Overmold for a Y-connector

- Corpak MedSystems, Inc.
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Description

FIG. 1 illustrates a perspective view of an overmold for a Y-connector according to the present invention;

FIG. 2 illustrates a front side elevational view thereof;

FIG. 3 illustrates a back side elevational view thereof;

FIG. 4 illustrates a right side elevational view thereof;

FIG. 5 illustrates a left side elevational view thereof;

FIG. 6 illustrates a top plan view thereof;

FIG. 7 illustrates a bottom plan view thereof; and,

FIG. 8 illustrates a front side elevational view thereof.

The ornamental design that is claimed is shown in solid lines in the drawings. Any broken lines in the drawings are for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for an overmold for a Y-connector, as shown and described.

Referenced Cited
U.S. Patent Documents
1910070 May 1933 Spaeth
D204184 March 1966 Schulze
3346887 October 1967 Sommer
3376897 April 1968 Dolder
3894302 July 1975 Lasater
4162546 July 31, 1979 Shortell
4480656 November 6, 1984 Johnson
5104150 April 14, 1992 Bard
5257826 November 2, 1993 Prassas
5344193 September 6, 1994 Rio
D389562 January 20, 1998 Picton
D456494 April 30, 2002 Whitfield
6442876 September 3, 2002 Morse
D612918 March 30, 2010 Alcebo
D654990 February 28, 2012 Coley
D658273 April 24, 2012 Cardo
Patent History
Patent number: D750759
Type: Grant
Filed: Nov 25, 2014
Date of Patent: Mar 1, 2016
Assignee: Corpak MedSystems, Inc. (Buffalo Grove, IL)
Inventors: Crystal E. Koelper (North Barrington, IL), John L. Morici (Wauconda, IL)
Primary Examiner: Sandra Snapp
Application Number: 29/510,183
Classifications
Current U.S. Class: Fitting (10) (D23/259)