Abstract: Some embodiments of the invention include a 2-up manufacturing technique for producing test strips to reduce costs, reduce waste, and increase output. Other techniques relating to the 2-up technique, such as simultaneously manufacturing test strips arranged in multiple columns, are also disclosed. Yet other techniques include cutting through the upper and lower substrates to form an overhang of either the upper or the lower substrate. Other embodiments include a dual-use biosensor in which a user can apply a sample of bodily fluid to both test strips simultaneously.

Abstract: A device for assembling a first upper transparent part to a second lower absorbent part, the parts being positioned on a support. The device includes a mechanism projecting a laser beam onto the upper part, a first clamp geometrically referencing the assembly formed by the two parts and positioned on the support, a second clamp exerting a pre-determined stress on the assembly of parts, and a management system associated with the second clamp, adjusting the stress exerted at a pre-determined welding interface. An assembly method is intended for laser-transparent welding of two parts assembled using one such assembly device. The clamping fitting is configured to apply the stress exerted at the welding interface.

Abstract: A method for production of an identification medium, includes a forming step in which a code printed pattern is formed by printing; and a joining step in which the code printed pattern and a cholesteric liquid crystal layer are joined; wherein the identification medium includes, in order, seen from an observing side: a cholesteric liquid crystal layer, in which a hologram is processed and right circularly polarized light ?/4 plate and a linearly polarizing filter from the observing side, in which left circularly polarized light selectively penetrates toward the cholesteric liquid crystal layer when natural light enters from the opposite side to the cholesteric liquid crystal layer side; and a code printed pattern, in which a two-dimensional codes is formed.

Abstract: A method for thermoforming a laminate to a part by controlling the temperature and pressure during the thermoforming. The laminate to be thermoformed may include an adhesive layer and the part may be a metal article. A thermoforming box may be used to control one of the temperature and the pressure.

Abstract: A road stud placement and removal system includes an induction heating system to quickly heat an appropriate quantity of road stud adhesive. A specific volume of the road adhesive may be dispensed by the system on the road surface, and a road stud placement assembly may automatically place a road stud in the dispensed adhesive. The stud placement system is operable to automatically dispense stud adhesive and place road studs in succession. According to certain embodiments, the placement system may be supported by a traffic safety vehicle, which enables the worker to automatically place the road studs while driving the vehicle.

Abstract: The invention relates to a method for manufacturing a mechanical member in composite material, such as a connecting rod (19), comprising successive operations of applying layers of reinforcing fibres braided all about a mandrel, comprising, between two operations of applying layers of braided reinforcing fibres, a step: of placing at least one element formed of pultruded reinforcing fibres (14?), oriented longitudinally (AX); and of at least temporary attachment of each pultruded element (14?) to the last layer of braided reinforcing fibres, and in which a resin is then injected into the various braided layers before this resin is polymerized in order to form a rough connecting rod.

Abstract: A process for producing a curved substrate (20) covered with a film (10) comprises a heat treatment of the film performed between a step of preforming said film and a step of assembling the film with the substrate. A maximum temperature of the pre-assembling heat treatment is higher than another maximum temperature of a post-assembling heat treatment (F) which is performed after the assembling step. Then the assembly of the substrate (20) with the film (10) is not altered during said post-assembling heat treatment. In particular, no defect and no delamination appear, and no change in the curved shape of the substrate is caused by the post-assembling heat treatment, even if the substrate (20) has a low glass transition temperature.

Abstract: Methods and systems for controlling temperatures in plasma processing chamber via pulsed application of heating power and pulsed application of cooling power. In an embodiment, fluid levels in each of a hot and cold reservoir coupled to the temperature controlled component are maintained in part by a coupling each of the reservoirs to a common secondary reservoir. Heat transfer fluid is pumped from the secondary reservoir to either the hot or cold reservoir in response to a low level sensed in the reservoir. In an embodiment, both the hot and cold reservoirs are contained in a same platform as the secondary reservoir with the hot and cold reservoirs disposed above the secondary reservoir to permit the secondary reservoir to catch gravity driven overflow from either the hot or cold reservoir.

