Wire bonding wedge tool

- COORSTEK, INC.
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Description

FIG. 1 depicts a perspective view of a wire bonding wedge tool.

FIG. 2 depicts a second perspective view of the wire bonding wedge tool of FIG. 1, wherein FIG. 2 is rotated axially 90 degrees relative to FIG. 1.

FIG. 3 depicts a front side elevation view of the wire bonding wedge tool of FIG. 1.

FIG. 4 depicts a right side elevation view of the wire bonding wedge tool of FIG. 1.

FIG. 5 depicts a left side elevation view of the wire bonding wedge tool of FIG. 1.

FIG. 6 depicts a rear side elevation view of the wire bonding wedge tool of FIG. 1.

FIG. 7 depicts a top plan view of the wire bonding wedge tool of FIG. 6; and,

FIG. 8 depicts a bottom plan view of the wire bonding wedge tool of FIG. 6.

The broken lines in the figures depict portions of the wire bonding wedge tool that form no part of the claimed design.

Claims

The ornamental design for a wire bonding wedge tool, as shown and described.

Referenced Cited
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Other references
  • Search Report issued on Dec. 7, 2015 in Taiwanese Design Patent Application No. 104302295 (English Translation provided).
  • Decision of Grant issued on Jan. 26, 2016 in Japanese Design Application No. 2015-21935.
  • Office Action dated Oct. 6, 2015, issued in Japanese Design Application No. 2015-9731.
Patent History
Patent number: D753739
Type: Grant
Filed: Apr 17, 2015
Date of Patent: Apr 12, 2016
Assignee: COORSTEK, INC. (Golden, CO)
Inventor: Russell Bell (Ventura, CA)
Primary Examiner: Phillip S Hyder
Application Number: 29/524,165