Wall panel
Latest KMEW CO., LTD. Patents:
Description
The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
1. Wall panel
The present article is a wall panel with a surface on which a pattern is printed.
Claims
The ornamental design for a wall panel, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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3486919 | December 1969 | Kreeger, Jr. |
D261191 | October 6, 1981 | Ford |
D624668 | September 28, 2010 | Noppe |
D660463 | May 22, 2012 | Kalwa |
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832472-003 | July 1992 | JP |
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1654418 | March 2020 | JP |
1682773 | April 2021 | JP |
- Notification of Total Refusal dated Jul. 15, 2022 issued for the corresponding Russian design application (International Registration No. DM/216641 designating Russia).
- Web materials on the website “Pxhere”, posted on Apr. 3, 2017, pp. 1-2, https://pxhere.com/ru/photo/978433, with partial English translation.
- Japanese Notice of Reasons for Refusal for Japanese Design Application No. 2021-003172, dated Oct. 26, 2021, with a partial English translation.
- Japanese Publication Material No. HA3100432900, “Decorative Sheet,” CONFORT, vol. 169, dated Jul. 8, 2019, p. 70 (7 pages total), with a partial English translation.
- Japanese Publication Material No. HC2502320400, “Decorative board for building,” Catalog of tiles and building materials, dated Dec. 6, 2013, p. 177 (8 pages total), with a partial English translation.
- Japanese Publication Material No. HC3101745700, “Board for building,” Materials, vol. 26, dated Nov. 29, 2019, p. 29 (15 pages total), with a partial English translation.
- Notification of Reference Information issued along with Decision of Grant a Design Registration dated Apr. 5, 2022 for the Priority Japanese Design Application No. 2021-003172, with a partial English translation.
Patent History
Patent number: D990716
Type: Grant
Filed: Aug 10, 2021
Date of Patent: Jun 27, 2023
Assignee: KMEW CO., LTD. (Osaka)
Inventor: Chikako Ota (Osaka)
Primary Examiner: Doris Clark
Application Number: 35/513,557
Type: Grant
Filed: Aug 10, 2021
Date of Patent: Jun 27, 2023
Assignee: KMEW CO., LTD. (Osaka)
Inventor: Chikako Ota (Osaka)
Primary Examiner: Doris Clark
Application Number: 35/513,557
Classifications
Current U.S. Class:
Wood Grain (D25/150)