Bubble mailer
Description
The broken lines in the figures are for the purposes of illustrating portions of the bubble mailer, which form no part of the claimed design.
Claims
The ornamental design for a bubble mailer, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
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Patent History
Patent number: D997242
Type: Grant
Filed: Mar 30, 2023
Date of Patent: Aug 29, 2023
Inventor: Jianping Li (Dongguan)
Primary Examiner: Nicole C Shiflet
Assistant Examiner: Danielle Nichole Bowly
Application Number: 29/888,323
Type: Grant
Filed: Mar 30, 2023
Date of Patent: Aug 29, 2023
Inventor: Jianping Li (Dongguan)
Primary Examiner: Nicole C Shiflet
Assistant Examiner: Danielle Nichole Bowly
Application Number: 29/888,323
Classifications
Current U.S. Class:
Envelope (D19/3)