Abstract: The present invention relates to an integrated-circuit device and to a method for fabricating an integrated-circuit device with an integrated fluidic-cooling channel. The method comprises forming recesses in a dielectric layer sequence at desired lateral positions of electrical interconnect segments and at desired lateral positions of fluidic-cooling channel segments. A metal filling is deposited in the recesses of the dielectric layer sequence so as to form the electrical interconnect segments and to form a sacrificial filling in the fluidic-cooling channel segments. Afterwards, the sacrificial metal filling is selectively removed from the fluidic-cooling channel segments.

Abstract: A radiation device for computer or electric appliances includes a heat inhalant block under a CPU of a computer, a heat transmission block positioned next to the heat inhalant block, a bridge block, a cold crystal and a cooling source block sequentially disposed on the top of the heat transmission block with a bridge block engaged therebetween, a transparent cover covering the top of the cooling source block to form a left and a right flow canals therein, a upper heat radiation module superimposed a lower heat radiation module positioned next to the heat transmission block, a fan on the top of the upper heat radiation module, a set of the heat pipes extended from the heat inhalant block to the lower heat radiation module through the heat transmission block, a pair of lateral pipe connected between the bridge block and the lower heat radiation module and a set of the cold pipes connected between the cooling source block and the upper heat radiation module.

Abstract: A telecommunications cabinet in which active equipment can be mounted. The cabinet including an airflow ducting arrangement located in the interior region of the cabinet. The airflow ducting arrangement accommodating thermal cooling of active equipment having internal side-to-side air cooling arrangements.

Abstract: A server with a flexible cooling scheme is disclosed. The server comprises a case having an inside and an outside. A first fan is positioned inside the case and configured to draw gas from a first area inside the case and force the gas past a first area to be cooled. A first opening in the case is configured to allow gas from outside the case to enter the first area. When the server is in a first cooling configuration the first fan is configured to force the gas past the first area to be cooled and out to the outside of the case through a second opening in the case. When the server is in a second cooling configuration, the server further comprises a heat exchanger located in the first area and configured to seal the first opening in the case thereby preventing outside gas from entering the first area.

Abstract: A redundant power supply system includes a system cabinet, a first power supply apparatus, a second power supply apparatus and a power converting circuit board. The system cabinet at least includes a first receptacle and a second receptacle. The first power supply apparatus has a first connection interface. The second power supply apparatus has a second connection interface. The power converting circuit board is disposed inside the system cabinet and includes a first insertion slot, a second insertion slot and a power converting circuit. A voltage outputted from the first power supply apparatus and/or the second power supply apparatus is converted by the power converting circuit into a regulated voltage when the first connection interface of the first power supply apparatus and the second connection interface of the second power supply apparatus are inserted into the first insertion slot and the second insertion slot, respectively.

Abstract: A power supply apparatus for use with a redundant power supply system includes a casing, a main circuit board and an airflow driving device. The casing includes a first airflow opening and a second airflow opening. The main circuit board is disposed within the casing and includes plural electronic components thereon. The airflow driving device is disposed in the middle region of the main circuit board. A cooling air is pumped by the airflow driving device to be introduced into the inner portion of the casing through one of the first airflow opening and the second airflow opening, then the heat generated from the electronic components is removed by the cooling air, and finally a heated air is exhausted through the other one of the first airflow opening and the second airflow opening.

Abstract: A cooling structure for a power supply is disclosed. The power supply has a housing. The cooling structure includes a cooling fan and a cooler. The cooling fan is located on the inner side of the top surface of the housing. The cooler is located below the cooling fan. The cooler includes a vertical board and a plurality of cooling fins. The cooling fins are disposed slantwise on the vertical board and at intervals. There is a plurality of air-guiding channels between the cooling fins. Thereby, the airflow of the cooling fan can be guided forward to a specified direction. The hot air circulating flow will not occur. The cooling fan blows onto the electronic elements on the circuit board to exhaust the heat generated by the electronic elements, and noise generated from the cooling fans is lowered.

Abstract: A processor of an apparatus in one example is configured to control at least one characteristic of a cooling fluid supplied to an electronic component based on a temperature rise of the cooling fluid between an inlet and an outlet of the electronic component.

Abstract: A heat dissipation device includes a heat sink and a fan. The heat sink includes two first fins, and a plurality of second fins between the first fins. A locking portion extends outward from each first fin. The locking portions are located higher than the second fins. A sliding guideway is defined in each locking portion. Two flanges extend from two opposite sides of the fan respectively. The flanges are capable of engaging in the guideways of the heat sink to mount the fan to the heat sink.

