Ultrasonic transducer
Latest KAIJO CORPORATION Patents:
- Wire bonding method and wire bonding apparatus
- Method for bonding insulated coating wire, connection structure, method for stripping insulated coating wire and bonding apparatus
- Ultrasonic cleaning apparatus and ultrasonic cleaning system
- Ultrasonic homogenizer
- Wire bonding method and wire bonding device
Description
The broken lines in the figures are for the purpose of illustrating environmental structure and form no part of the claimed design.
Claims
The ornamental design for an ultrasonic transducer, as shown and described.
Referenced Cited
U.S. Patent Documents
D234125 | January 1975 | Goble et al. |
D242779 | December 21, 1976 | Goble |
4616440 | October 14, 1986 | Millroy |
D334968 | April 20, 1993 | Gladfelter |
D352988 | November 29, 1994 | Jan |
D409626 | May 11, 1999 | Hansen |
D443105 | May 29, 2001 | Friesenhahn |
D454232 | March 5, 2002 | LaVanier |
D612478 | March 23, 2010 | Karolak |
D650524 | December 13, 2011 | Wilson |
D696555 | December 31, 2013 | Kolano |
D768922 | October 11, 2016 | Dietvorst |
Patent History
Patent number: D889593
Type: Grant
Filed: Jun 7, 2018
Date of Patent: Jul 7, 2020
Assignee: KAIJO CORPORATION (Tokyo)
Inventor: Akihisa Nakano (Tokyo)
Primary Examiner: Derrick E Holland
Application Number: 29/650,549
Type: Grant
Filed: Jun 7, 2018
Date of Patent: Jul 7, 2020
Assignee: KAIJO CORPORATION (Tokyo)
Inventor: Akihisa Nakano (Tokyo)
Primary Examiner: Derrick E Holland
Application Number: 29/650,549
Classifications
Current U.S. Class:
Treatment (D23/207)