Abstract: Provided are a substrate processing device and an impedance matching method. The substrate processing device includes: a high frequency power source for generating high frequency power; a process chamber for performing a plasma process by using the high frequency power; a matching circuit for compensating for a changed impedance of the process chamber; and a transformer disposed between the process chamber and the matching circuit in order to reduce the impedance of the process chamber.

Abstract: In one embodiment, a plasma etching system may include a process gas source, a plasma processing chamber, and a gas supply conduit. A plasma can be formed from a process gas recipe in the plasma processing chamber. The gas supply conduit may include a corrosion resistant layered structure forming an inner recipe contacting surface and an outer environment contacting surface. The corrosion resistant layered structure may include a protective silicon layer, a passivated coupling layer and a stainless steel layer. The inner recipe contacting surface can be formed by the protective silicon layer. The passivated coupling layer can be disposed between the protective silicon layer and the stainless steel layer. The passivated coupling layer can include chrome oxide and iron oxide. The chrome oxide can be more abundant in the passivated coupling layer than the iron oxide.

Abstract: Methods and systems for controlling temperatures in plasma processing chamber with a combination of proportional and pulsed fluid control valves. A heat transfer fluid loop is thermally coupled to a chamber component, such as a chuck. The heat transfer fluid loop includes a supply line and a return line to each of hot and cold fluid reservoirs. In an embodiment, an analog valve (e.g., in the supply line) is controlled between any of a closed state, a partially open state, and a fully open state based on a temperature control loop while a digital valve (e.g., in the return line) is controlled to either a closed state and a fully open state.

Abstract: Apparatus for processing substrates are provided herein. In some embodiments, an apparatus includes a first conductive body disposed about a substrate support in the inner volume of a process chamber; a first conductive ring having an inner edge coupled to a first end of the second conductive body and having an outer edge disposed radially outward of the inner edge; a second conductive body coupled to the outer edge of the first conductive ring and having at least a portion disposed above the first conductive ring, wherein the first conductive ring and the at least a portion of the second conductive body partially define a first region above the first conductive ring; and a heater configured to heat the first conductive body, the second conductive body, and the first conductive ring.

Abstract: A plasma processing apparatus may include a process chamber having an interior processing volume, first, second and third RF coils disposed proximate the process chamber to couple RF energy into the processing volume, wherein the second RF coil disposed coaxially with respect to the first RF coil, and wherein the third RF coil disposed coaxially with respect to the first and second RF coils, at least one ferrite shield disposed proximate to at least one of the first, second or third RF coils, wherein the ferrite shield is configured to locally guide a magnetic field produced by an RF current flow through the first, second or third RF coils toward the process chamber, wherein the plasma processing apparatus is configured to control a phase of each RF current flow through each of the of the first, second or third RF coils.

Abstract: An electrostatic chuck is disclosed, which is especially suitable for fabrication of substrates at high throughput. The disclosed chuck may be used for fabricating large substrates or several smaller substrates simultaneously. For example, disclosed embodiments can be used for fabrication of multiple solar cells simultaneously, providing high throughput. An electrostatic chuck body is constructed using aluminum body having sufficient thermal mass to control temperature rise of the chuck, and anodizing the top surface of the body. A ceramic frame is provided around the chuck's body to protect it from plasma corrosion. If needed, conductive contacts are provided to apply voltage bias to the wafer. The contacts are exposed through the anodization.

Abstract: Apparatus for processing semiconductors are provided herein. In some embodiments, an apparatus for processing a substrate may include: a first ring disposed concentrically about a substrate support, the first ring configured to position a substrate atop the substrate support during processing; and a second ring disposed between the substrate support and the first ring, the second ring configured to provide a heat transfer path from the first ring to the substrate support.

Abstract: A method for separating a substrate assembly is provided. A substrate assembly including a first substrate and a second substrate is provided first. The second substrate has at least a through hole. The first substrate and the second substrate are adhered together so that the through hole exposes the first substrate. A fluid is then injected between the first substrate and the second substrate through the through hole so as to separate the first substrate from the second substrate.

