Connection module

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Description

FIG. 1 is a top, front, left side perspective of the connection module;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a front elevation view thereof;

FIG. 5 is a back elevation view thereof;

FIG. 6 is a right side elevation view thereof;

FIG. 7 is a left side elevation view thereof; and,

FIG. 8 is a bottom, front, right side perspective view thereof.

The broken lines that appear on the drawings form no part of the claimed design and are included for illustrative purposes only.

Claims

The ornamental design for a connection module, as shown and described.

Referenced Cited
U.S. Patent Documents
D336746 June 22, 1993 Tse
D364399 November 21, 1995 Long
D434040 November 21, 2000 Yasufuku
D482692 November 25, 2003 Nishio
D485562 January 20, 2004 Goto
D486824 February 17, 2004 Chung
D499731 December 14, 2004 Fan
D506200 June 14, 2005 Shih
D506469 June 21, 2005 Matsunaga
D539853 April 3, 2007 Hussaini
D562326 February 19, 2008 Hsu
D562327 February 19, 2008 Hsu
D570845 June 10, 2008 Liu
D737778 September 1, 2015 Druscovich
D737779 September 1, 2015 Druscovich
D753604 April 12, 2016 Druscovich
20080070454 March 20, 2008 Chang
20080227309 September 18, 2008 Liao
Patent History
Patent number: D784342
Type: Grant
Filed: Jan 11, 2016
Date of Patent: Apr 18, 2017
Assignee: Telit Communications S.p.A. (Sgonico (Trieste))
Inventors: SeongWhan Kim (Seoul), Taehyoung Ko (Seoul)
Primary Examiner: Austin Murphy
Application Number: 29/551,139
Classifications