Dual material Y-connector
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The ornamental design that is claimed is shown in solid lines in the drawings. Any broken lines in the drawings are for illustrative purposes only and form no part of the claimed design.
Claims
The ornamental design for a dual material Y-connector, as shown and described.
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Type: Grant
Filed: Nov 25, 2014
Date of Patent: Mar 1, 2016
Assignee: Corpak MedSystems, Inc. (Buffalo Grove, IL)
Inventors: Crystal E. Koelper (North Barrington, IL), John L. Morici (Wauconda, IL)
Primary Examiner: Sandra Snapp
Application Number: 29/510,178