Abstract: There is provided a household appliance including a housing and a cavity arranged within the housing. The housing element is further arranged to allow viewing of the cavity. A display which is transparent to at least one wavelength in the visible light spectrum is arranged in connection to the housing element and is further arranged such that the cavity is exposed from outside the household appliance. The display is a thin film type electroluminescent display which is arranged as an integral part of the housing element.

Abstract: An exemplary computer includes a computer case, a first power conversion device mounted at a first position in the computer case, and a second power conversion device separate from and electrically connected with the first power conversion device. The first power conversion device converts external AC power to a first DC voltage and outputs the first DC voltage to the second power conversion device. The second power conversion device is mounted at a second position separate from the first position in the computer case. The second power conversion device converts the first DC voltage to at least one second DC voltage and outputs the at least one second DC voltage.

Abstract: Various embodiments are described relating to mounting chassis for the assembly and support of display devices. For example, one disclosed embodiment provides a mounting chassis for an interactive display device. The mounting chassis includes a plurality of sides defining an opening, wherein the plurality of sides including a lip extending into the opening, the lip being configured to support an electronic display panel. The chassis also includes one or more display panel fastening features disposed on the plurality of sides, and one or more integrated stand mounts integrated into one or more of the sides.

Abstract: An electronic apparatus is provided, which includes a first body, a second body, a supporting frame, and a pivoting-locking module. The two bodies overlap with each other. The supporting frame is pivoted onto the second body. The pivoting-locking module is disposed between the first body and the supporting frame. The pivoting-locking module includes a first pivoting-locking part and a plurality of second pivoting-locking parts. The first pivoting-locking part is fixed to the first body. The second pivoting-locking parts are movably attached to the supporting frame. When the second pivoting-locking parts are locked with the first pivoting-locking part, the second pivoting-locking parts may be pivoted relative to the first pivoting-locking part. The supporting frame may be pivoted relative to the second body only when the first body is pivoted to a predetermined position relative to the supporting frame by means of the first pivoting-locking part and the second pivoting-locking parts.

Abstract: The invention relates to an electronic apparatus 10 comprising with a flexible display 2, which may be extendable from a housing 5 upon use. In accordance with the invention, the edge portions 3 are provided with an edge protector having an upper surface P1 and a lower surface P2, said edge protector being comprised of segments 6a, 6b, 6c, 6d, 8a, 8b, 8c, 8d, which may be interconnected by hinges 9a, 9b, 9c. The segments of the edge protector are arranged above and below the edge portions of the flexible display 2 and are preferably displaceable during translation of the flexible display from a collapsed to an extended state and back. Preferably, the hinges 9a, 9b, 9c are arranged for enabling a vertical V and/or a horizontal H displacement of the segments. The segmented edge protector is arranged for being moved together with the display and to be stored together with it, so that the segments 6a, 6b, 6c, 6d, 8a, 8b, 8c, 8d substantially do not loose contact with the edge portion during storage.

Abstract: A supporting apparatus is used in an electronic apparatus that has a display device, a support base, and a transmission component. The display device is supported by the supporting apparatus and an angle is formed between the display device and the support base. The supporting apparatus includes a first support element, a second support element, a plurality of second axial levers, a first connecting element, and a second connecting element. The first support element is pivotally connected to the display device. The second support element is pivotally connected to the support base. Two ends of the first connecting element are respectively pivotally connected to the first support element and the second support element. Two ends of the second connecting element are respectively pivotally connected to the first support element and the second support element.

Abstract: An electronic apparatus includes a chassis, a casing fixed in the chassis, a first resilient shielding plate and a second resilient shielding plate both made of electromagnetic radiation shielding material, and a drawer. The casing defines a receiving space. The drawer is slidably received in the receiving space. The first resilient shielding plate fits about a front end of the casing and abuts against the chassis. The second resilient shielding plate is fixed to a front end of the drawer, to abut against an inner surface of the casing bounding the receiving space.

Abstract: A support device includes a base, a fitting portion, a first holding portion and a second holding portion. The fitting portion, to which a portable device is fitted, is provided in the base, the fitting portion includes a support surface that supports the portable device and a side surface continuous with the support surface. The first holding portion is provided at a first distance from the support surface and fixed to the side surface. The second holding portion is provided at a second distance from the support surface and is projected from and retracted into the side surface, the second distance being smaller than the first distance.

