Solder

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Description

FIG. 1 is a perspective view of a solder showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left view thereof;

FIG. 5 is a right view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken lines depict portions of the solder in which the design is embodied that are not considered part of the claimed design.

Claims

The ornamental design for solder, as shown and described.

Referenced Cited
U.S. Patent Documents
4552124 November 12, 1985 Nakajima
D300297 March 21, 1989 Arehart
4966128 October 30, 1990 Wang
D330998 November 17, 1992 Watmore
5490496 February 13, 1996 Lin
5915955 June 29, 1999 Lin
5928536 July 27, 1999 Lee
6513697 February 4, 2003 Sines
6874671 April 5, 2005 Hirano
6989511 January 24, 2006 Tsai
D577974 October 7, 2008 Miller
D659496 May 15, 2012 Mochizuki
D739696 September 29, 2015 Miyazaki
D743766 November 24, 2015 Tsai
9314863 April 19, 2016 Teraoka
D810532 February 20, 2018 Tsai
D813628 March 27, 2018 Tsai
20030146264 August 7, 2003 Miyazaki
20060108345 May 25, 2006 Shigekawa
Patent History
Patent number: D848232
Type: Grant
Filed: Sep 29, 2017
Date of Patent: May 14, 2019
Assignee: Goodhouse Enterprise Co. Ltd. (Taichung)
Inventor: Jung-Fa Tsai (Taichung)
Primary Examiner: Philip S Hyder
Application Number: 29/619,457
Classifications
Current U.S. Class: D8/30