Abstract: Improved semiconductor wafer debonding system, method, and apparatus, including a stress-free means for multi-axis debonding utilizing a specialized tool or fixture having at least one ultrasonic transducer.

Abstract: A paper stripping member is removably supported by a supporting member disposed facing a circumferential surface of a photoreceptor drum, and strips a paper sheet off the circumferential surface. The paper stripping member includes an acute-shaped stripping nail, a holding member and a cover member. The holding member is configured removably from the supporting member, and holds the stripping nail in such a manner that the stripping nail extends toward the circumferential surface. The cover member is configured removably from the holding member, and covers at least part of the stripping nail in the extending direction of the stripping nail in a state where the cover member is attached to the holding member.

Abstract: The present invention is a door cover useful for covering a door that one would like to hide for various reasons not limited to dings, nicks, scratches, color fading, paint chipping, or simple dislike of design or color. In addition to the utility of hiding an aspect of a door, the door cover also offers an easy, cheap, and quick method of securely fastening a new style to a door. This new style can consist of endless artistic opportunities, not limited to numerous different colors, materials, patterns and textures. The fitted door cover can accommodate any style imaginable, to include any artist style, holiday representations, represent political affiliations, sporting loyalties, characters, brands, logos, as well as many other possible expressions of individuals, such as monograms.

Abstract: A draft arrester for an overhead door. An exemplary embodiment may include a flexible draft curtain extending between a ceiling structure and a wound-up portion of the overhead door. The draft arrester may include a follower assembly, which may include one or more rollers arranged to roll against the overhead door. An exemplary embodiment may include a repositionable arm arranged to press the rollers against the wound-up portion of the door.

Abstract: A process and system for manufacturing roller blinds is provided which includes structure for performing plural steps including a first step of helically winding slat fabric about a drum, thereby forming a slat product. A second step includes moving the slat product from the drum to a platform. A third step includes winding the slat product about a roller tube to form a roller blind. A fourth step includes moving the blind from the platform to a heat treating device.

Abstract: A motorized roller shade includes a shade tube, including an outer surface upon which a shade is attached, an inner surface defining an inner cavity and two end portions, a motor/controller unit, disposed within the shade tube inner cavity and mechanically coupled to the shade tube inner surface, including a support shaft configured to attach to a mounting bracket, and a DC motor having an output shaft coupled to the support shaft such that the output shaft and the support shaft do not rotate when the support shaft is attached to the mounting bracket. A wireless receiver is coupled to the motor/controller unit to receive wireless signals and an antenna is arranged on or in at least one of the two end portions.

Abstract: A sun shading apparatus includes a supporting frame, a shading frame and a shading fabric. The supporting frame includes a first and a second leg frame, and a supporting bar extended between the first and the second leg frames, while the second leg frame has a third and a fourth mounting slot. The shading frame includes a first and a second coupling joint each having a V-shaped cross section detachably coupled with two ends of the supporting bar respectively, a first and a second frame member and a reinforcing frame. The first and the second frame member are coupled with the first coupling joint and the second coupling joint respectively, while the reinforcing frame is extended between the first and second frame member and the supporting bar to form a support platform. The shading fabric is detachably mounted on the support platform for shading adverse weather condition.

Abstract: A method is presented, by which dewatering in paper product production, optical properties, bulk and surface smoothness of the paper product can be increased. The method involves at least one step physical treatment of the vegetable fiber raw material.

Abstract: The withdrawal screen section is for impregnation of chips during the manufacture of chemical pulp. Chips are steamed and impregnated in a low pressure impregnation vessel using pressurised hot spent cooking liquor BL. The spent cooking liquor produces most of the steam BLST, necessary for steaming the chips. To reduce the need for adding fresh steam for chip steaming is a first withdrawal section in the impregnation vessel modified to be used both as a flash tank for warm pressurised wash filtrate and improved wash-out feature for the spent impregnation liquid behind the screen in the withdrawal section. The withdrawal volume is arranged with an upper part located above the liquid level LIQLEV of the impregnation vessel. Additional pressurised warm wash liquor REC1 is added to the withdrawal volume and flashed off steam is led in a steam duct to the chip volume above the liquid level.

