Housing for electric and electronic components
Claims
The ornamental design for a housing for electric and electronic components, as shown and described.
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Type: Grant
Filed: Apr 3, 2019
Date of Patent: Feb 2, 2021
Assignee: ROLEC Gehäuse-Systeme GmbH (Rinteln/Weser)
Inventor: Bernd von der Lippe (Bückeburg)
Primary Examiner: Keli L Hill
Assistant Examiner: Harold E Blackwell, II
Application Number: 29/686,342