Blister package
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Description
Claims
The ornamental design for a blister package, as shown and described.
Referenced Cited
U.S. Patent Documents
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Patent History
Patent number: D975531
Type: Grant
Filed: Jul 22, 2019
Date of Patent: Jan 17, 2023
Assignee: Henkel AG & Co. KGaA (Duesseldorf)
Inventor: Bodo Warden (Moenchengladbach)
Primary Examiner: Rhea Shields
Application Number: 29/698,925
Type: Grant
Filed: Jul 22, 2019
Date of Patent: Jan 17, 2023
Assignee: Henkel AG & Co. KGaA (Duesseldorf)
Inventor: Bodo Warden (Moenchengladbach)
Primary Examiner: Rhea Shields
Application Number: 29/698,925
Classifications
Current U.S. Class:
D9/415