Abstract: The present invention relates to an aqueous preparation comprising a fluorescent dyestuff of a specific formula, water, and optionally a dispersing agent, and the use of the aqueous preparation for dyeing cellulose- or polyamide-containing materials.

Abstract: A method is provided for controlling organic contaminants, such as xylans, pitch or both, that interfere with bleaching of fibers and/or cause other interference(s) in papermaking systems. The method includes contacting fibers before any bleaching thereof with a composition which contains a hemicellulolytic enzyme and an organic contaminant removal adjuvant to liberate the organic contaminants from the fibers. The treated fibers can then be bleached and further used, for example, in making paper. The present invention also relates to the treatment compositions and to paper products made with fiber materials treated with these compositions. A method of enhancing enzymatic degradation of a substrate as well as formulations and systems for achieving the same are also provided. Various substrates can be degraded or otherwise processed, including biomass, paper mill sludge, and animal hides. Enzymatic degradation can be enhanced by including one or more polymeric surfactants.

Abstract: A roll coating is manufactured having fiber and polyurethane made from aromatic isocyanate. The roll coating incorporates fiber having improved strength during the manufacturing stage, and so does not crack, as a result of which the coating can be s manufactured in a simple, efficient and inexpensive manner. A roll of a fiber web machine has a roll body having a coating of fiber and polyurethane that is made from aromatic isocyanate, on the roll body.

Abstract: A system for transferring molten metal from a vessel and into one or more of a ladle, ingot mold, launder, feed die cast machine or other structure is disclosed. The system includes at least a vessel for containing molten metal, an overflow (or dividing) wall, and a device or structure, such as a molten metal pump, for generating a stream of molten metal. The dividing wall divides the vessel into a first chamber and a second chamber, wherein part of the second chamber has a height H2. The device for generating a stream of molten metal, which is preferably a molten metal pump, is preferably positioned in the first chamber. When the device operates, it generates a stream of molten metal from the first chamber and into the second chamber. When the level of molten metal in the second chamber exceeds H2, molten metal flows out of the vessel and into another structure, such as into one or more ladles and/or one or more launders.

Abstract: The present invention provides a structure for casting containing an organic fiber, an inorganic fiber, inorganic particles (A) having an average particle diameter of 50 to 150 ?m, and a binder (a), having a surface layer containing refractory inorganic particles (B) having an average particle diameter of 1 to 100 ?m selected from metal oxides and metal silicates, a clay mineral, and a binder (b), on the surface of the structure.

Abstract: A control system comprising a temperature sensor, an enthalpy sensor and a processor capable of receiving said temperature and enthalpy signals and further capable of controlling the operation of an energy recovery ventilation wheel based at least in part on said temperature and enthalpy signals.

Abstract: A bimetallic seal for an air heater is designed to flex and close a gap as the temperature changes. The laminated metal/bimetallic seal is designed such that when subjected to a temperature change, the laminated metals deflect and this deflection is used provide a seal to control leakage. With its ability to deflect with a temperature change, the laminated metal proves to be a material that can deflect to accommodate the clearances caused by the structural deformation found in air heaters. Various mounting configurations can be used, depending on the conditions in each air heater. The bimetallic seal can be used in air handlers and other devices that are exposed to a temperature change.

Abstract: In one embodiment, a thermal energy storage system includes a first cascade containing a first phase change material and a second cascade containing a second phase change material, wherein the melting point of the first phase change material is different than the melting point of the second phase material.

Abstract: An energy saving air conditioning system is disclosed which provides different air conditioning modes, including a closed-loop mode, an open-loop mode, and a partial-loop mode, for controlling the environment in a high-density apparatus room. The energy saving air conditioning system uses a cloud operating center to monitor the temperature and the moisture inside and outside the high-density apparatus room. The cloud operating system dynamically selects the air conditioning mode in such a manner that energy can be saved and the environment in the high-density apparatus room can be optimally to managed.

