Wire lead-in device

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Description

FIG. 1 is a front elevational view of a wire lead-in device showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a left side elevational view thereof; and,

FIG. 7 is a perspective view thereof.

Claims

The ornamental design for a wire lead-in device, as shown and described.

Referenced Cited
U.S. Patent Documents
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Patent History
Patent number: D904857
Type: Grant
Filed: Jun 5, 2019
Date of Patent: Dec 15, 2020
Assignee: YANEGIJUTSUKENKYUJO CO., LTD. (Takahama)
Inventor: Shuichi Kobayashi (Takahama)
Primary Examiner: Mark A Goodwin
Assistant Examiner: Benjamin M Weeks
Application Number: 29/693,847
Classifications
Current U.S. Class: D8/349