Abstract: A printed circuit board according to an embodiment of the present invention is formed of an insulating material and configured to mount components and wiring thereon. The printed circuit board includes a liquid pool for storing a liquid; a pair of deterioration detection traces one of which is connected to a power supply at one end and disposed in the liquid pool at the other end, and the other of which is connected to a ground at one end through a resistor and disposed in the liquid pool at the other end; a voltage detection circuit for detecting a voltage between the one ends of the one and the other deterioration detection traces; and a deterioration determination circuit for determining, based on the detected voltage, whether or not insulation deteriorates between the other ends of the one and the other deterioration detection traces.

Abstract: A circuit board includes a substrate, a patterned copper layer, a phosphorous-containing electroless plating palladium layer, an electroless plating palladium layer and an immersion plating gold layer. The patterned copper layer is disposed on the substrate. The phosphorous-containing electroless plating palladium layer is disposed on the patterned copper layer, wherein in the phosphorous-containing electroless plating palladium layer, a weight percentage of phosphorous is in a range from 4% to 6%, and a weight percentage of palladium is in a range from 94% to 96%. The electroless plating palladium layer is disposed on the phosphorous-containing electroless plating palladium layer, wherein in the electroless plating palladium layer, a weight percentage of palladium is 99% or more. The immersion plating gold layer is disposed on the electroless plating palladium layer.

Abstract: Provided is a metal microparticle dispersion including metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.5 ?m; the polymeric dispersant has a polyester skeleton in at least one of a principal chain and a side chain thereof; or the polymeric dispersant has a polyether skeleton in at least one of a principal chain and a side chain thereof; and a content of the above polymeric dispersant is 0.1 to 100 parts by mass based on a content of 100 parts by mass of the metal microparticles. Further, provided is a production process for an electrically conductive substrate, and an electrically conductive substrate produced by the above production process is provided.

Abstract: A multi-layered 3D printed laser direct structuring method and apparatus for electrical interconnect and antennas. 3D printed components can be configured with structurally integrated metal connections (e.g., bulk highly conductive metal) that traverse multiple layers (some embedded and others external) of a structure fabricated using an additive manufacturing system enhanced with an iterative laser activated plating processes, which includes a novel well side-wall vertical interconnect.

Abstract: Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

Abstract: The printed circuit board with at least one substrate layer having signal lines on a corresponding upper surface and on a corresponding lower surface has a sleeve-sized conductive layer on a circumference of at least one via hole between the upper and lower surface for a conductive connection between at least one signal line on the upper surface and at least one signal line on the lower surface. to An axial enlargement of the sleeve-sized conductive layer is radially bent above a base layer of copper on the upper surface and below a base layer of copper on the lower surface.

Abstract: A differential trace pair system includes a board having a first board structure member and a second board structure member. A differential trace pair in the board includes a first differential trace pair portion of a first width outside the board structure, and a second differential trace pair portion of a second width extending through the board structure. A first outer edge and a second outer edge of the second differential trace pair portion define the second width that is less than the first width. A first board structure member channel is defined by the first outer edge adjacent the first board structure member, a second board structure member channel is defined by the second outer edge adjacent the second board structure member and the first and second board structure member channels provide a third width of the second differential trace pair portion that is less than the second width.

Abstract: Indentation visibility is improved and quick and accurate inspection is performed after a connection step using an anisotropic conductive film. A connection body according to the present disclosure comprises a transparent substrate and an electronic component connected to the transparent substrate via an anisotropic conductive adhesive; conductive particles contained by the anisotropic conductive adhesive cause a plurality of indentations arranged in an in-plane direction of a terminal of the transparent substrate.

Abstract: A composite electronic component includes an electronic element and a resistance element in a height direction. The electronic element includes an electronic element body, and a first and second external electrodes separated from each other in a length direction. The resistance element includes a base portion, a resistor disposed on the upper surface of the base portion, a protective film, and first to third upper surface conductors. The first and second upper surface conductors are separated from each other in the length direction, and the resistor and the third upper surface conductor connected thereto are located between the first and the second upper surface conductors.

Abstract: [Object] A method for efficiently manufacturing chip resistors is provided. [Means] The method includes the steps of preparing at least three conductive elongated boards 711 made of an electrically conductive material and a resistive member 702 made of a resistive material, arranging the at least three conductive elongated boards 711 apart from each other along a width direction crossing a longitudinal direction in which one of the at least three conductive elongated boards 711 is elongated, forming a resistor aggregate 703 by bonding the resistive member 702 to the at least three conductive elongated boards 711, and collectively dividing the resistor aggregate 703 into a plurality of chip resistors by punching so that each of the chip resistors includes two electrodes and a resistor portion bonded to the two electrodes.

