Package with surface ornamentation

- S. C. Johnson & Son, Inc.
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Description

FIG. 1 is a front elevational view of a package with surface ornamentation;

FIG. 2 is a front elevational view showing the package with surface ornamentation of FIG. 1 in an alternative unclaimed environment;

FIG. 3 is a front elevational view showing the package with surface ornamentation of FIG. 1 in a second alternative unclaimed environment; and,

FIG. 4 is a front elevational view showing the package with surface ornamentation of FIG. 1 in a third alternative unclaimed environment.

The broken lines showing the package are included for the purpose of illustrating environmental structure and form no part of the claimed design. The claim is limited to the solid lines in the drawings.

Claims

The ornamental design for a package with surface ornamentation, as shown and described.

Referenced Cited
U.S. Patent Documents
D74065 December 1927 Lumley
D88724 December 1932 Calvert
D89100 January 1933 White
D92965 August 1934 Kandetzki
D97553 November 1935 Hirsch
D152684 February 1949 Feltz
D153969 May 1949 Murray
D190384 May 1961 Meyerson
D191759 November 1961 Meyerson
D195872 August 1963 Rodriguez
D386710 November 25, 1997 Pandel
D495748 September 7, 2004 Leland
D676316 February 19, 2013 Powers
D676743 February 26, 2013 Powers
D679996 April 16, 2013 Kersten
D679997 April 16, 2013 Kersten
D684188 June 11, 2013 Kocmick
D706294 June 3, 2014 Jewitt
D723914 March 10, 2015 Singh
D725466 March 31, 2015 Giza
D760074 June 28, 2016 Giza
20100275478 November 4, 2010 Kuan
20110119968 May 26, 2011 Buddenhagen
Patent History
Patent number: D789197
Type: Grant
Filed: May 20, 2016
Date of Patent: Jun 13, 2017
Assignee: S. C. Johnson & Son, Inc. (Racine, WI)
Inventor: Danielle C. Giza (Brooklyn, NY)
Primary Examiner: Robert M Spear
Assistant Examiner: Darcey E Heflin
Application Number: 29/565,454
Classifications
Current U.S. Class: D9/434; D9/499