Bone conduction headphone

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Description

FIG. 1 is a front, top and right side perspective view of a first embodiment of a bone conduction headphone showing my new design;

FIG. 2 is a rear, bottom and left side perspective view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a rear elevation view thereof;

FIG. 5 is a left side elevation view thereof;

FIG. 6 is a right side elevation view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a front, top and right side perspective view of a second embodiment of a bone conduction headphone showing my new design;

FIG. 10 is a rear, bottom and left side perspective view thereof;

FIG. 11 is a front elevation view thereof;

FIG. 12 is a rear elevation view thereof;

FIG. 13 is a left side elevation view thereof;

FIG. 14 is a right side elevation view thereof;

FIG. 15 is a top plan view thereof;

FIG. 16 is a bottom plan view thereof;

FIG. 17 is a front, top and right side perspective view of a third embodiment of a bone conduction headphone showing my new design;

FIG. 18 is a rear, bottom and left side perspective view thereof;

FIG. 19 is a front elevation view thereof;

FIG. 20 is a rear elevation view thereof;

FIG. 21 is a left side elevation view thereof;

FIG. 22 is a right side elevation view thereof;

FIG. 23 is a top plan view thereof;

FIG. 24 is a bottom plan view thereof;

FIG. 25 is a front, top and right side perspective view of a fourth embodiment of a bone conduction headphone showing my new design;

FIG. 26 is a rear, bottom and left side perspective view thereof;

FIG. 27 is a front elevation view thereof;

FIG. 28 is a rear elevation view thereof;

FIG. 29 is a left side elevation view thereof;

FIG. 30 is a right side elevation view thereof;

FIG. 31 is a top plan view thereof; and,

FIG. 32 is a bottom plan view thereof.

The broken lines in the drawings are employed to show unclaimed portions of the bone conduction headphone, and form no part of the claimed design.

Claims

The ornamental design for a bone conduction headphone, as shown and described.

Referenced Cited
U.S. Patent Documents
D572706 July 8, 2008 Schaefer
D758355 June 7, 2016 Lee
D759633 June 21, 2016 Gondo
D800703 October 24, 2017 Vaclavik
D810720 February 20, 2018 Lee
D814443 April 3, 2018 Sandanger
D820239 June 12, 2018 Yoshimura
D839238 January 29, 2019 Hu
D845282 April 9, 2019 Chen
D870711 December 24, 2019 Karayiannis
D872065 January 7, 2020 Cai
D899399 October 20, 2020 Jung
20180295437 October 11, 2018 Chen
Patent History
Patent number: D998597
Type: Grant
Filed: Jul 6, 2021
Date of Patent: Sep 12, 2023
Assignee: Dongguan Pure Audio Technology Co., Ltd. (Dongguan)
Inventor: Chun-Chun Ho (New Taipei)
Primary Examiner: Katie Jane Stofko
Application Number: 29/798,197
Classifications
Current U.S. Class: Headphone (D14/223)