Three-dimensional printer housing
Latest SHENZHEN SNAPMAKER TECHNOLOGIES CO., LTD. Patents:
Description
In
Claims
The ornamental design for a three-dimensional printer housing, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
D729309 | May 12, 2015 | Jun |
D732586 | June 23, 2015 | Chen |
D738410 | September 8, 2015 | Liu |
D745069 | December 8, 2015 | Kemperle |
D854591 | July 23, 2019 | Gupta |
D879850 | March 31, 2020 | Wolf |
20180178463 | June 28, 2018 | Manian |
- Snapmaker Enclosure, available in Amazon.com, date first available Dec. 7, 2020 [online], [site visited on Oct. 4, 2022], Available from the internet URL:https://www.amazon.com/Enclosure-Snapmaker-Printer-Quieter-Compatible/dp/B08PTX55WP/ref=asc_df_B08PTX55WP/?tag=hyprod-20&linkCode=df0&hvadid=475794950 (Year: 2020).
Patent History
Patent number: D976971
Type: Grant
Filed: Jan 27, 2021
Date of Patent: Jan 31, 2023
Assignee: SHENZHEN SNAPMAKER TECHNOLOGIES CO., LTD. (Shenzhen)
Inventors: Xuedong Chen (Shenzhen), Chengfang Xiao (Shenzhen)
Primary Examiner: Calvin E Vansant
Assistant Examiner: Eidiol Ghigliotty Torres
Application Number: 29/768,076
Type: Grant
Filed: Jan 27, 2021
Date of Patent: Jan 31, 2023
Assignee: SHENZHEN SNAPMAKER TECHNOLOGIES CO., LTD. (Shenzhen)
Inventors: Xuedong Chen (Shenzhen), Chengfang Xiao (Shenzhen)
Primary Examiner: Calvin E Vansant
Assistant Examiner: Eidiol Ghigliotty Torres
Application Number: 29/768,076
Classifications
Current U.S. Class:
Material Working, Abrading, Or Founding Machinery (D15/122)