Notebook ultrasonic module

- Edan Instruments, Inc.
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Description

FIG. 1 is a front side perspective view of a notebook ultrasonic module showing my new design;

FIG. 2 is another side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

Claims

The ornamental design for a notebook ultrasonic module, as shown and described.

Referenced Cited
U.S. Patent Documents
D377482 January 21, 1997 Geck
D421428 March 7, 2000 Wu
D474185 May 6, 2003 Goto
D485562 January 20, 2004 Goto
D491189 June 8, 2004 Williams
D496039 September 14, 2004 Kerrigan
D565573 April 1, 2008 Alo
D589517 March 31, 2009 Chien
D594009 June 9, 2009 Nakano
D742887 November 10, 2015 Ignomirello
D743404 November 17, 2015 Ignomirello
20040017651 January 29, 2004 Gan
Patent History
Patent number: D754665
Type: Grant
Filed: Oct 30, 2014
Date of Patent: Apr 26, 2016
Assignee: Edan Instruments, Inc. (Shenzhen, Guangdong Province)
Inventors: Renfu Zhang (Guangdong), Chunhong Xia (Guangdong), Shunjin Xiao (Guangdong)
Primary Examiner: Austin Murphy
Application Number: 29/507,700
Classifications