Abstract: An apparatus for process automation for use in an area where there is a risk of explosion and in which dusts may occur, including a wall structure serving as a housing of the apparatus and having a first wall structure section defining a first housing inner area and a second wall structure section defining a second housing inner area separated from the first housing inner area, wherein a first circuit arrangement is arranged in the first housing inner area and the first housing inner area is dust-tightly enclosed by the first wall structure section so that the dusts cannot penetrate into the first housing inner area and the explosion safety of the first housing inner area is ensured by the dust-tight enclosure, one or more electrical circuits being arranged in the second housing inner area and all the electrical circuits arranged in the second inner area forming an altogether intrinsically safe second circuit arrangement.

Abstract: Provided is an electronic device including a housing, a plate coupled to one surface of the housing, and an adhesive member at least partially disposed in a coupling portion between the housing and the plate and including a plurality of layers. The adhesive member includes at least one waterproof-ventilation layer to perform a ventilation function and a waterproof function.

Abstract: An outer case includes an upper case, a lower case, and a plurality of guiding structures. The lower case includes a bottom wall defining a plurality of through holes. The guiding structures are arranged on the bottom wall. Each of the guiding structures includes a first guiding plate and a second guiding plate, the first guiding plate includes a first connecting part and a first blocking part connected with the first connecting part, the second guiding plate includes a second connecting part and a second blocking part connected with the second connecting part, the first connecting part and the second connecting part face each other. The first blocking part is suspended on the bottom wall through the first connecting part, the second blocking part is suspended on the bottom wall through the second connecting part, the first blocking part and the second blocking part are staggered.

Abstract: A foldable display device comprises a flexible display panel, a first bottom shell, a second bottom shell, a lifting mechanism, and a transmission mechanism. The flexible display panel comprises a first display area, a second display area, and a foldable display area between the first display area and the second display area. The first bottom shell, the second bottom shell, and the transmission mechanism are respectively disposed below the first display area, the second display area, and the foldable display area. The transmission mechanism is rotatably connected to the lifting mechanism and is configured to make a support member of the lifting mechanism to provide support for the foldable display area when the foldable display device is in an unfolded state. This prevents the foldable display area from collapsing due to finger pressing, or wrinkling and peeling due to bending.

Abstract: A hinge structure includes housing and at least one first hinge, the first hinge includes trajectory limiting mechanism including first hinge bracket connected to the housing, first slider including first hollow chute, and second slider including second hollow chute; and synchronization mechanism including cylindrical gear set, first guide gear, and second guide gear, first guide gear and second guide gear including gear end and guide end respectively, the gear end of first guide gear engaging with end gear of the cylindrical gear set, the gear end of second guide gear engaging with another end gear of the cylindrical gear set, the guide end of first guide gear being in sliding fit with first hollow chute, and the guide end of the second guide gear being in sliding fit with second hollow chute, to drive the first and second sliders respectively to rotate with respect to first hinge bracket.

Abstract: A display device is disclosed and includes: a first back housing, wherein the first back housing includes a first rotating shaft and a second rotating shaft; a middle frame, wherein the middle frame includes a first middle frame connected to the first back housing by the first rotating shaft, a second middle frame connected to the first back housing by the second rotating shaft, and a plurality of sliding components disposed on lateral sides of the first middle frame and the second middle frame; a supporting plate, wherein the supporting plate includes a first supporting plate, a second supporting plate, a third supporting plate, and a fourth supporting plate which are connected to the sliding components; and a first display screen, wherein the first display screen is attached to the first supporting plate and the fourth supporting plate.

Abstract: A portable electronic device is provided. The portable electronic device includes a first housing including a first surface and a second surface a second housing including a third surface and a fourth surface, and a hinge. The hinge includes a hinge shaft, a sliding device including a portion configured to slide to an inside or an outside of the second housing to be introduced, or slide from the inside or the outside of the second housing in a specific direction to be extracted in correspondence to a hinge operation of the second housing, and a multi-bar disposed between the first surface and the fourth surface and including multi-bar units to be spread or bent in correspondence to a hinge operation of the second housing.

