Mask assembly
Latest NEXA3D INC. Patents:
- Modular, damped X, Y-Z three-dimensional printer construction
- Three-dimensional printer head including a dielectric barrier discharge (DBD) disk and a transformer assembly
- Methods and systems for photocuring liquid with reduced heat generation using a digital light processing (DLP) light source
- Light engines for vat polymerization 3D printers
- Methods for photocuring liquid resin with reduced heat generation
Description
The broken lines show portions of a mask assembly which form no part of the claimed design.
Claims
The ornamental design for a mask assembly, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
D109851 | May 1938 | Meredith |
D324391 | March 3, 1992 | Gaab |
D426559 | June 13, 2000 | Christensen |
D717845 | November 18, 2014 | Wachsmann |
D717846 | November 18, 2014 | Wachsmann |
D759980 | June 28, 2016 | Toth |
D858591 | September 3, 2019 | Koch |
D900175 | October 27, 2020 | MacNeil |
D900177 | October 27, 2020 | Pappas |
D913345 | March 16, 2021 | Wachsmann |
D913346 | March 16, 2021 | Wachsmann |
D956136 | June 28, 2022 | Lee |
209821547 | December 2019 | CN |
Patent History
Patent number: D989135
Type: Grant
Filed: Nov 10, 2021
Date of Patent: Jun 13, 2023
Assignee: NEXA3D INC. (Ventura, CA)
Inventors: Matthew Buckby (Ventura, CA), Avi N. Reichental (Carpinteria, CA), Miguel Cuevas Sandoval (Camarillo, CA), Francis Kenyon Whetsell (Ventura, CA)
Primary Examiner: Michael C Stout
Assistant Examiner: Fritzgerald L Butac
Application Number: 29/790,178
Type: Grant
Filed: Nov 10, 2021
Date of Patent: Jun 13, 2023
Assignee: NEXA3D INC. (Ventura, CA)
Inventors: Matthew Buckby (Ventura, CA), Avi N. Reichental (Carpinteria, CA), Miguel Cuevas Sandoval (Camarillo, CA), Francis Kenyon Whetsell (Ventura, CA)
Primary Examiner: Michael C Stout
Assistant Examiner: Fritzgerald L Butac
Application Number: 29/790,178
Classifications
Current U.S. Class:
Molding Or Casting (D15/135)