Abstract: The display device includes: a flexible display panel including a display portion in which scanning lines and signal lines cross each other; a supporting portion for supporting an end portion of the flexible display panel; a signal line driver circuit for outputting a signal to the signal line, which is provided for the supporting portion; and a scanning line driver circuit for outputting a signal to the scanning line, which is provided for a flexible surface of the display panel in a direction which is perpendicular or substantially perpendicular to the supporting portion.

Abstract: A method for forming a film on a conductive substrate, comprising immersing a substrate having a conductive portion in a solution comprising a metal ion ceramic precursor for the film and a peroxide; applying a voltage potential to the conductive portion with respect to a counter electrode in the solution, sufficient to protect the conductive portion from corrosion by the solution, and drive formation of a film on the substrate, controlling a pH of the solution while limiting a production of hydrogen by electrolysis of the solution proximate to the conductive portion; and maintaining the voltage potential for a sufficient duration to produce a film on the conductive portion. An electrode may be formed over the film to produce an electrical device. The film may be, for example, insulating, dielectric, resistive, semiconductive, magnetic, or ferromagnetic.

Abstract: An anisotropic conductive film (ACF) including a base film, a support unit on the base film, the support unit defining at least one opening, at least one conductive particle in the opening, and an adhesive layer on the support unit and the conductive particle.

Abstract: A method of manufacturing conductive patterns includes the steps of a) printing and curing UV curable inkjet to define a cured inkjet ink pattern on a metal sheet bonded to a non-conductive substrate; b) etching the metal sheet not covered by the cured ink pattern to expose the non-conductive substrate; and c) applying an alkaline solution to dissolve the cured inkjet ink pattern within 5 minutes.

Abstract: Presented is an apparatus for generating a transfer pattern to be used in a transfer printing process. The pattern is generated in a substrate that could be a web substrate and that bears one or more trenches. A filler to be transferred is made to fill the trenches within the web substrate. Upon completion of the trench by filler filling, the substrate, the scraper and the squeegee are translated from the working zone in a synchronized movement, such that in course of the translation movement at least the scraper remains in full contact with the substrate.

Abstract: Reliability is improved for the mechanical electrical connection formed between a grid array device, such as a pin grid array device (PGA) or a column grid array device (CGA), and a substrate such as a printed circuit board (PCB). Between adjacent PCB pads, a spacing pattern increases toward the periphery of the CGA, creating a misalignment between pads and columns. As part of the assembly method, columns align with the pads, resulting in column tilt that increases from the center to the periphery of the CGA. An advantage of this tilt is that it reduces the amount of contractions and expansions of columns during thermal cycling, thereby increasing the projected life of CGA. Another advantage of the method is that it reduces shear stress, further increasing the projected life of the CGA.

Abstract: A display device that includes a housing with at least one Printed Circuit Board (PCB) and a plurality of rollers disposed in the housing. The display device also includes a display unit which, in turn, includes a display panel and a module cover. The display device further includes a driving unit that is connected to the display panel and the module cover. The driving unit moves the display panel and the module cover between a first state and a second state. In the first state, the panel and module cover are wound around at least one of the plurality of rollers, and in the second state they are unwound from the at least one of the plurality of rollers and exposed by being drawn out from the housing.

Abstract: A fixing structure is suitable for fixing a display panel of an electronic device. The display panel has a panel fitting portion at a side edge of the display panel. The fixing structure includes a front bezel and a rear bracket. The front bezel has a bezel fitting portion to fit with the panel fitting portion. The rear bracket is assembled to the front bezel and has a restraining portion to restrain the motion of the bezel fitting portion relative to the panel fitting portion after the bezel fitting portion fits with the panel fitting portion and the rear bracket is fixed to the front bezel. Besides, an electronic device applied with the above fixing structure and a method for assembling the same are also provided here.

Abstract: A curved display device is disclosed, the curved display device having a display panel having a plurality of curvatures. In some examples of the curved display device, a curvature of a side area of a display panel is higher than a curvature of a center area of the display panel.

