Diaper with bond pattern
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Claims
The ornamental design for a diaper with bond pattern, as shown and described.
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Type: Grant
Filed: Oct 28, 2016
Date of Patent: Jun 30, 2020
Assignee: The Procter & Gamble Company (Cincinnati, OH)
Inventors: Jason Edward Naylor (Loveland, OH), Jeromy Thomas Raycheck (South Lebanon, OH), Theodore Cory Fites (Cincinnati, OH), Christopher Erin Kiger (Union Township, OH), Justin Chance Leazer (West Chester, OH), Matthew Alexander Gittings (Cincinnati, OH)
Primary Examiner: Samantha Q Lawrence
Application Number: 29/582,630