Connection module
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Description
The broken lines that appear on the drawings form no part of the claimed design and are included for illustrative purposes only.
Claims
The ornamental design for a connection module, as shown and described.
Referenced Cited
U.S. Patent Documents
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D539853 | April 3, 2007 | Hussaini |
D562326 | February 19, 2008 | Hsu |
D562327 | February 19, 2008 | Hsu |
D570845 | June 10, 2008 | Liu |
D737778 | September 1, 2015 | Druscovich |
D737779 | September 1, 2015 | Druscovich |
D753604 | April 12, 2016 | Druscovich |
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20080227309 | September 18, 2008 | Liao |
Patent History
Patent number: D784342
Type: Grant
Filed: Jan 11, 2016
Date of Patent: Apr 18, 2017
Assignee: Telit Communications S.p.A. (Sgonico (Trieste))
Inventors: SeongWhan Kim (Seoul), Taehyoung Ko (Seoul)
Primary Examiner: Austin Murphy
Application Number: 29/551,139
Type: Grant
Filed: Jan 11, 2016
Date of Patent: Apr 18, 2017
Assignee: Telit Communications S.p.A. (Sgonico (Trieste))
Inventors: SeongWhan Kim (Seoul), Taehyoung Ko (Seoul)
Primary Examiner: Austin Murphy
Application Number: 29/551,139
Classifications
Current U.S. Class:
Adapter, Connector Or Coupler (D14/433)