Abstract: A display device including: a display panel; a polarizing member overlapping the display panel; a cover window overlapping the polarizing member; and a window bonding member disposed between the polarizing member and the cover window, wherein a penetration depth of the window bonding member that is measured by an indentation tester is equal to or less than approximately 13 ?m.

Abstract: The present disclosure provides a module including a circuit board, a first component and a second component. The circuit board includes a first side and a second side opposite to each other and includes a first plane and second plane disposed on the first side. A first height difference is formed between the first plane and the second plane. The first component and the second component are disposed on the first plane and the second plane, respectively. The first component and the second component include a first contact surface and a second contact surface, respectively. The first contact surface and the second contact surface are coplanar with a first surface of the module. It benefits to reduce the design complexity of a heat-transfer component, and enhance the heat dissipation capability and the overall power density of the module simultaneously.

Abstract: Ruggedized avionics assemblies for use on kinetically launched space vehicles are disclosed. The avionic assemblies are able to maintain structural integrity and functionality under high acceleration forces generated during kinetic launch, including acceleration forces of >5,000 times Earth's gravity in a single direction of loading. The avionics assembly is ruggedized to withstand this level of acceleration force during launch via a plurality of constraining elements to constrain a plurality of printed circuit boards aligned in parallel to an acceleration vector. Further, a high specific strength and stiffness composition of the plurality of constraining elements aids in supporting the printed circuit boards and preventing them from bending and dislodging electronic components mounted to the printed circuit boards.

Abstract: In an example, a movable lock may include a lock bar and a pivot disposed at a first end of the lock bar. The movable lock may also include a card retainer disposed on the lock bar at a second end of the lock bar, opposite the first end. The card retainer may include a card notch sized to receive an edge of a system card.

Abstract: Electronic device fastening systems that enable one or more electronic devices to be reliably and quickly secured on a host board and electronic systems made of the same. In a specific exemplary embodiment, a retainer clip spans across the width of one or more electronic devices, engages with the board and snaps into place. The clip includes one or retaining posts such that when the clip engages the board, the one or more retaining posts align and engage with a predefined mounting feature of a corresponding one of the one or more electronic devices, thereby securing the electronic device in place to restrict horizontal, lateral, and vertical movement of the electronic device.

Abstract: A modular system for producing an electronic device includes: a housing, which forms an accommodating space; a printed circuit board which is insertable along an insertion direction into the accommodating space of the housing and, in a mounting position, is accommodated in the accommodating space; and a plurality of attachment parts, which are connectable to the printed circuit board and which, when viewed along the insertion direction, each have a division corresponding to a predetermined smallest dividing unit or an integral multiple of the predetermined smallest dividing unit. Each attachment part has a first guide device for guiding on a second guide device of the housing and a combination of attachment parts is connectable to the printed circuit board in a manner arranged next to one another along the insertion direction such that when the printed circuit board is inserted into the accommodating space, the combination is guided.

Abstract: A support assembly includes a first slide rail assembly, a second slide rail assembly, a carried object, a first cable management device and a second cable management device. The first cable management device is mounted to the first slide rail assembly and the second slide rail assembly. The first cable management device includes a first cross bar and a second cross bar movably connected to the first cross bar. The first cross bar is further connected to the first slide rail assembly and the second cross bar is further connected to the first slide rail assembly. The present invention further discloses a cable management kit which includes the first cable management device and the second cable management device.

Abstract: One example of a server enclosure includes a plurality of slots, a first power backplane, and a second power backplane. Each slot includes a first power connector and a second power connector. The first power backplane is electrically coupled to each of the first power connectors. The second power backplane is electrically coupled to each of the second power connectors.

Abstract: A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

Abstract: The invention relates to electrical equipment comprising: a heatsink comprising an internal volume delimited by at least two opposite faces, a busbar, said busbar coming against said two opposite faces of the heatsink in such a way as to be cooled by said heatsink.

