Vibration sensor attachment
Latest Sony Corporation Patents:
- Information processing apparatus, information processing method and program
- Image processing apparatus and method
- Communication apparatus, communication method, and recording medium
- Biological image processing apparatus, method, non-transitory computer readable medium and biological image processing system
- Telecommunications apparatus and methods
The broken lines illustrate unclaimed portions of the vibration sensor attachment and form no part of the claimed design.
Claims
The ornamental design for a vibration sensor attachment, as shown and described.
| 6753778 | June 22, 2004 | Kruger |
| D583826 | December 30, 2008 | Sawai et al. |
| 8840483 | September 23, 2014 | Steusloff et al. |
| 8926444 | January 6, 2015 | Kato et al. |
| 8944929 | February 3, 2015 | Smith |
| 9033810 | May 19, 2015 | Bentley |
| 9144726 | September 29, 2015 | Whitney |
| 20090233735 | September 17, 2009 | Savarese et al. |
| 20110224012 | September 15, 2011 | Hashimoto et al. |
| 20120035003 | February 9, 2012 | Moran et al. |
| 20120052973 | March 1, 2012 | Bentley |
| 20130065703 | March 14, 2013 | Rose |
| D1227155 | January 2005 | JP |
- Final Decision of the Board of Appeal issued in Japanese Application No. D2013-030975, dated May 22, 2015.
Type: Grant
Filed: Jun 26, 2015
Date of Patent: May 31, 2016
Assignee: Sony Corporation (Tokyo)
Inventors: Yasuhide Hosoda (Kanagawa), Shinji Yamamura (Chiba), Tatsuhiro Obara (Chiba)
Primary Examiner: Antoine D Davis
Application Number: 29/531,539