Abstract: Electronic devices may be provided that contain multiple housing portions. The housing portions may be coupled together using hinges. The hinges may include hinges based on a three-bar linkage, hinges based on a four-bar linkage, hinges with slotted members, hinges formed from flexible support structures, and hinges based on flexible housing structures. Flexible displays may be mounted to the housing portions overlapping the hinges. When the housing portions in a device are rotated relative to each other, the flexible display may bend. The hinge may be configured to allow the flexible display to be placed in a front-to-front configuration in which an active side of the display faces itself or a back-to-back configuration. Engagement structures may be used to help the housing grip external objects and to hold the housing portions together. The hinges may be provided with rotational detents to help hold the flexible display in desired positions.

Abstract: An outer viewing panel includes a display window and a supporting body integrated with the display window. The display window is made of sapphire and the supporting body is made of ceramic for increased hardness and durability. The supporting body is integrally formed with the supporting body by a sintering process.

Abstract: Disclosed is an electronic device including a housing with a first surface facing a first direction and a second surface facing a second, opposite direction. A glass cover may form at least a portion of the first surface. A display may be exposed through the glass cover. At least one protrusion is configured to absorb external impact to the electronic device.

Abstract: A locking apparatus for a switchgear cabinet comprising a plurality of doors comprises: a locking slide, which is movable between an unlocked position and a locked position; a first blocking element which is connected to the locking slide; an electrically actuable second blocking element which is configured to enter into engagement with the first blocking element in the locked position of the locking slide and which is configured to release the first blocking element on reception of an unblocking signal; for at least two doors, in each case one door-securing slide, which is movable along the respective doors between an unlocked position and a locked position and which is coupled to the locking slide in a closed position of the doors so that the locking slide and the door-securing slide are movable together; and for at least two doors, in each case at least one closure rod which is movable along the respective doors between an unlocked position and a locked position, wherein the corresponding closure rod is in

Abstract: A display device includes: a display module including a display panel which displays an image; a main driving unit on a side of the display module; a first auxiliary driving assembly hinge-connected to a first side of the main driving unit; and a second auxiliary driving assembly hinge-connected to a second side of the main driving unit opposite to the first side thereof. The main driving unit includes: a fixing bracket attached to the side of the display module; a first main actuator hinge-connected to a first side of the fixing bracket; and a second main actuator hinge-connected to a second side of the fixing bracket opposite to the first side thereof.

Abstract: The protective housing can cover at least one component on the circuit board; the interior of the cover has several protrusions that are built, so that at least one part is displaced by raising the protective housing on at least one component, so that it is in contact with the exterior contour of the component and fastens it. Moreover, a circuit board is provided with at least one protective housing.

Abstract: An electronic device having a metal housing includes an external housing including a first face facing a first direction, a second face facing a second direction which is the opposite direction of the first direction, and a lateral face at least partially surrounding a space formed between the first and second faces, and a display exposed through the first face of the external housing, wherein the external housing includes a metal substrate having a first part at least partially forming the second face and a second part at least partially forming the lateral face, the second part being integrally extended from the first part; and a non-metallic material coated on the first part, and wherein the second part includes micro dimples having a repeated pattern on the lateral face.

Abstract: A cover for an electrical receptacle including a faceplate. The cover also includes a first transmission tab configured to be electrically connected to a first power line of the electrical receptacle and a second transmission tab configured to be electrically connected to a second power line of the electrical receptacle. Additionally, the cover includes a device (such as a light source, circuit, port, or sensor) in communication with the first transmission tab and the second transmission tab.

Abstract: A frame plate forms a frame of an opening, and leads to side plates. On the frame plate, a spacer extends towards the opening. The spacer is folded back in the opening in the side plate directions, and is fixed to the inner surfaces of the side plates.

Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment, a number of insert molded retaining members are utilized to inhibit outward deformation of a sidewall of the housing during a drop event. In another embodiment, a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.

Abstract: Thermoelectric-enhanced, rack-level cooling of airflow entering an electronics rack is provided by a cooling apparatus, which includes: an air-to-liquid heat exchanger; a coolant loop coupled to the heat exchanger, the coolant loop including a first loop portion and a second loop portion, where the heat exchanger exhausts heated coolant to the first loop portion and receives cooled coolant from the second loop portion. The cooling apparatus further includes a heat rejection unit and a thermoelectric heat pump(s). The heat rejection unit is coupled to the coolant loop between the first and second loop portions, and provides partially-cooled coolant to the second loop portion. The thermoelectric heat pump is disposed with the first and second loop portions coupled to opposite sides to transfer heat from the partially-cooled coolant within the second loop portion to provide the cooled coolant before entering the air-to-liquid heat exchanger.

