Mobile phone cooling device
Latest SHENZHEN DIYIWEI ELECTRONICS CO., LTD. Patents:
Description
The broken lines in the drawings depict portions of the mobile phone cooling device that form no part of the claimed design.
Claims
The ornamental design for a mobile phone cooling device, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
9975497 | May 22, 2018 | Kim |
D840995 | February 19, 2019 | Balmer |
D854006 | July 16, 2019 | Wang |
D854537 | July 23, 2019 | Ackeret |
10704564 | July 7, 2020 | Jones |
20160124210 | May 5, 2016 | Ross |
20190341884 | November 7, 2019 | Walker |
- Divi Phone Cooler, cellmost.com, Jan. 17, 2020 <https://www.cellmost.com/details/divi-phone-cooler-cooling-games-heat-sink-radiator-smartphone-clip-cooler-silver-sku109901770b.html> (Year: 2020).
- Divi Phone Cooler, tvc-mall.com, Dec. 19, 2019 <https://www.tvc-mall.com/details/phone-cooler-cooling-games-heat-sink-radiator-smartphone-clip-cooler-black-sku109901770a.html> (Year: 2019).
Patent History
Patent number: D913271
Type: Grant
Filed: Jun 4, 2019
Date of Patent: Mar 16, 2021
Assignee: SHENZHEN DIYIWEI ELECTRONICS CO., LTD. (Shenzhen)
Inventor: Kangda Peng (Shenzhen)
Primary Examiner: Janice Hallmark
Application Number: 29/693,584
Type: Grant
Filed: Jun 4, 2019
Date of Patent: Mar 16, 2021
Assignee: SHENZHEN DIYIWEI ELECTRONICS CO., LTD. (Shenzhen)
Inventor: Kangda Peng (Shenzhen)
Primary Examiner: Janice Hallmark
Application Number: 29/693,584
Classifications
Current U.S. Class:
For Handset (D14/253)