Abstract: Systems and methods to precisely balance the amount of heat removed from a specimen with the amount of heat generated during processing are presented. In some embodiments, the heat introduced into the specimen is rapidly removed by a temperature controlled cooling element via radiative heat transfer. In some embodiments, a heating element is disposed between the specimen and the cooling element. The heating element is controlled to precisely balance the amount of heat removed from the specimen with the amount of heat generated. A control signal is generated based on the amount of process energy known apriori. The control signal may also be based on an indication of a temperature of the specimen. In some embodiments, an adjustable aperture is employed to change the surface area of the cooling element exposed to the specimen, and thus control the amount of heat absorbed from the specimen by the cooling element.

Abstract: Resources Recovery Scheme and Removal to that extent—lost in the direction and furnish with a foundation of knowledge, is a uniform aim. The whole complex of factors, surroundings the Ecological Community who supports Trade with a piece of equipment that automatically controls temperature used to keep the canister hot or cold. Another supplies a mixture formed toward instances of sweeping the beginning of, and the additional flow—that is waste over Public health equality.

Abstract: An integrated power and refrigeration system is disclosed. The integrated system includes a solution comprising an absorber fluid and a working fluid that can be selectively dissolved into the absorber fluid. The integrated system also includes a first subsystem configured to extract heat from an external cooling load by pumping the solution through a vapor absorption cycle and a second subsystem configured to provide power by accepting a first portion of the solution from the first subsystem, extracting at least a portion of the working fluid from the accepted solution, heating the extracted working fluid, using the heated extracted working fluid to drive a turbine that is coupled to a power generator, and then returning the extracted working fluid and the remaining accepted solution to the first subsystem.

Abstract: Disclosed is a power system comprising a mount, a heat exchanger, and a corrugated strap positioned about the heat exchanger for securing the heat exchanger to the mount. The heat exchanger comprises a separation edge, and the corrugated strap may comprise a first corrugated section and a second corrugated section. A separation bend may be positioned between the first corrugated section and the second corrugated section, and the separation bend may overlap the separation edge.

Abstract: A heat sink configured for heat dissipation of a heat-dissipating element on a circuit boards includes a base, a linear fastener and a heat-dissipating fin set. A surface of the base is provided with a groove. The linear fastener includes a fixing section and an engaging section bent to extend from the fixing section. The fixing section is disposed in the groove. The engaging section protrudes out of the base to be fixed onto the circuit board. The heat-dissipating fin set is constituted of a plurality of stamped fins engaged with each other. The heat-dissipating fin set is combined on the base to press the fixing section, thereby clamping the fixing section between the heat-dissipating fin set and the base. The linear fastener makes the heat-dissipating fin set to be combined on the circuit board, thereby increasing the heat-dissipating efficiency of the heat sink.

Abstract: A magnetic lock system for releasably securing a heat exchanger with a component. The system includes: an electromagnet on one of the heat exchanger or the component and a magnetic region on the other of the heat exchanger or the component; the electromagnet being energizable to attract the magnetic region to secure the component and the heat exchanger in a thermally coupled position; and the electromagnet being de-energizable to release the component and the heat exchanger from the thermally coupled position.

Abstract: An air conditioner having a structure capable of variably installing an indoor unit of the air conditioner in a vertical or horizontal direction, the air conditioner including a body configured to be variably installed in a vertical or a horizontal direction, a heat exchanging device installed inside the body, and a drain assembly provided to collect condensation water generated from the heat exchanging device, wherein the drain assembly includes a first drain tray provided at a lower portion of a traverse (length) side of the heat exchanging device to collect the condensation water falling along the surface of the heat exchanging device when the body is horizontally installed, and a second drain tray provided at a lower portion of a longitudinal (height) side of the heat exchanging device to collect the condensation water falling along the surface of the heat exchanging device when the body is vertically installed.