Abstract: A power tool and a printed circuit board assembly (“PCBA”) for the power tool. The PCBA includes, for example, a printed circuit board (“PCB”), a heat sink, a spacer between the PCB and the heat sink, and a gap pad. The PCB and the heat sink are fastened to one another via fasteners so the spacer absorbs excess forces torsional forces from torques applied to the fasteners. The gap pad is placed within an opening or recess of the spacer to contact one or more FETs on the PCB. In some embodiments, the PCBA includes a second heat sink or rigid member on the opposite side of the PCB than the spacer to further distribute excess torsional forces from torques applied to the fasteners.

Abstract: A housing for a radar sensor module has a back surface and a plurality of side surfaces connected to the back surface. A vent structure is connected to the back surface and at least one of the side surfaces. The vent structure includes an enclosure enclosing a chamber. A first opening in the vent structure penetrates the at least one of the side surfaces of the housing, such that the chamber is exposed to an exterior of the housing. A second opening in the vent structure penetrates the enclosure such that the chamber is exposed to an interior of the housing.

Abstract: An electronic device includes a rack, a mount housing in which an electronic component is housed, and mounted in the rack from a front face side or rear face side of the rack, and a movable duct configured to have a housed state where the movable duct is retracted from an opening formed in a sidewall part of the mount housing and is housed in the mount housing and an opened state where the movable duct is moved to outside of the mount housing through the opening so as to form a ventilation flue located outside the mount housing and communicating with the opening.

Abstract: In a motor drive device of the present invention, a motor control unit is disposed on a first surface of an attaching unit, and a heat sink is disposed on a second surface opposite to the first surface. A first duct connects the second surface and the heat sink with each other. A second duct is disposed on the first surface, and a fan motor is disposed in the second duct. A space inside the first duct in communication with only a second opening of the attaching unit, and a space inside the second duct is in communication with both a first opening and the second opening of the attaching unit.

Abstract: A pressure control system within a multi-phase heat transfer immersion cooling tank includes: a differential pressure transducer that measures a differential pressure between a first vapor pressure internal to the immersion cooling tank and a second pressure outside of the immersion cooling tank; and a condenser inflow valve assembly that controls a flow rate of condensation liquid within the condenser located within the immersion tank. The pressure control system also includes a controller coupled to both the differential pressure transducer and the condenser inflow valve assembly having control logic that, in response to the measured differential pressure exceeding a pre-set threshold difference, triggers the condenser inflow valve assembly to increase a flow rate of the condensation fluid in order to reduce an amount of vapor within the immersion tank and bring the measured differential pressure back to below the threshold difference.

Abstract: The present disclosure relates to a unit structure for use in forming a modular data center. The unit structure may have an elongated frame structure forming a rectangular-like subsystem, and may be adapted to be supported above a floor surface. At least one conduit may be integrated into the elongated frame structure for supplying a fluid to an area defined by the elongated frame structure.

Abstract: Thermoelectric-enhanced, rack-level cooling of airflow entering an electronics rack is provided by a cooling apparatus, which includes: an air-to-liquid heat exchanger; a coolant loop coupled to the heat exchanger, the coolant loop including a first loop portion and a second loop portion, where the heat exchanger exhausts heated coolant to the first loop portion and receives cooled coolant from the second loop portion. The cooling apparatus further includes a heat rejection unit and a thermoelectric heat pump(s). The heat rejection unit is coupled to the coolant loop between the first and second loop portions, and provides partially-cooled coolant to the second loop portion. The thermoelectric heat pump is disposed with the first and second loop portions coupled to opposite sides to transfer heat from the partially-cooled coolant within the second loop portion to provide the cooled coolant before entering the air-to-liquid heat exchanger.

Abstract: This invention relates to a cooling apparatus comprising a base plate, an evaporator and a condenser. In order to obtain a simple and efficient cooling apparatus the evaporator is a porous aluminum evaporator having a capillary structure with pores and a plurality of larger sized evaporator channels extending through the evaporator between a second end and the first end of the evaporator. A compensation chamber extending along a second surface of the evaporator receives first fluid from the condenser such that pores opening up into the second surface of the evaporator are provided with first fluid.

Abstract: One object is to prevent electromagnetic wave interference between electronic components with restricted increase of the size of a circuit module. A circuit module according to an embodiment includes a circuit board, a plurality of electronic components provided on the circuit board, a resin mold provided on the circuit board so as to seal the plurality of electronic components in an insulating manner, a conductive shield covering the top surface and the side surfaces of the resin mold, and a plurality of conductive poles having a columnar shape provided in the resin mold and connecting the top surface of the conductive shield and the ground of the circuit board. The resonance caused by frequencies equal to or less than a predetermined maximum usable frequency is restricted.

