Forklift
Latest Doosan Corporation Patents:
- System and method for manufacturing composite substrate
- Underfill film for semiconductor package and method for manufacturing semiconductor package using the same
- POLYAMIC ACID RESIN AND POLYIMIDE FILM USING THE SAME
- Resin composition, metal laminate and printed circuit board using same, and method for manufacturing metal laminate
- Forklift truck
Description
Claims
The ornamental design for a forklift, as shown and described.
Referenced Cited
U.S. Patent Documents
D393134 | March 31, 1998 | Mariano |
D395115 | June 9, 1998 | Russey |
D427409 | June 27, 2000 | Sato |
D468885 | January 14, 2003 | Salin |
D471339 | March 4, 2003 | Mori |
D538004 | March 6, 2007 | Kouyama |
D557474 | December 11, 2007 | Kouyama |
D612563 | March 23, 2010 | Stark |
D634504 | March 15, 2011 | Radaelli |
D657932 | April 17, 2012 | Kazaoka |
D663502 | July 10, 2012 | Lin |
D663503 | July 10, 2012 | Lin |
D694984 | December 3, 2013 | Kawakami |
D725863 | March 31, 2015 | Kazaoka |
D731736 | June 9, 2015 | Kurihara |
D731737 | June 9, 2015 | Seimiya |
D741565 | October 20, 2015 | Schweig |
Patent History
Patent number: D756059
Type: Grant
Filed: Jun 23, 2015
Date of Patent: May 10, 2016
Assignee: Doosan Corporation (Seoul)
Inventor: Sung Kyu Kang (Gyeonggi-do)
Primary Examiner: Mark Goodwin
Application Number: 29/531,161
Type: Grant
Filed: Jun 23, 2015
Date of Patent: May 10, 2016
Assignee: Doosan Corporation (Seoul)
Inventor: Sung Kyu Kang (Gyeonggi-do)
Primary Examiner: Mark Goodwin
Application Number: 29/531,161
Classifications
Current U.S. Class:
Mobile (D34/34)