Abstract: Devices, systems, and techniques for managing heat generated in coils for wireless energy transmission are disclosed. Inductive coupling between two coils (e.g., a primary coil and a secondary coil) may be used to recharge the power source of an implantable medical device. A phase change material may be thermally coupled to the primary coil to absorb heat generated during the inductive coupling and reduce temperature increases of the primary coil. In one example, the phase change material may be configured to absorb heat from an energy transfer coil. A housing may be configured to contain the phase change material and a coupling mechanism may be configured to removably attach the housing to the energy transfer coil.

Abstract: A cooling method is provided which includes providing a cooling apparatus that includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.

Abstract: According to the present invention, the method of heat transfer in a direction, which is reverse to natural convection, includes introduction of an additional pumping substance into the heated area. The pumping substance is incapable to be dissolved in the heat-transfer agent and its boiling temperature is lower than the boiling temperature of the heat-transfer agent. The heat-transfer agent is heated up, the pumping substance evaporates and the vapour pressure of the pumping substance is used to force the hot heat-transfer agent to flow along the branches of the circulating loop. The device for heat transfer in a direction reverse to the natural convection characterized in that its design incorporates technical means intended for vapour condensation of the pumping substance as well as technical means intended for draining that condensate from the condensation area to the evaporation area.

Abstract: An air conditioner is provided. The air conditioner may include at least one indoor device and an outdoor device connected to the at least one indoor device. The outdoor device may include an outdoor heat exchanger including a plurality of heat exchange parts, a plurality of outdoor expansion parts corresponding to the plurality of heat exchange parts, a pass variable tube that varies refrigerant flow in the outdoor heat exchanger, and a pass variable valve provided in the pass variable tube. The heat exchange parts may include a first heat exchange part. The first heat exchange part may be connected to a manifold that distributes refrigerant flow in a heating operation. The manifold may be connected to a plurality of capillaries connected to the first outdoor expansion part. The pass variable tube may be connected to the manifold.

Abstract: A liquid-cooling heat-dissipating module is configured for allowing a cooling liquid to be filled therein and includes a casing and a cooling assembly. The casing has a hollow interior and is provided with an inlet and an outlet in communication with its interior. The cooling assembly is provided in the casing and formed with a conical eddy generation region at a position corresponding to the outlet. The cooling liquid generates an eddy in the eddy generation region to flow into the outlet. By this structure, the staying time of the cooling liquid in the heat exchange module is increased, so that the cooling effect and the heat-dissipating efficiency of the cooling liquid are improved greatly.

Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s), and a boiling fluid mixture of first and second dielectric fluids within the fluid-tight compartment, with the electronic component(s) immersed within the mixture. A condensing fluid is also provided within the fluid-tight compartment, and is immiscible with the boiling fluid mixture. The condensing fluid has a lower specific gravity and a higher thermal conductivity than the boiling fluid mixture, and facilitates condensing of vaporized boiling fluid mixture. A cooling structure is provided within the compartment, and includes a condensing region and a sub-cooling region, with the condensing region being in contact with the condensing fluid, and the sub-cooling region being in contact with the boiling fluid mixture.

Abstract: A heat dissipation device includes a heat pipe and a fin set. The fin set includes a plurality of fins. Each of the fins includes a body, a first flange vertically extending from a top side of the body, and a second flange vertically extending from a bottom side of the body. The first flange has a first edge abutting a front neighboring fin and a second edge spaced to the first edge to define a slit. The first flange forms an extending portion extending from the second edge to define a gap between the extending portion and the body of the front neighboring fin. Each of the extending portions is soldered to the body of the front neighboring fin by solder filled in the gap between the extending portion and the body of the front neighboring fin from the slit.

Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment.

Abstract: An exemplary heat dissipation device is adapted for dissipating heat generated from electronic components having different heights. The heat dissipation device includes a base plate and a first heat absorbing member and a second heat absorbing member extending from a top side of the base plate and having different heights for contacting the electronic components having different heights.