Flip cap package with chamfer

- Hollister Incorporated
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Description

FIG. 1 is a top, front perspective view of a flip cap package with chamfer according to the present design.

FIG. 2 is a bottom, right side perspective view thereof.

FIG. 3 is a front elevation view thereof.

FIG. 4 is a rear elevation view thereof.

FIG. 5 is a right side elevation view thereof.

FIG. 6 is a left side elevation view thereof.

FIG. 7 is a top plan view thereof.

FIG. 8 is a bottom plan view thereof.

FIG. 9 is a rear elevation view of a second embodiment of a flip cap package with chamfer showing the same portions of the package as the first embodiment except for the hinge in broken lines.

FIG. 10 is a right side elevation view of the embodiment of FIG. 9; and,

FIG. 11 is a left side elevation view of the embodiment of FIG. 9.

The broken lines shown represent portions of the claim that form no part of the claimed design.

Claims

The ornamental design for a flip cap package with chamfer, as shown and described.

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Patent History
Patent number: D896632
Type: Grant
Filed: Aug 10, 2018
Date of Patent: Sep 22, 2020
Assignee: Hollister Incorporated (Libertyville, IL)
Inventors: Martin McMenamin (Lifford), Daniel E. O'Brien (Calry), Vincent Naughton (Sligo), Martin P. Creaven (Ballina), Joseph N. Hanley (Sligo), Scott J. Pupino (Oak Park, IL)
Primary Examiner: Lauren R Calve
Application Number: 29/659,706
Classifications
Current U.S. Class: D9/420; D3/203.1