Stamp

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Description

FIG. 1 is a perspective view of a stamp, showing my new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines immediately adjacent to the shaded areas depict the bounds of the claimed design, while all other broken lines are directed to portions of the article that form no part of the claimed design.

The wire frame lines shown throughout the views are intended to indicate surface contour.

Claims

The ornamental design for a stamp, as shown and described.

Referenced Cited
U.S. Patent Documents
D493191 July 20, 2004 Sculler
D493192 July 20, 2004 Sculler
6945172 September 20, 2005 Shih
D518087 March 28, 2006 Shih
7066089 June 27, 2006 Shih
D538840 March 20, 2007 Shih
D545353 June 26, 2007 Treml
D568381 May 6, 2008 Shih
D583857 December 30, 2008 Shih
D584340 January 6, 2009 Lee
D585087 January 20, 2009 Shih
D747405 January 12, 2016 Shih
20190270326 September 5, 2019 Shih
Foreign Patent Documents
005286804-0001 May 2018 EM
2505372 October 2012 EP
300416625.0000 June 2006 KR
07-1676-0101-0001 December 2008 MY
Patent History
Patent number: D870201
Type: Grant
Filed: Jul 3, 2018
Date of Patent: Dec 17, 2019
Assignee: SUN SAME ENTERPRISES CO., LTD. (Tainan)
Inventor: Wen-Jer Shih (Tainan)
Primary Examiner: Susan Bennett Hattan
Assistant Examiner: Lauren D McVey
Application Number: 29/655,403
Classifications