Abstract: Illustrative embodiments of the present invention are directed to a computer that has a housing with walls that form a substantially sealed interior cavity from an exterior environment. The computer includes a plurality of computer components within the interior cavity. The computer also includes at least one heat sink for dissipating thermal energy into the exterior environment. A cooling element is thermally coupled to the heat sink and at least one of the computer components to transfer thermal energy from the computer component into the heat sink and the exterior environment.

Abstract: There are provided systems, devices and methods for operating a housing for an electronic device as an input/output (I/O) device. In one embodiment, an electronic device includes a housing configured to function as an integrated housing and I/O device and one or more sensors obscured by a panel of the housing. The one or more sensors being configured to sense via the panel of the housing. The electronic device further includes a processing unit communicatively coupled to the one or more sensors and configured to interpret electrical signals generated by the one or more sensors. One or more output devices are communicatively coupled to the processing unit and configured to provide an output in response to the one or more sensors generating an electrical signal.

Abstract: A carrier is mountable to a component, and includes first tabs and second tabs. Clips and a latch are associated with a compartment of a computing system. The clips are to receive the first tabs, and the latch is to receive the second tabs, to isolate the carrier from movement in three dimensions.

Abstract: A pedestal structure of a flat panel display is made storable and disposed at the bottom of a main body of the flat panel display. The pedestal structure has substantially similar shape as a container of the main body that contains the pedestal structure and is capable of being completely hid in the main body when the pedestal structure is not in use. The pedestal structure may be directly drawn out of and rotated with respect to the main body as the support of the main body.

Abstract: This present invention provides a high power electronic device which is used for transforming the alternating current into the direct current, or transforming the direct current into the alternating current: a thyristor valve module, there are two same thyristor valve segments in the whole thyristor valve module; each segment includes saturated reactor, thyristor valve unit, direct current equalizing resistor unit, acquiring energy unit, damped resistor unit, damped capacitor unit, gate series unit and water cooling system. This device series connects the thyristor valves to meet different transmission powers and different voltage ranks. This device is the key element of the high voltage direct current transmission. It can be used for different voltage ranks AD transmission system and can also be used for different voltage ranks DC system, including the ultra-high voltage 800 kV and above system.

Abstract: An electric connection box according to the present invention can include a circuit board having a first surface capable of mounting an electronic component, and a second surface defining a non-mounting surface, a case housing the circuit board, the circuit board oriented in a substantially vertical direction, a vertical inner wall surface of the case formed opposite the non-mounting surface of said circuit board, the vertical inner wall and the non-mounting surface of said circuit board defining a substantially vertical air ventilation path, a suction port positioned in the case and in communication with the ventilation path, an exhaust port positioned in the case above said suction port and in communication with the ventilation path, and a heat generating component in communication with the ventilation path.

Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.

Abstract: A heat transfer apparatus and method are provided for transferring heat between integrated circuits. In use, a heat transfer medium is provided with a first end in thermal communication with a first integrated circuit and a second end in thermal communication with a second integrated circuit. Furthermore, a single casting formed about the heat transfer medium and defining at least one heat sink is provided for thermal communication with the first integrated circuit or the second integrated circuit.

Abstract: An electronic device includes a housing unit, a first electronic component, a heat-dissipating module, and an air-guide passage. The first electronic component, the heat-dissipating module, and the air-guide passage are disposed in the housing unit. The heat-dissipating module includes a fan unit and a heat-dissipating sink. The fan unit has a first air outlet zone and a second air outlet zone. The heat-dissipating sink is for dissipating heat generated by the first electronic component. The heat-dissipating sink is substantially aligned with the first air outlet zone. The air-guide passage is in spatial communication with the second air outlet zone and is formed with a passage air outlet. Air through the first air outlet zone flows in a first direction. Air through the passage air outlet is directed into the housing unit and flows in a second direction different from the first direction.

