Sensor module

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Description

FIG. 1 is perspective view of a sensor module showing the claimed design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left-side elevational view thereof;

FIG. 5 is a right-side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Broken lines are for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design of a sensor module, as shown and described.

Referenced Cited
U.S. Patent Documents
D735061 July 28, 2015 Laforest
D754007 April 19, 2016 Stefancic, Sr.
Patent History
Patent number: D772736
Type: Grant
Filed: Apr 20, 2015
Date of Patent: Nov 29, 2016
Assignee: SZ DJI TECHNOLOGY CO., LTD. (Shenzhen)
Inventors: Deng-Feng Hu (Shenzhen), Hong-Ju Li (Shenzhen), You Zhou (Shenzhen)
Primary Examiner: Antoine D Davis
Application Number: 29/524,294
Classifications
Current U.S. Class: Angle Or Direction (7) (D10/65)