Electronic materials neck tie

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Description

FIG. 1 is a front perspective view of an electronic materials neck tie.

FIG. 2 is a back perspective view of the electronic materials neck tie; and,

FIG. 3 is a side view of the electronic materials neck tie showing the neck tie partially folded.

The broken line showing of environmental structure in FIGS. 1-3 form no part of the claimed design.

Claims

I claim the ornamental design for an electronic materials neck tie, as shown and described.

Referenced Cited
U.S. Patent Documents
D161798 January 1951 Spielmann
4627113 December 9, 1986 Lord
D294658 March 15, 1988 Davenport, Sr.
D301520 June 13, 1989 Campbell
D318754 August 6, 1991 Hughes
D320499 October 8, 1991 White
5673434 October 7, 1997 Risk
D398435 September 22, 1998 Gray
D509944 September 27, 2005 Mason
D605376 December 8, 2009 Dickerson
D663916 July 24, 2012 Bracey
Other references
  • “Green and Gold Circuit Board Tie,” available for sale on-line. Publication date unknown. Retrieved from the internet on Sep. 12, 2015. URL: http://www.techwears.com/green-and-gold-circuit-board-tie/. (2 pages).
  • Circuit board tie, shown in article, 11 Wearable Tech: Circuit Chic (on-line); published on the Internet on Sep. 11, 2012, downloaded from the Internet on Sep. 19, 2015. URL: >http://techrange.blogspot.com/2012/09/11-wearable-tech-circuit-chic.html<. (6 pages, see p. 2).
Patent History
Patent number: D748370
Type: Grant
Filed: Dec 31, 2014
Date of Patent: Feb 2, 2016
Assignee: TecWares, LLC (Colorado Springs, CO)
Inventor: Andrew Johnson (Colorado Springs, CO)
Primary Examiner: Karen E. Eldridge Powers
Assistant Examiner: Jasmine Mlinarcik
Application Number: 29/513,512
Classifications
Current U.S. Class: D2/605