Abstract: A removable, permanent or reconfigurable debug probing device for use in debug probing of a printed circuit assembly, the printed circuit assembly having at least one through via, the debug probing device comprising at least one leader thread configured to be threaded through the at least one through via. Using the probing device comprises inserting a selected one of the at least one leader threads through a selected one of the at least one through via to thereby probe a surface of the printed circuit assembly; and responsive to detecting a defect in the selected through via, using a flexible circuit connected to the selected leader thread to repair the detected defect.

Abstract: A method of manufacturing a flexible electronics module includes mounting at least two functional components onto a flexible substrate, forming stretchable electrical interconnects configured to provide connection between the two functional components, and cutting shapes into the flexible substrate to increase an ability of the flexible substrate to stretch and flex, wherein the electrical interconnects to the functional components are placed to avoid the shapes.

Abstract: Circuit boards are mechanically connected to each other by a U-shaped pin, the legs of which are forcibly inserted into holes along edges of the circuit boards. The holes are conventional through-holes having metal linings that are electrically connected to circuit board traces that extend to components on the circuit boards. The U-shaped pin thus electrically connects components on the two circuit boards to each other.

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.

Abstract: The present invention discloses a frame for holding a display panel. The frame includes a number of side frames and at least one rotating part. The side frames are connected end to end to form an enclosed frame for accommodating the display panel. The side frame defines at least one cutout extending along a longitudinal direction of the side frame. The rotating part is received in the cutout and is rotatably connected to the side frame via a rotating axis extending along the longitudinal direction of the side frame. The display panel is assembled in the enclosed frame via the rotating part. The present invention further provides a display device having the frame.

Abstract: An operating mechanism is provided for an electrical enclosure. The operating mechanism includes a switch operator, and a housing to house the switch operator. The switch operator includes a portion which extends through one of one or more holes in the electrical enclosure, and can be manipulated by an external handle to operate an electrical switching device, such as a circuit breaker, that is housed in the electrical enclosure. The housing includes a cavity to house and protect an external antenna or other electrical device, which is connectable to an electrical cable that extends from the cavity into an interior of the electrical enclosure via the hole(s). The electrical cable can be connected to a monitoring system inside of the electrical enclosure. The housing is mountable onto an exterior surface of a wall of the electrical enclosure to cover the hole(s).

Abstract: Bay RAM Five is a very high-speed solid-state data storage device with 4 independently controlled banks of 4 DDR3 SO-DIMM sockets per bank, 4 industry-standard SATA data connectors, and one 12V input DC power connector, all housed within an enclosure compatible with 5.25? drive bays found in common PC chassis. The 4 controllers are independently switched with jumper blocks, allowing backward- and forward-compatibility with SATA chipsets and add-on controllers transmitting data at various speeds. A separate jumper switches the device's firmware from the 8 b/10 b “legacy frame” to the 128 b/130 b “jumbo frame” now in the PCI-Express 3.0 specification. The 5.25? enclosure has room for 3 40×40 mm cooling fans, either 20 mm or 10 mm thick: fans are powered by 3 fan headers integrated onto the PCB, or a separate power supply installed in the PC chassis.

Abstract: An enclosure is provided which is mountable to a base frame carrying a generator. The enclosure includes a lower portion connectable to the base frame. The lower portion includes a lower first sidewall, a lower second sidewall, and a lower first end wall and a lower second end wall. The enclosure further includes an upper portion having a roof, an upper first sidewall, an upper second sidewall, and an upper end wall depending downwardly from the roof. The lower portion and the upper portion are hingedly connected together such that the upper portion is pivotable relative to the lower portion between closed and open positions.

Abstract: An electronic device having a housing for accommodating electronic components, preferably electronic components forming a process transmitter. The housing has two chambers, in which electronic components and user interfaces and/or connection elements for cable are arranged. The electronic components are arranged in a first chamber. In the case of a process transmitter, which is simple to maintain, electronic components are arranged exclusively in the first chamber, while user interfaces of the electronic components and/or connection elements for cable are positioned exclusively in the second chamber.

Abstract: Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and/or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.

Abstract: A heat sink embodiment has at least one anti-rocking tab that extends outwardly and downwardly from an edge of the body portion of the heat sink. A leading lower edge of the anti-rocking tab is above a top surface of the motherboard when the heat sink is being affixed to the motherboard over a flip chip. During installation of the heat sink to the motherboard, a travel distance limit is imposed by the leading lower edge of the anti-rocking tab, thereby limiting a force that is applied to the die of the flip chip so that an edge and/or a corner of the die of the flip chip is not crushed, or such that the die of the flip chip is not cracked.