Abstract: A cooling coolant pipe of a server cabinet includes multiple tube bodies interconnected in series and at least one adjustable valve. In each of the tube bodies a first chamber and a second chamber that are adjacent to and separated from each other, the second chambers of the two adjacent tube bodies are in communication with each other, and a wall surface of each of the tube bodies has at least one connection port in communication with the first chamber. The adjustable valve is disposed in one of the tube bodies. The first chamber in each of the tube bodies is in communication with the second chamber in the tube body through the adjustable valve. In this way, the adjustable valve adjusts the flow rate of a cooling fluid flowing from the second chamber to the first chamber.

Abstract: A power cord (14) for an electronic product (10) such as a set-top box or the like provides a reduced thermal resistance path from a heat generating portion of the set-top to the ambient air to improve heat dissipation. In a preferred embodiment, the power cord includes a ground wire having a size in excess of that necessary to carry ground current to as to increase heat conduction from the ground plane of the set-top box circuit board.

Abstract: An electronic device includes a cabinet and electronic units received in the cabinet. A window is defined between two front columns. Each electronic unit includes a casing, which includes a top plate, a lateral side and a rotator. The lateral side defines an engaging opening therein. The rotator is movably connected to the casing and includes an engaging portion and an abutting portion. The abutting portion extends above the top plate. the engaging portion is received in the casing. When the abutting portion is pushed down, the rotator moves to cause the engaging portion to extend through the engaging opening to engage with the cabinet and to prevent the casing from being pulled out from the cabinet.

Abstract: A card holder adapted for converting a micro SIM card into a standard SIM card in size and shape includes an insulating housing of a flat board shape which is in accordance with the standard SIM card in size and shape, and defines a card groove in accordance with the micro SIM card in size and shape and in accordance with the standard SIM card in contact position for receiving the micro SIM card in place. At least one elastic part is disposed in a positioning fillister of the insulating housing opened in one groove sidewall of the card groove, and elastically stretches into the card groove to resist against one end of the micro SIM card for securing the micro SIM card in the card groove. By using the card holder, the micro SIM card can be converted into the standard SIM card in size and shape.

Abstract: The present invention relates to a method for the production of an expandable circuit carrier in which a starting material for an expandable substrate is applied on an electrically conductive foil which forms an expandable substrate layer which is connected to the foil, after which the foil is structured such that it forms a conductor structure having at least one expandable strip conductor. The present invention further relates to an expandable circuit carrier which can be produced by the method.

Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.

Abstract: A wiring board including a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on one surface of the first substrate and including multiple interlayer resin insulation layers and wiring layers, the built-up layer having an opening portion communicated with the penetrating hole of the first substrate and opened to the outermost surface of the built-up layer, an interposer accommodated in the opening portion of the built-up layer and including a second substrate and a wiring layer formed on the second substrate, the wiring layer of the interposer including multiple conductive circuits for being connected to multiple semiconductor elements, and a filler filling the opening portion of the built-up layer such that the interposer is held in the opening portion of the built-up layer. The opening portion of the built-up layer has a tapered portion tapering toward the outermost surface of the built-up layer.

Abstract: An object of the present invention is to provide a capacitor-incorporated wiring substrate in which connection reliability can be improved through ensuring of a path for supply of electric potential even upon occurrence of a faulty connection in a via-conductor group. In a capacitor-incorporated wiring substrate of the present invention, a capacitor 50 is accommodated in a core 11, and a first and a second buildup layers 12 and 13 are formed on the upper and lower sides, respectively, of the capacitor 50.

Abstract: A first step of the method for assembling a wire element with an electronic chip comprises arranging the wire element in a groove of the chip delineated by a first element and a second element, joined by a link element comprising a plastically deformable material, and a second step then comprises clamping the first and second elements to deform the link element until the wire element is secured in the groove.

Abstract: Three-dimensional power electronics packages are disclosed. In one embodiment, a three-dimensional power electronics package includes a metalized substrate assembly, a first power electronics device, and a second power electronics device. The metalized substrate assembly includes an insulating dielectric substrate having a power via fully-extending through the insulating dielectric substrate, a first conductive layer on a first surface of the insulating dielectric substrate, and a second conductive layer on a second surface of the insulating dielectric substrate. The first conductive layer is electrically coupled to the second conductive layer by the power via. The first power electronics device is electrically coupled to the first conductive layer such that the first power electronics device is positioned in a first plane.

