Earphone

- Sony Corporation
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Description

FIG. 1 is a perspective view of a first embodiment of an earphone showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a perspective view of a second embodiment of an earphone showing our new design;

FIG. 9 is a front elevational view thereof;

FIG. 10 is a rear elevational view thereof;

FIG. 11 is a left side elevational view thereof;

FIG. 12 is a right side elevational view thereof;

FIG. 13 is a top plan view thereof; and,

FIG. 14 is a bottom plan view thereof.

Portions shown as broken lines are for illustrative purposes only and form no part of the claimed design. Dot-dash broken lines define the boundaries of, but not included in, the claimed design.

Claims

The ornamental design for an earphone, as shown and described.

Referenced Cited
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Foreign Patent Documents
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Patent History
Patent number: D736185
Type: Grant
Filed: Mar 14, 2014
Date of Patent: Aug 11, 2015
Assignee: Sony Corporation (Tokyo)
Inventors: Taku Yaegashi (Tokyo), Junko Katsuraku (Tokyo)
Primary Examiner: Paula Greene
Application Number: 29/485,033
Classifications
Current U.S. Class: Headphone (D14/223)