Headphone

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Description

FIG. 1 is a perspective view of an embodiment of a headphone, showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Broken lines are for illustrating unclaimed portions of the headphone; the broken lines form no part of the claimed design.

Any change in scale between different views is not intended to limit the headphone to a particular size.

Claims

I claim the ornamental design for a headphone, as shown and described.

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Patent History
Patent number: D826210
Type: Grant
Filed: Jun 1, 2017
Date of Patent: Aug 21, 2018
Assignee: RAZER (ASIA-PACIFIC) PTE. LTD. (Singapore)
Inventor: Boon Sim Chong (Singapore)
Primary Examiner: Paula Allen Greene
Application Number: 29/606,053
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)