Overmold for a Y-connector
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Description
The ornamental design that is claimed is shown in solid lines in the drawings. Any broken lines in the drawings are for illustrative purposes only and form no part of the claimed design.
Claims
The ornamental design for an overmold for a Y-connector, as shown and described.
Referenced Cited
U.S. Patent Documents
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Patent History
Patent number: D750759
Type: Grant
Filed: Nov 25, 2014
Date of Patent: Mar 1, 2016
Assignee: Corpak MedSystems, Inc. (Buffalo Grove, IL)
Inventors: Crystal E. Koelper (North Barrington, IL), John L. Morici (Wauconda, IL)
Primary Examiner: Sandra Snapp
Application Number: 29/510,183
Type: Grant
Filed: Nov 25, 2014
Date of Patent: Mar 1, 2016
Assignee: Corpak MedSystems, Inc. (Buffalo Grove, IL)
Inventors: Crystal E. Koelper (North Barrington, IL), John L. Morici (Wauconda, IL)
Primary Examiner: Sandra Snapp
Application Number: 29/510,183
Classifications
Current U.S. Class:
Fitting (10) (D23/259)