Vibration sensor attachment
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The broken lines illustrate unclaimed portions of the vibration sensor attachment and form no part of the claimed design.
Claims
The ornamental design for a vibration sensor attachment, as shown and described.
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- Final Decision of the Board of Appeal issued in Japanese Application No. D2013-030975, dated May 22, 2015.
Type: Grant
Filed: Jun 26, 2015
Date of Patent: May 31, 2016
Assignee: Sony Corporation (Tokyo)
Inventors: Yasuhide Hosoda (Kanagawa), Shinji Yamamura (Chiba), Tatsuhiro Obara (Chiba)
Primary Examiner: Antoine D Davis
Application Number: 29/531,539