Mobile phone cooling device
Description
The broken lines in the drawings depict portions of the mobile phone cooling device that form no part of the claimed design.
Claims
The ornamental design for a mobile phone cooling device, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
9975497 | May 22, 2018 | Kim |
D840995 | February 19, 2019 | Balmer |
D854006 | July 16, 2019 | Wang |
D854537 | July 23, 2019 | Ackeret |
10704564 | July 7, 2020 | Jones |
20160124210 | May 5, 2016 | Ross |
20190341884 | November 7, 2019 | Walker |
- Divi Phone Cooler, cellmost.com, Jan. 17, 2020 <https://www.cellmost.com/details/divi-phone-cooler-cooling-games-heat-sink-radiator-smartphone-clip-cooler-silver-sku109901770b.html> (Year: 2020).
- Divi Phone Cooler, tvc-mall.com, Dec. 19, 2019 <https://www.tvc-mall.com/details/phone-cooler-cooling-games-heat-sink-radiator-smartphone-clip-cooler-black-sku109901770a.html> (Year: 2019).
Patent History
Patent number: D913271
Type: Grant
Filed: Jun 4, 2019
Date of Patent: Mar 16, 2021
Assignee: SHENZHEN DIYIWEI ELECTRONICS CO., LTD. (Shenzhen)
Inventor: Kangda Peng (Shenzhen)
Primary Examiner: Janice Hallmark
Application Number: 29/693,584
Type: Grant
Filed: Jun 4, 2019
Date of Patent: Mar 16, 2021
Assignee: SHENZHEN DIYIWEI ELECTRONICS CO., LTD. (Shenzhen)
Inventor: Kangda Peng (Shenzhen)
Primary Examiner: Janice Hallmark
Application Number: 29/693,584
Classifications
Current U.S. Class:
For Handset (D14/253)