Abstract: According to one embodiment, an electronic device includes a cooling fan which is arranged in a case, a space being present between heat radiation fins and the cooling fan, and a case-contained member contained in the case. The case includes a second member which is detachably coupled to a first member and faces the space. The case-contained member faces the space on the side opposite to the second member. When the second member is coupled to the first member, the second member and the case-contained member cooperate to form a duct which guides air exhausted from the cooling fan to the heat radiation fins.

Abstract: It's a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(?umd)/??2,500; with ? being the fluid density, um being the free-stream fluid velocity, d being the pipe distance or diameter, ? being the fluid viscosity. Since the airflow produces air turbulence, it causes the frequent heat exchanges in the air. It also causes the obvious temperature changes within the different layers of air. Therefore, it increases tremendously, the efficiency of dissipating the heat. It requires only the input of the air. The operation is simple and it allows the usage of even higher heat generating devices. Thus it promotes the alternative usage of this top mount heatsink device within the installation of circuit board components.

Abstract: A liquid cooled electronic system and method includes a first component rotably connected to a second component via a coolant pathway. The coolant pathway includes at least one hinge assembly disposed and configured to convey coolant from the first component through the hinge assembly to the second component. The hinge assembly includes a first hinge portion in operable communication with the first component, a second hinge portion in operable communication with the second component; and a hinge pin disposed and configured to convey fluid therethrough and connecting the first hinge portion to the second hinge portion.

Abstract: A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The actuation load is configured to mechanically actuate the cold plate to a module.

Abstract: A heat sink comprises a vapor chamber base formed in a three-dimensional arrangement that mirrors topology of underlying structures on a substrate upon which the heat sink can be mounted, and at least one fin coupled to the vapor chamber base.

Abstract: A power electronic module is cooled by a phase change heat spreader or cooling device. The module may include switched or unswitched devices, such as power transistors, diodes, and so forth, forming circuits such as rectifiers, inverters, converters, or the like, or portions of such circuits. Heat is transferred to the heat spreader in which a continuous phase change cycle takes place to cool the circuit components. The heat spreader may extend over an area sufficient to reduce the temperature of the components, and ultimately will render portions of the overall structure more isothermal.

Abstract: A technique is disclosed for cooling connections points in power electronic circuits, such as points at which wire bonding connections are made. A phase change heat spreader is thermally coupled at or near the connection point and a continuous phase change takes place in the heat spreader to extract heat from the connection point during operation. The heat spreader may extend over a area larger than the connection point to enhance cooling and to dissipate heat over a larger area. Small, specifically directed applications are possible in which specific points are cooled together or individually.

Abstract: A technique for cooling electrical bus structures is disclosed, in which a phase change heat spreader is thermally coupled to the bus. A continuous phase change cycle occurs within the heat spreader to draw heat from the bus during operation. The heat spreader may be planar, and extend over an area greater then the surface area of the bus to enhance cooling and to render the overall assembly more isothermal. The heat spreader may be placed near bus joints and circuits to remove heat caused by increased resistance at such locations.

Abstract: The invention relates to thermally conductive greases that may contain carrier oil(s), dispersant(s), and thermally conductive particles, wherein the thermally conductive particles are a mixture of at least three distributions of thermally conductive particles, each of the at least three distributions of thermally conductive particles having an average (D50) particle size which differs from the other average particle sizes by at least a factor of 5

Abstract: The invention relates to an assembly of a carrier for electrical components that are arranged for producing more heat than can be dissipated via natural cooling at least under certain operating conditions and a cooling body mechanically and thermally connected thereto, whereby the carrier is provided with a metal part that is connected to the cooling body by means of a metallic connection. Mounting a metal part on the carrier makes it possible to form a metallic connection between the metal part and the metal cooling body. The invention also relates to a method for assembling an assembly of a carrier for heat-producing electrical components and a cooling body mechanically and thermally connected thereto, whereby the components are initially mounted on the carrier and a metal part of the carrier is then connected to the cooling body by means of a metallic connection.

Abstract: The electronic assembly includes a substrate that has a first side and a second side. The electronic assembly further includes first and second electronic components that are mounted on the first side of the substrate. The first electronic component extends a different height above the first side of the substrate as the second electronic component. The electronic assembly further includes a heat sink that includes a base and fins which extend from the base. The base of the heat sink includes a formation which engages the second electronic component in order to maintain the base of the heat sink in substantially parallel relation to the substrate. In some embodiments, the formation in the base of the heat sink is a detent, while in other embodiments the formation in the base of the heat sink is a projection.

