Wall panel

- KMEW CO., LTD.

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Description

1. Wall panel

1.1 : Front

1.2 : Partially enlarged front view 1

1.3 : Partially enlarged front view 2

1.4 : Partially enlarged perspective view

1.5 : Top

1.6 : Bottom

1.7 : Left

1.8 : Right

1.9 : Back

The present article is a wall panel with a surface on which a pattern is printed.

Claims

The ornamental design for a wall panel, as shown and described.

Referenced Cited
U.S. Patent Documents
D679424 April 2, 2013 Rhee
D823489 July 17, 2018 Grzeskowiak, II
20140272250 September 18, 2014 Dirkson
20160236507 August 18, 2016 Domanico
Foreign Patent Documents
5-228429 September 1993 JP
6-235257 August 1994 JP
1654416 March 2020 JP
30-0359323 August 2004 KR
Other references
  • “Decorative board for construction,” Document name: Catalog of tiles and building materials 2013, LIXIL Corporation, Dec. 6, 2013, HC2502320500, with a partial English translation.
  • “Flooring for building,” Document name:Hapia Floor grain pattern, Daiken Corporation, Mar. 2, 2018, HC3000136500, with a partial English translation.
  • “Flooring for building,” HTML document title of product page: Daiken Online Catalog, Daiken Corporation, Mar. 17, 2007, HJ1802337700, with a partial English translation.
  • “Flooring for building,” HTML document title of product page: Daiken Online Catalog, Daiken Corporation, Mar. 17, 2007, HJ1802337800, with a partial English translation.
  • “Wall Panel,” Document Name: Real Technology For Pre-fabricated Construction, Aug. 1, 2000, HD1202337900, with a partial English translation.
  • Fersman A.E., quoted from the book “Stories about the gem-stones,” Nauka, 1974, URL: http://www.bibliotekar.ru/2-8-18-fersman-samocvety/30.htm, with a partial English translation.
  • Japanese Notice of Reasons for Refusal for Japanese Application No. 2021-003171, dated Oct. 26, 2021, with a partial English translation.
  • Japanese Notification of Reference Information issued along with Decision of Grant a Design Registration for Japanese Application No. 2021-003171, dated Apr. 5, 2022, with a partial English translation.
  • Russian Notification of Total Refusal for Russian Application No. DM/216640, dated Jun. 17, 2022.
Patent History
Patent number: D992155
Type: Grant
Filed: Aug 10, 2021
Date of Patent: Jul 11, 2023
Assignee: KMEW CO., LTD. (Osaka)
Inventor: Arisa Miyake (Osaka)
Primary Examiner: Doris Clark
Application Number: 35/513,568
Classifications
Current U.S. Class: Brick Or Stone (23) (D25/151)