Three dimensional faceted identification chip

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Description

FIG. 1 is a front, top, and right side perspective view of a three dimensional faceted identification chip showing our new design;

FIG. 2 is a rear, bottom, and left side perspective thereof;

FIG. 3 is front elevation thereof;

FIG. 4 is a right side elevation thereof;

FIG. 5 is a rear elevation thereof;

FIG. 6 is a left side elevation thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a section view thereof, as identified in FIG. 3;

FIG. 10 is a section view thereof, as identified in FIG. 3; and,

FIG. 11 is a section view thereof, as identified in FIG. 3.

The features shown in broken lines depict environmental subject matter only and form no part of the claimed design.

Claims

The ornamental design for three dimensional faceted identification chip, as shown and described.

Referenced Cited
U.S. Patent Documents
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5329407 July 12, 1994 Sasaki
D380402 July 1, 1997 Binder, Sr.
D432939 October 31, 2000 Hooglander
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D774687 December 20, 2016 Dennis
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D865765 November 5, 2019 Min
Patent History
Patent number: D911331
Type: Grant
Filed: Mar 19, 2019
Date of Patent: Feb 23, 2021
Assignee: LEXMARK INTERNATIONAL, INC. (Lexington, KY)
Inventors: Hyeob Kim (Independence, KY), Thomas Eugene Pangburn (Winchester, KY), Scott Richard Castle (Lexington, KY), Robert Henry Muyskens (Lexington, KY), Brant Dennis Nystrom (Lexington, KY), Samuel Leo Rhodus (Lexington, KY)
Primary Examiner: Austin Murphy
Application Number: 29/684,253
Classifications