Package

Info

Patent number: D929860
Type: Grant
Filed: Mar 19, 2021
Date of Patent: Sep 7, 2021
Assignee: BMIC LLC (Dallas, TX)
Inventors: Carlos Caicedo (Dallas, TX), Natalie Cruz (Dallas, TX), Carol Monza (Dallas, TX), Michael Comiskey (Dallas, TX), David Shin (Dallas, TX), Don Miller (Dallas, TX), Carolyn Eckert (Dallas, TX)
Primary Examiner: Vy N Koenig
Application Number: 29/774,910

Description

Description

FIG. 1 is a front perspective view of a first embodiment of a package.

FIG. 2 is a front view of the first embodiment of the package shown in FIG. 1.

FIG. 3 is a back view of the first embodiment of the package shown in FIG. 1.

FIG. 4 is a right side view of the first embodiment of the package shown in FIG. 1.

FIG. 5 is a left side view of the first embodiment of the package shown in FIG. 1.

FIG. 6 is a top view of the first embodiment of the package shown in FIG. 1.

FIG. 7 is a bottom view of the first embodiment of the package shown in FIG. 1.

FIG. 8 is a front perspective view of a second embodiment of a package.

FIG. 9 is a front view of the second embodiment of the package shown in FIG. 8.

FIG. 10 is a back view of the second embodiment of the package shown in FIG. 8.

FIG. 11 is a right side view of the second embodiment of the package shown in FIG. 8.

FIG. 12 is a left side view of the second embodiment of the package shown in FIG. 8.

FIG. 13 is a top view of the second embodiment of the package shown in FIG. 8; and,

FIG. 14 is a bottom view of the second embodiment of the package shown in FIG. 8.

The broken lines in the drawings illustrate unclaimed features forming no part of the claimed design.

Claims

The ornamental design for a package, as shown and described.