Abstract: An electronic component includes a component enclosure. At least one subcomponent is positioned within the component enclosure. The at least one subcomponent is configured to be thermally coupled to the component enclosure.

Abstract: A apparatus for controlling heat transfer between portions of a substrate is provided. The apparatus includes a substrate including at least part of a hydraulic circuit, the hydraulic circuit including a plurality of microconduits, the plurality of microconduits including a first microconduit and a second microconduit. The apparatus further includes a liquid metal flowing through the hydraulic circuit and a magnetic field configured to selectively direct the flow of the liquid metal between the plurality of microconduits. The flow of the liquid metal through the hydraulic circuit transfers heat between a first portion of the substrate and the liquid metal.

Abstract: A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.

Abstract: Various methods and systems are provided for a detector head for an imaging system. The detector head comprises a detector module comprising at least one detector element for detecting radiation and detector electronics, and a shaft to which the detector module is coupled, the detector module configured to rotate more than 360 degrees about the shaft in at least one direction.

Abstract: A control system for providing thermal management of electronic equipment housed in a cabinet enclosure. The system can include a plurality of sensors in proximity to the cabinet enclosure for monitoring a temperature, a pressure and a humidity associated with the electronic equipment; and a controller in communication with the sensors for receiving data from the sensors, where the controller adjusts the temperature, the pressure and the humidity associated with the electronic equipment.

Abstract: A data center cooling system includes a cooling liquid supply conduit fluidly coupled between a cooling plant and an air-to-liquid heat exchanger positioned to receive a heated airflow from one or more racks. At least one rack supports a plurality of heat-generating electronic devices. The system further includes a cooling liquid return conduit fluidly coupled between the cooling plant and the air-to-liquid heat exchanger; and a heat transfer module thermally coupled to the cooling liquid supply and return conduits between the cooling plant and the air-to-liquid heat exchanger. The heat transfer module includes a cold side and a warm side, with the cold side thermally coupled to the cooling liquid supply conduit to transfer heat from a flow of a cooling liquid in the cooling liquid supply conduit to the warm side of the heat transfer module, and the warm side including a heat sink.

Abstract: A power converter is provided. The power converter includes a heat sink provided with a holding unit, a plurality of semiconductor devices disposed on the heat sink, and a fixing assembly pressing each of the semiconductor devices toward the heat sink to fix the semiconductor device. The fixing assembly includes a lower push unit disposed on the semiconductor device, and an upper push unit disposed on the lower push unit to press the lower push unit downward, the upper push unit being coupled to the holding unit. The upper push unit includes a central bent part that partially protrudes downward, an insertion part disposed on each of both ends of the central bent part in a left/right direction, the insertion part having a left/right distance therebetween that gradually increases upward, and a fixing bar inserted into the insertion part.

Abstract: A holder for a noise current absorber in one aspect of the invention comprises a pair of accommodating portions, and one or more pairs of an engaging portion and an engaged portion. The accommodating portion accommodates a magnetic body. The engaging portion and the engaged portion are engaged with each other and maintain a state that a pair of the magnetic bodies exhibits a cylindrical shape or an annular shape. The engaging portion and the engaged portion form a through hole that penetrates in an insertion direction of the engaging portion. When at least one of the engaging portion and the engaged portion is elastically deformed by using a jig inserted in the through hole, engagement between the engaging portion and the engaged portion is released.

Abstract: A transparent electromagnetic interference shield includes a first transparent substrate and an electromagnetic interference shielding layer. The electromagnetic interference shielding layer includes a transparent conductive polymer film which is formed on the first transparent substrate, and a plurality of metallic warp and weft lines which are laid on the transparent conductive polymer film. The warp lines and the weft lines cross one another.

Abstract: An electro-optic display is produced using a sub-assembly comprising a front sheet, an electro-optic medium; and an adhesive layer. An aperture is formed through the adhesive layer where the adhesive layer is not covered by the electro-optic medium, and the sub-assembly is adhered to a backplane having a co-operating member with the aperture engaged with a co-operating member, thus locating the sub-assembly relative to the backplane. In another form of electro-optic display, a chip extends through an aperture in the electro-optic medium and adhesive layer. In a third form, the aforementioned sub-assembly is secured to a backplane and then a cut is made through both backplane and sub-assembly to provide an aligned edge.