Abstract: In a high-frequency switch module, a switch IC is mounted on a multilayer board to define a high-frequency switch module. The multilayer board includes two internal wirings and two internal ground electrodes. The internal ground electrodes are spaced apart from each other at an interval when viewed from a lamination direction of the multilayer board. The first internal wiring is located on the upper surface side of the first internal ground electrode, and is entirely separated from an RF wiring, and the first internal wiring includes a power supply wiring for supplying power to the switch IC. The second internal wiring is located on the upper surface side of the second internal ground electrode, and is entirely separated from the power supply wiring, and the second internal wiring includes a signal wiring through which an RF signal propagates.

Abstract: A circuit board assembly includes two external circuit boards, at least one electrical connector, at least one electronic component, and at least one hollow substrate. Each external circuit board includes an external electromagnetic shielding layer, a circuit layer and a dielectric layer. In each external circuit board, the dielectric layer is located between the external electromagnetic shielding layer and the circuit layer. The electrical connector is connected between the circuit layers located between the external electromagnetic shielding layers. The electronic component is disposed between the external circuit boards and connected with one of the circuit layers. The hollow substrate with plural openings is disposed between the external circuit boards. The electronic component and the electrical connector are located in the openings. Both a thickness of the electronic component and a height of the electrical connector are smaller than or equal to a thickness of the hollow substrate.

Abstract: An electronic apparatus includes: a first casing; a second casing; a support member, disposed on the second casing, to support the first casing; a slide rail, engaged with the support member, to support the first casing such that the first casing becomes slidable; and a slide stopper, disposed on the slide rail, to include a stopper surface for the support member and a projecting portion that separates a first end side of the first casing from the second casing.

Abstract: The invention relates to an arrangement for holding a plurality of electric capacitor assemblies, particularly assemblies having live housings. The arrangement has a carrier having a through-passage for introducing one of the assemblies and further has at least one bearing ring for mounting an assembly. The bearing ring is matched to the dimensions of the through-passage and the assembly such that the assembly when extending through the through-passage, is in contact with the inner edge of the through-passage via the bearing ring, but not in direct contact with the inner edge of the through-passage.

Abstract: A control circuit of a resonant power converter is disclosed. The control circuit comprises a first transistor and a second transistor for switching a transformer and a resonant tank comprising a capacitor and an inductor. A controller is configured to receive a feedback signal correlated to the output of the power converter for generating a first switching signal and a second switching signal to drive the first transistor and the second transistor, respectively. A diode coupled to the first transistor and the resonant tank for detecting the state of the first transistor and generating a detection signal for the controller. The detection signal indicates if the transistors are in a zero voltage switching (ZVS) state. If the transistors are not in the ZVS state, the switching frequency of the transistors will be increased.

Abstract: In one aspect, a power supply includes an energy transfer element, a switch, a feedback circuit, a comparator, a state machine, and a control circuit. The feedback circuit generates a feedback signal representative of an output level of the power supply. The comparator provides a feedback state signal having a first feedback state that represents the output level of the power supply being above a threshold level and a second feedback state that represents the output level being below the threshold level. The state machine selectively modulates a first signal in response to the feedback state signal, where the first signal is the feedback signal or the threshold value signal. The control circuit is coupled to control switching of the switch to regulate the output level of the power supply in response to the feedback state signal.

Abstract: A method and apparatus of primary side output voltage sensing for a flyback power converter preserves secondary-side tranformer isolation without the use of opto-isolators and does not require multiple high-speed sample and hold circuits. A timing circuit measures the duration of the diode conduction interval during a first PWM control cycle and applies this measurement to set the voltage sampling time of the feedback loop during the next PWM cycle. The voltage sampling time for the next PWM cycle is configurable and may be set to occur near the middle of the diode conduction interval or near the end of the diode conduction interval. The cycle-to-cycle PWM duty cycle adjustment step size may be limited to ensure that the diode conduction interval does not vary substantially from cycle to cycle.