Abstract: The present inventive concept relates to a method for manufacturing a shield can which absorbs and blocks electromagnetic waves generated in a circuit device inside an electronic device such as a portable phone, a PCS, or an RF communication apparatus and, more particularly, to a method for manufacturing a shield can for blocking electromagnetic waves, capable of continuously performing a manufacturing process from a metal band which is wound around a supply roll to the shield can to which a shielding tape is attached.

Abstract: A component mounting device includes a mounting head that is movable in a horizontal direction and mounts a held component on a substrate and a control portion that controls the operation of the mounting head. The control portion is configured to perform control of a speed of mounting, by the mounting head, of a component to be located closely adjacent to another component and to be mounted on the substrate such that an interval to an adjacent component is equal to or less than a predetermined threshold, on the substrate. A speed of mounting of the component is less than a speed of mounting in a normal state in which the mounting head mounts a component, which is not the component to be located closely adjacent to another component, on the substrate.

Abstract: The new variety ‘TH-917’ is provided. The new and distinct variety ripens around mid May in southern Georgia and late May in middle Georgia. The fruit of the new variety ‘TH-917’ are large, firm, have good flavor and scar. The new variety ‘TH-917’ is vigorous with an estimated chilling requirement of about 500 to 550 hours at or below approximately 7° C. The asexually reproduced variety is reliably propagated vegetatively.

Abstract: A new and distinct variety of interspecific tree. The following features of the tree and its fruit are characterized with the tree budded on ‘Nemaguard’ Rootstock (non-patented), grown on Handford sandy loam soil with Storie Index rating 95, in USDA Hardiness Zone 9, near Modesto, Calif., with standard commercial fruit growing practices, such as pruning, thinning, spraying, irrigation and fertilization. Its novelty consist of the following combination of desirable features: 1. Fruit with an attractive dark red skin color. 2. Fruit with good storage and shipping quality. 3. Fruit with good flavor and eating quality. 4. Fruit maturing in the late season. 5. Tree with vigorous, upright growth habit.

Abstract: A new and distinct Ilex×meserveae cultivar named ‘GEERS’ is disclosed, characterized by greyed-green leaves margined cream-white with dotted transition. Plants are male and do not produce fruit. Floriferous plants with moderately vigorous growth. Leaves appear sharp but are not sharp to the touch. The new variety is an Ilex×meserveae, normally produced as an outdoor garden plant.

Abstract: A new and distinct Dianthus cultivar named ‘DDTHP02-0’ is disclosed, characterized by continuous flowering on floriferous plants hardy to USDA Zone 3. Flowers are semi-double and medium purple. The new variety is a Dianthus, typically produced as a garden or container plant.

Abstract: A new and distinct cultivar of Chrysanthemum plant named ‘Aramis White’, characterized by its upright, outwardly spreading and uniformly rounded plant habit; moderately vigorous growth habit; freely branching habit; dense and full plant habit; dark green-colored leaves; uniform and freely flowering habit; and relatively large decorative-type inflorescences that are snow white in color.

Abstract: A new and distinct cultivar of Chrysanthemum plant named ‘Vigorelli Dark Orange’, characterized by its upright, outwardly spreading and uniformly rounded plant habit; vigorous growth habit; dark green-colored leaves; uniform and freely flowering habit; and relatively large decorative-type inflorescences with ray florets that are initially dark red in color becoming dark orange and lighter orange in color with subsequent development giving the inflorescences a bi-colored appearance.

Abstract: A new and distinct cultivar of Chrysanthemum plant named ‘Miora Orange’, characterized by its upright, outwardly spreading and uniformly rounded plant habit; vigorous growth habit; freely branching habit; dense and full plant habit; dark green-colored leaves; uniform and freely flowering habit; and relatively large decorative-type inflorescences with ray florets that are initially red in color becoming dark orange and yellow orange in color with subsequent development giving the inflorescences a bi-colored appearance.

Abstract: A new and distinct cultivar of Chrysanthemum plant named ‘Mefisto Dark Pink’, characterized by its upright, outwardly spreading and uniformly rounded plant habit; moderately vigorous growth habit; medium green-colored leaves; uniform and freely flowering habit; and relatively large decorative-type inflorescences that are dark pink in color.