Connector modules
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The broken lines in the drawings illustrate portions of the connector modules that form no part of the claimed design.
Claims
The ornamental design for a connector module, as shown and described.
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Type: Grant
Filed: Oct 14, 2016
Date of Patent: May 8, 2018
Assignees: MICRODUINO INC. (Westlake Village, CA), MEIKE TECHNOLOGY (BEIJING) LTD. (Beijing)
Inventors: Jian Hu (Westlake Village, CA), Kejia Pan (Westlake Village, CA), Zhenshan Wang (Westlake Village, CA), Xi Li (Westlake Village, CA), Taiming Suo (Westlake Village, CA), Bin Feng (Westlake Village, CA)
Primary Examiner: Thomas Johannes
Assistant Examiner: Shawn T Gingrich
Application Number: 29/580,964