Abstract: An example electronic assembly includes a substrate that has a first surface and a second surface. The first surface of the substrate includes a grounding ring. The electronic assembly further includes one or more electronic components that are mounted on the first surface of the substrate such that the grounding ring at least partially surrounds the electronic components(s). A heat sink engages the electronic component(s) and the grounding ring in order provide cooling and EMI shielding to the electronic components(s). In some embodiments, the grounding ring surrounds the entire electronic components(s) and the heat sink engages the entire grounding ring, although in other embodiments, the grounding ring may partially surround the electronic components(s) and/or the heat sink may engage just a portion of the grounding ring.

Abstract: A method and apparatus for cooling an electronic application having at least one heat-generating electronic component mounted on a circuit board. A heat transferring heat sink is attached to the circuit board in thermal contact with one heat generating electronic component by first being statically fixed to the circuit board in a stationary position at a specified height above the circuit board, and then by resiliently biasing the component against the heat sink.

Abstract: A thermal conducting mixture is provided which is used to make thermal conducting formulations such as a paste having a high thermal conductivity and a relatively low viscosity. The paste is used to provide a thermal conductor connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The formulation contains the mixture of thermally conductive particles in various particle size ranges typically dispersed in a non-aqueous dielectric carrier containing an antioxidant and a dispersant with the thermally conductive particles mixture being specially correlated in the mixture by volume % based on particle size range and by particle size ratio of each particle size range. The mixture may be used to make other similar products such as thermal gels, adhesives, slurries and composites, for electronic and cosmetics, pharmaceuticals, automotive, and like products.

Abstract: A power switching device is provided that includes a housing, a printed circuit board disposed within the housing, and a plurality of electrical components mounted to the printed circuit board, including at least one relay. At least one pair of load terminals is connected to the printed circuit board on opposite sides of the relay, and a plurality of heat transfer elements are formed through and in the printed circuit board and are dispersed proximate the relay, around the load terminals, and extending to the peripheral portion.

Abstract: One of the purpose is to obtain a motor drive circuit and an outdoor unit for an air conditioner using the same, which can flexibly support change of a model at a low price and in a small lot without using unnecessary materials, wherein a stress in a soldering part due to self-heating is low, a solder reliability is high, and design constraints are small, while maintaining a low-noise and low-loss power wiring due to lowering inductance.

Abstract: A pressure-contact power semiconductor module is arranged on a heat sink. The power semiconductor module is used with at least one substrate provided with conductor tracks and power semiconductor components. The module has a mounting body, on the underside of which the at least one substrate is arranged, and which is formed with cutouts. The module also includes a load connection element which is provided with contact feet that project away from strip sections and make pressure contact with the conductor tracks. The power semiconductor module additionally has a dimensionally stable cover, which covers the mounting body on all sides and is connected to the mounting body by means of snap-action latching connections. At least one pad element is restrained between the cover and the strip sections of the load connection elements.

Abstract: A blade server assembly is disclosed that includes a blade server chassis, a blade server, and a support assembly connected with the blade server chassis and with the blade server so as to support the blade server substantially outside the blade server chassis. A method is also disclosed for maintaining a blade server installed in a blade server chassis that includes supporting the blade server substantially outside the blade server chassis through a support assembly connected with the blade server chassis and with the blade server.

Abstract: The invention relates to a modular rear wall for a switching system module, in particular an insertion module. Said modular rear wall comprises a measuring device which is integrated therein and which forms an integral component of the switching system module. The invention also relates to a switching circuit module which comprises said type of modular rear wall, in addition to a switching system comprising at least one switching system module having a modular rear wall.

Abstract: Embodiments of the present technique are directed to a blade system. The blade system may include a first blade module comprising a first conjoining channel, and a second blade module comprising a second conjoining channel aligned with the first conjoining channel, wherein the first blade module and the second blade module are symmetrical and mechanically coupled to form a conjoined blade, wherein electrical components of the first blade module and electrical components of the second blade module are electrically coupled via an electrical coupler routed through the aligned first conjoining channel and second conjoining channel.

Abstract: A Solid State Drive (SSD) device includes a printed circuit board assembly (PCBA) defining rivet holes, and a support structure including parallel side frame rails defining rivet openings and support platforms for receiving and supporting the PCBA. Compression-mated rivet sets are used to connect the PCBA to the support structure, each rivet set including a female rivet portion and an associated male rivet portion. The PCBA is mounted onto the support structure such that the rivet holes are aligned with the rivet openings of the plurality of rivet openings, and then the rivet sets are mounted and secured using an automatic rivet tool such that each rivet set extends through an associated rivet hole/opening and fixedly engaged such that the PCBA and the support structure are held between end caps of the respective male and female rivet portions.

