Package for lock devices
Latest TAIWAN FU HSING INDUSTRIAL CO., LTD. Patents:
Description
In the drawings, the broken lines are for the purpose of illustrating environment only and form no part of the claimed design.
Claims
The ornamental design for a package for lock devices, as shown and described.
Referenced Cited
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Patent History
Patent number: D760071
Type: Grant
Filed: Jun 17, 2015
Date of Patent: Jun 28, 2016
Assignee: TAIWAN FU HSING INDUSTRIAL CO., LTD. (Gangshan District, Kaohsiung)
Inventors: Wen-Fa Wu (Kaohsiung), Chiao-Chin Lu (Kaohsiung)
Primary Examiner: Holly Baynham
Assistant Examiner: Rhea Shields
Application Number: 29/530,591
Type: Grant
Filed: Jun 17, 2015
Date of Patent: Jun 28, 2016
Assignee: TAIWAN FU HSING INDUSTRIAL CO., LTD. (Gangshan District, Kaohsiung)
Inventors: Wen-Fa Wu (Kaohsiung), Chiao-Chin Lu (Kaohsiung)
Primary Examiner: Holly Baynham
Assistant Examiner: Rhea Shields
Application Number: 29/530,591
Classifications
Current U.S. Class:
D9/415