-Hua Chiang (Taipei)
Primary Examiner: Joel Sincavage
Assistant Examiner: Rhea Shields
Application Number: 29/478,020
Classifications
Current U.S. Class:
D9/418