Abstract: An electronic device swappable to be embedded into a system cabinet includes a casing and a locking element. The casing includes a first sidewall and a second sidewall, which have a first opening and a second opening, respectively. The locking element includes a first end part, a protrusion part, a bent part and a second end part. The first end part is fixed on an inner surface of the second sidewall of the casing. The protrusion part is partially exposed from the second opening to be engaged with a receiving structure of the system cabinet. The bent part is arranged between the first end part and the protrusion part. The second end part is exposed from the first opening so as to be protruded from the first sidewall of the casing.

Abstract: Briefly, in accordance with one or more embodiments, a scanning module for a scanner system comprises a frame having a first section and a second section. The first section of the frame is capable of receiving a laser to secure the laser in the first section, and the second section of the frame is capable of receiving a MEMS device having a mirror, to secure the MEMS device in the first section. The laser is aligned with the mirror by the frame to cause light emitted from the laser to impinge upon the mirror during operation of the laser. Such an arrangement may facilitate the physical and/or electrical assembly of the components of the scanner system.

Abstract: An exemplary mounting support for a flexible printed circuit board is provided. The flexible printed circuit board has a side surface and at least one electronic component mounted on the side surface. The mounting support includes a first surface for contacting with the side surface of the flexible printed circuit board and a second surface on an opposite side of the mounting support to the first surface. The mounting support has at least one first recess defined in the first surface for receiving the at least one electronic component therein and at least one through-hole defined through the first surface and the second surface. The mounting support has at least one second recess defined in the second surface. The mounting support can fix a double surface mounted flexible printed circuit board flatly, thereby enhancing laser processing precision.

Abstract: A system for supporting and electrically grounding metallic covers for electronic control modules includes a housing having wall portions defining a cavity with an opening, a circuit board located within the cavity, the circuit board having a ground plane formed within the circuit board, the circuit board having a top surface substantially facing the opening and supports for proving structural support for the cover, the supports being located on the top surface of the circuit board. The system shields emissions radiating from the module.

Abstract: A housing for an electronic circuit is provided with a single-part seal for sealing a clearance space between a floor plate and a cover, through which exposed electrical conductors are led, which connect the circuit on the inside of the housing to the surroundings. The floor plate, the cover and the conductors are made of the same kind of material, e.g., a metal. The floor plate and the cover are made of aluminum and the conductors of copper.

Abstract: An electronic elements carrier includes a body, at least an electronic element and a filler. The body includes a substrate having a plate and a dam formed on the peripheral of plate, a conductive layer mounted on a surface of the dam, and at least a cavity defined by the plate and the dam of the substrate. The electronic element is disposed in the cavity of the body. The filler is received in the cavity of the substrate for encapsulating, sealing and protecting the electronic element.

Abstract: A circuit board assembly (100) includes a circuit board (10) and at least one electrical element (20). The circuit board includes a dielectric substrate (12) including a supporting surface (13), and at least one connecting part (14) formed on the supporting surface. The at least one electrical element is electrically connected to the at least one connecting part via a connecting media (28). At least one air-exhaust hole (16) extends through the connecting part and the dielectric substrate. The at least one air-exhaust hole is configured for exhausting air from the connecting media.

Abstract: A pad for soldering a lead of an electronic element includes a solder portion and one or more non-contiguous extending portions. The solder portion is configured for positioning the lead of the electronic element thereon and has a size and shape substantially equal to the size and shape of the footprint of the lead. The one or more non-contiguous extending portions extending from the solder portion and configured for providing additional solder paste in the soldering process. The pad can limit the position of the leads of the electronic element in the solder portion, thus ensuring accurate positioning of the electronic element.

Abstract: An electronic component package includes: an insulating carrier substrate; a connection wiring that is provided on one side of the carrier substrate; an IC chip that is connected to the connection wiring; an external connection land that is disposed on the other side of the carrier substrate and is connected to the connection wiring via a wiring in the carrier substrate; and a solder ball that is disposed on the external connection land. A region of the external connection land that can be bonded to the solder ball has an outer shape that includes at least one arc portion and at least one straight portion. With this configuration, it is possible to provide an electronic component mounted apparatus in which bonding failure of the external connection land and the circuit board-side land with the solder ball can be reduced, and the bonding state can be easily inspected, and a method of inspecting a bonding portion therein.

Abstract: An exemplary assemblable substrate for an SIP includes a substrate and a group of welding pads. The substrate defines a receiving portion therein for receiving a line of pins of the SIP. The group of welding pads is formed on the substrate for electrically coupling the line of pins to the substrate; the group of welding pads being distributed around the receiving portion, two welding pads corresponding to two adjacent pins in the same line being distributed on opposing sides of the receiving portion.

