Mobile phone cooling device

Latest SHENZHEN DIYIWEI ELECTRONICS CO., LTD. Patents:

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of the mobile phone cooling device showing my new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The broken lines in the drawings depict portions of the mobile phone cooling device that form no part of the claimed design.

Claims

The ornamental design for a mobile phone cooling device, as shown and described.

Referenced Cited
U.S. Patent Documents
9975497 May 22, 2018 Kim
D840995 February 19, 2019 Balmer
D854006 July 16, 2019 Wang
D854537 July 23, 2019 Ackeret
10704564 July 7, 2020 Jones
20160124210 May 5, 2016 Ross
20190341884 November 7, 2019 Walker
Other references
  • Divi Phone Cooler, cellmost.com, Jan. 17, 2020 <https://www.cellmost.com/details/divi-phone-cooler-cooling-games-heat-sink-radiator-smartphone-clip-cooler-silver-sku109901770b.html> (Year: 2020).
  • Divi Phone Cooler, tvc-mall.com, Dec. 19, 2019 <https://www.tvc-mall.com/details/phone-cooler-cooling-games-heat-sink-radiator-smartphone-clip-cooler-black-sku109901770a.html> (Year: 2019).
Patent History
Patent number: D913271
Type: Grant
Filed: Jun 4, 2019
Date of Patent: Mar 16, 2021
Assignee: SHENZHEN DIYIWEI ELECTRONICS CO., LTD. (Shenzhen)
Inventor: Kangda Peng (Shenzhen)
Primary Examiner: Janice Hallmark
Application Number: 29/693,584
Classifications
Current U.S. Class: For Handset (D14/253)