Package for lock devices

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Description

FIG. 1 is a front perspective view of a package for lock devices showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

In the drawings, the broken lines are for the purpose of illustrating environment only and form no part of the claimed design.

Claims

The ornamental design for a package for lock devices, as shown and described.

Referenced Cited
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Patent History
Patent number: D760071
Type: Grant
Filed: Jun 17, 2015
Date of Patent: Jun 28, 2016
Assignee: TAIWAN FU HSING INDUSTRIAL CO., LTD. (Gangshan District, Kaohsiung)
Inventors: Wen-Fa Wu (Kaohsiung), Chiao-Chin Lu (Kaohsiung)
Primary Examiner: Holly Baynham
Assistant Examiner: Rhea Shields
Application Number: 29/530,591
Classifications
Current U.S. Class: D9/415