Abstract: A chip component mounting structure is provided that has a chip component surface mounted on a pair of electrodes formed on a substrate. The electrodes have differing areas, and the chip component and t.

Abstract: A lead frame has multiple regions having different wetting characteristics on its surface. For example, one region is formed to handle silver plating while another has less wetting ability. A boundary between the regions causes a wetting force difference that inhibits molten solder flow between regions during solder die bonding.

Abstract: A shielding structure is provided for shielding a signal path extending between a first layer and a second layer in an electronic device at a transition region with a transition that extends in a first direction and a second direction orthogonal to the first direction. The shielding structure includes a shielding structure portion, which includes a first shielding via in proximity to a first area of the signal path at the transition; a second shielding via in proximity to a second area of the signal path at the transition; and an area metallization electrically coupled to the first shielding via.

Abstract: An exemplary embodiment of the present invention comprises a radio frequency absorber that is operative for absorbing electromagnetic energy, scattering electromagnetic signals, and/or attenuating electromagnetic signals. In accordance with certain aspects of the invention, the radio frequency absorber is substantially flat and comprises an absorbing surface. The absorbing surface is operative to absorb electromagnetic energy, scatter electromagnetic signals, and/or attenuate electromagnetic signals. In exemplary embodiments of the invention, the radio frequency absorber comprises a plurality of holes disposed within the radio frequency absorber. The radio frequency absorber, according to various embodiments of the present invention, is configured to reduce cavity oscillations and/or cavity modes and resonances within an integrated circuit device, such as a device that houses a monolithic microwave integrated circuit.

Abstract: A filter including: a base film; a reflection preventing layer which is formed on one side of the base film; an electro magnetic interference (EMI) shielding layer which is formed on another side of the base film; an adhesive layer, which is formed between the EMI shielding layer and a front substrate of a display panel so as to directly adhere the filter to the front substrate of the display panel; and a conductive member which is formed to externally protrude and is formed inside a groove that penetrates the reflection preventing layer and the base film so as to electrically connect the EMI shielding layer and the conductive member. Accordingly, the filter includes a single base film and can ground the EMI shielding layer at the front surface of the plasma display device. The filter is included in a plasma display device.

Abstract: A lighting device, for illuminating display designed parts on a display plate, includes at least one light source arranged at a rear side of the display plate, and a light guide body having a light guide portion for guiding the light toward its outer-circumferential portion to output the light toward the display designed parts through a front surface of the light guide portion. The outer-circumferential portion has an outer-circumferential side wall surface at is outer end. The light guide portion has at least one projecting portion projecting from the outer-circumferential side wall surface. The projecting portion is provided with a reflecting side surface formed along the outer-circumferential side wall surface so that the reflecting side surface can reflect the light traveling in the light guide portion to be outputted through the front surface of the light guide portion.

Abstract: A rigid light-passing body is disclosed. Within the body, an electroluminescent strand is supported in a predetermined configuration. In some embodiments, the body may be tubular, with the electroluminescent strand configured in spaced-apart windings around a support extending through the tubular body. In other embodiments related to area lighting, windings or strands may be closely spaced, or touching so that the windings or strands are self-supporting in their predetermined configuration. In other embodiments, there may be multiple strands that produce light of differing colors, the multiple strands attached to a support. The rigid body may also be a spherical shape, with a support therein for supporting at least one electroluminescent strand. For most embodiments, a housing is provided that includes an inverter and battery carrier for providing electrical power to the electroluminescent strand. In other embodiments, electrical power may be provided from an external source.

Abstract: The present invention deals with wireless control of a lamp such as a fluorescent lamp controlled by a ballast with a wireless control interface for RF communication. The receiver input and the transmitter output of the control interface module are connected to one or more electrode wires by means of (a) coupling capacitor(s) or a Lecher line transformer. During operation the lamp electrodes serve as the lamp antenna.

Abstract: A folder has a detachable illumination device disposed on an upper cover of the folder so that the illumination device, such as a lamp, can be momentarily inserted into a specific power socket to provide illumination, or can be detached and placed in a predetermined slot formed on an inner surface of the folder to facilitate the carrying. Thus, the folder can break the limitation in use in various occasions where no sufficient light source is provided, and can thus enhance the utility and the convenience thereof.

Abstract: An articulated aquarium light is combined with a display case. The light is secured to ground, includes an upright support, and a cantilevered arm mounting one or more operative units, such as lights, etc. The light may include adjustment for the length of the support, thus allowing the cantilevered arm to be moved upward or downward. The light may alternatively or additionally include adjustment of the angular position of the cantilevered arm, thus allowing the arm to swing away from the case.