Notebook ultrasonic module
Description
Claims
The ornamental design for a notebook ultrasonic module, as shown and described.
Referenced Cited
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Patent History
Patent number: D754665
Type: Grant
Filed: Oct 30, 2014
Date of Patent: Apr 26, 2016
Assignee: Edan Instruments, Inc. (Shenzhen, Guangdong Province)
Inventors: Renfu Zhang (Guangdong), Chunhong Xia (Guangdong), Shunjin Xiao (Guangdong)
Primary Examiner: Austin Murphy
Application Number: 29/507,700
Type: Grant
Filed: Oct 30, 2014
Date of Patent: Apr 26, 2016
Assignee: Edan Instruments, Inc. (Shenzhen, Guangdong Province)
Inventors: Renfu Zhang (Guangdong), Chunhong Xia (Guangdong), Shunjin Xiao (Guangdong)
Primary Examiner: Austin Murphy
Application Number: 29/507,700
Classifications