Polycrystalline diamond compact with a double-layer structure

- SF DIAMOND CO., LTD.
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Description

FIG. 1 is a top perspective view of a polycrystalline diamond compact with a double layer structure showing our new design;

FIG. 2 is a bottom perspective view of a polycrystalline diamond compact with a double layer structure of FIG. 1;

FIG. 3 is a top plan view of the polycrystalline diamond compact with a double layer structure of FIG. 1;

FIG. 4 is a bottom plan view of the polycrystalline diamond compact with a double layer structure of FIG. 1;

FIG. 5 is a side elevation view of the polycrystalline diamond compact with a double layer structure of FIG. 1; and,

FIG. 6 is another side elevation view of the polycrystalline diamond compact with a double layer structure of FIG. 1.

The broken lines show portions of a polycrystalline diamond compact with a double layer structure which forms no part of the claimed design.

Claims

The ornamental design for a polycrystalline diamond compact with a double layer structure, as shown and described.

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Patent History
Patent number: D997219
Type: Grant
Filed: Oct 14, 2021
Date of Patent: Aug 29, 2023
Assignee: SF DIAMOND CO., LTD. (Zhengzhou)
Inventors: Haijiang Fang (Zhengzhou), Weifeng Du (Zhengzhou), Yongfeng Wang (Zhengzhou), Jian Yang (Zhengzhou)
Primary Examiner: Michael C Stout
Assistant Examiner: Fritzgerald L Butac
Application Number: 29/811,485
Classifications