Abstract: An input power circuit for a battery-powered device, such as a toy or consumer electronic device, includes a polarity correction circuit portion. The device includes a first input terminal and a second input terminal, a first output terminal and a second output terminal, and a diode with a forward voltage drop of about 0.5 volts or less. In embodiments, the polarity correction circuit portion is configured to provide a positive voltage polarity at the first output terminal and a negative voltage polarity at the second output terminal for any polarity of power at the first input terminal and the second input terminal. The polarity correction circuit portion can include a diode bridge, and the diode may include a Schottky diode or a germanium diode.

Abstract: A system and method for detecting a circulating current in a redundant AC-DC power supply is disclosed. In one embodiment, a redundant AC-DC power supply system can include a first AC-DC power converter that is configured to generate a first DC output. A second AC-DC power converter is configured to generate a second DC output. An output circuit is configured to provide an output voltage based on at least one of the first and second DC outputs. A controller is configured to control the first and second AC-DC power converters for providing at least one of the first and second DC outputs to the output circuit, the controller being configured to detect a circulating current condition in at least one idle converter of first and second AC-DC power converters.

Abstract: A power supply device includes two buck converters, having a coupling inductor Lo composed of two mutually-coupled inductors L1, L2, and a output capacitor Co, wherein of the two buck converters, a first buck converter is operated during a positive half-cycle period of an AC input voltage, and a second buck converter is operated during a negative half-cycle period of the AC input voltage, to obtain a DC output voltage at both ends of the output capacitor Co from the AC input voltage, is provided. Herewith, is provided the power-supply device using the buck converter, which can be reduced in the number of components and produced in a low cost without a diode bridge.

Abstract: There is provided an interleaved type power factor correction circuit having a transformer forming a separated winding structure, which is formed by integrating two inductors separately wound around the transformer. The interleaved type power factor correction circuit including a rectifying unit rectifying a commercial alternating current power, a transformer having a first inductor winding and a second inductor winding, a bobbin part, and a core part, a switching unit switching a power transmitted to the first and second inductor windings, a controlling unit controlling a switching operation of the switching unit in order to allow a phase difference between a current and a voltage of the switched power to satisfy a predetermined phase difference, and a stabilizing unit stabilizing the switched power from the switching unit.

Abstract: A method is directed to providing adaptive digital control for the PFC front-end of a switching mode power supply. The method uses an evaluation model to adjust control loop parameters of a control algorithm used by a controller on the primary side of the power supply. The method performs a series of step adjustments of the control loop parameter values to determine optimized values. In some implementations, the method determines and compares the line current THD corresponding to different control loop parameter values. The method provides simplified digital control loop design, optimizes PFC front-end performance, improves system efficiency by decreasing harmonic ripples, and reduces labor cost and time to market due to shorter research and development phase. System performance optimization is fully adaptive adjusted for changes in operating conditions due to, for example, environmental and temperature variations.

Abstract: A semiconductor device includes at least one arm series circuit, a conductive first thermal buffer member, and a conductive second thermal buffer member. The arm series circuit includes an upper arm, a lower arm, a positive-electrode terminal, a negative-electrode terminal, and an output terminal. The first thermal buffer member has a linear expansion coefficient greater than a linear expansion coefficient of the first switching device and smaller than a linear expansion coefficient of one of the positive-electrode terminal and the output terminal. The second thermal buffer member has a linear expansion coefficient greater than a linear expansion coefficient of the second switching device and smaller than a linear expansion coefficient of one of the negative-electrode terminal and the output terminal.

Abstract: A control signal generator to generate control signals for a readout integrated circuit (ROIC) includes a content addressable memory (CAM) and a random access memory (RAM). The CAM may have data stored within it that is indicative of times at which control signal switching events are to occur during generation of the control signals. The RAM may have data stored within it that is indicative of particular control signals that are to be toggled at the times indicated within the CAM.

Abstract: A Registered DIMM (RDIMM) system with reduced electrical loading on the data bus for increases memory capacity and operation frequency. In one embodiment, the data bus is buffered on the DIMM. In another embodiment, the data bus is selectively coupled to a group of memory chips via switches.

Abstract: A system including a controller and a memory chip. The controller includes first and second selection signal terminals supplying first and second selection signals, respectively, multiple first data terminals and multiple second data terminals. The memory chip includes a semiconductor substrate, third and fourth selection signal terminals provided on the semiconductor substrate and electrically coupled to the first and second selection signal terminals of the controller, respectively. Multiple third data terminals are provided on the semiconductor substrate and electrically coupled to the first data terminals of the controller, respectively. Multiple fourth data terminals are provided on the semiconductor substrate and electrically coupled to the second data terminals of the controller, respectively. The first and third data terminals communicate first data in response to the first selection signal. The second and fourth data terminals communicate second data in response to the second selection signal.

Abstract: A memory system having improved signal integrity includes a printed circuit board for use in a memory device, N memory semiconductor packages mounted on the printed circuit board, a first switch mounted on the printed circuit board, a controller mounted on the printed circuit board, N first signal lines connecting the semiconductor packages to the first switch such that the semiconductor packages and the first switch are in an N-to-1 correspondence, a second signal line connecting the first switch to the controller, and N selection lines connecting the semiconductor packages to the first switch such that the semiconductor packages and the first switch are in an N-to-1 correspondence. The N selection lines connect the semiconductor packages to the controller and transmit an enable signal. N is a natural number.

Abstract: The invention provides a semiconductor memory device including a variable resistance element capable of decreasing a variation of a resistance value of stored data due to a large number of times of switching operations and capable of performing a stable writing operation. The device has a circuit that applies a reforming voltage pulse to a memory cell including a variable resistance element of a degraded switching characteristic and a small read margin due to a large number of times of application of a write voltage pulse, to return each resistance state of the variable resistance element to an initial resistance state. By applying the reforming voltage pulse, the variable resistance element can recover at least one resistance state from a variation from the initial resistance state, and can recover the switching characteristic. Accordingly, there is obtained a semiconductor memory device in which a reduction of a read margin is suppressed.

Abstract: According to various embodiments, a variable resistance memory element and memory element array that uses variable resistance changes includes a select device, such as an ovonic threshold switch. The memory elements are able to switch during the very brief period when a transient pulse voltage is visible to the memory element.

Abstract: A memory device can include a plurality of programmable elements; at least one sense circuit that generates sense data values from detected impedances of accessed programmable elements; and at least one data store circuit that stores initial data values from the at least one sense circuit, and stores output data values from the at least one sense circuit after check conditions have been applied to at least one programmable element. The check conditions can induce a change in impedance for programmable elements programmed to at least one predetermined state. Methods can include reading data from at least one memory cell of a memory device comprising a plurality of such memory cells; if the read data has a first value, providing such data as an output value; and if the read data has a second value, repeating access to the memory cell to confirm the read data value.

Abstract: Balanced electrical performance in a static random access memory (SRAM) cell with an asymmetric context such as a buffer circuit. Each memory cell includes a circuit feature, such as a read buffer, that has larger transistor sizes and features than the other transistors within the cell, and in which the feature asymmetrical influences the smaller cell transistors. For best performance, pairs of cell transistors are to be electrically matched with one another. One or more of the cell transistors nearer to the asymmetric feature are constructed differently, for example with different channel width, channel length, or net channel dopant concentration, to compensate for the proximity effects of the asymmetric feature.

Abstract: Various embodiments comprise apparatuses and methods including a memory controller to control a non-volatile memory array. The memory controller includes a memory array interface coupled to the non-volatile memory array to perform reads and writes on the non-volatile memory array. An overwrite module is configured to write a desired bit value to a specific memory cell within the non-volatile memory array, after receiving the desired bit value and a logical address, regardless of an original value of the memory cell Additional apparatuses and methods are described.

Abstract: A resistive memory device comprises a memory cell array comprising a plurality of memory cells connected to a plurality of word lines and a plurality of bit lines, a row selector connected to the plurality of word lines, and a column selector connected to the plurality of bit lines. In a program or erase operation, the row selector provides a selected word line with program or erase pulse and a verification pulse in each of multiple program loops, wherein the verification pulse has a substantially fixed level through the program loops and the program or erase pulse has a negative value that decreases incrementally between successive program loops.