Abstract: Disclosed is duct for a scanner for a point of sale terminal. The duct may include a first body portion and a second body portion. The first body portion may have a first edge and a second edge. The second body portion may have a third edge. The second body portion may be connected to the first body portion so as to define a duct cavity. The first edge may define a duct cavity exhaust opening. The second edge and the third edge may define a duct cavity inlet opening.

Abstract: A heat dissipation assembly includes a fan and a heat conduction member connected to the fan. The fan includes an air outlet. An end of the heat conduction member cooperates with the air outlet of the fan and another end of the heat conduction member is provided with a plurality of flow outlets that are grouped into at least two groups facing different directions. Airflow from the air outlet of the fan flows through the heat conduction member and then flows out through the plurality of flow outlets.

Abstract: An information handling resource blank configured to populate a slot of an information handling system in lieu of an information handling resource may include a form factor having at least some features in common with that of the information handling resource and one or more false fans mechanically coupled to the form factor. Each of the one or more false fans may be configured to have a first airflow impedance when airflow through such false fan is below a threshold airflow and have a second airflow impedance when airflow through such false fan is above the threshold airflow.

Abstract: An air filtration panel is used in an information handling system (IHS) rack within a modular data center. The air filtration panel includes an air filter and a filter frame. The filter frame has a lateral width at least as wide as a transverse opening in a four-post rack. The four-post rack has left and right flanges respectively coupled to a pair of posts of the four-post rack. Each of the left and right flanges has vertically aligned holes. The filter frame includes a channel that receives and contains an outer edge of the air filter. The filter frame left and right surfaces each having fastener through-holes spaced to align with and mount to respective holes in the corresponding one of the left and right flanges of the four-post rack.

Abstract: A system for controlling a cooling unit of a transformer, more particularly a traction transformer of a rail vehicle, improves the efficiency and lifespan of the transformer having the cooling unit. The system includes a transformer, a cooling unit configured to cool the transformer, and a control unit configured to control the cooling unit for cooling the transformer. The control unit is configured to control the cooling unit using measurement data representing at least one condition of the system and/or using environmental data in anticipation of a change in the temperature of the transformer based on the utilization of the transformer and/or environmental influences. This prevents the transformer from overheating, thereby increasing the efficiency and lifespan of the transformer. A corresponding method for controlling a system is also provided.

Abstract: A liquid-cooling heat dissipation device includes a water-cooling module, a water-tank module, a power module, a first and a second water-cooling radiators. The water-cooling module includes a base, a plate, an isolating structure and a heat-conducting unit. The isolating structure connects between the base and the plate. The plate, the isolating structure and the base define a first chamber. The isolating structure and the plate define a second and a third chambers. The first, the second and the third chambers are isolated from each other. The heat-conducting unit is partially located within the first chamber and partially exposed from the base. The first and the second water-cooling radiators connect to the plate and communicate between the water-cooling module and the water-tank module. The power module drives a medium to flow between the water-cooling module and the water-tank module through the first and the second water-cooling radiators.

Abstract: The present invention belongs to the technical field of liquid-cooling heat dissipation, wherein discloses a novel mechanical pump liquid-cooling heat dissipation system, comprising an external radiator, a circulating pipe and a mechanical pump, wherein the circulating pipe communicates the external radiator with the circulating pipe to form a circulation loop, the mechanical pump includes a volute in the form of a hollow cylinder, a fixing surface is formed at one end of the volute, the fixing surface is planar and is part of the outer surface of the volute, a layer of heat-conducting silicone grease is coated on the fixing surface, the fixing surface and a heat source are fixed through pressure lamination, and the heat-conducting silicone grease is attached to the fixing surface and the heat source; and the mechanical pump takes away heat of the heat source and transfers it to a cooling working medium while pumping the cooling working medium to circulate in the circulation loop.

Abstract: A module including a cooling unit that cools a heat-generating component provided on a substrate; a connection pipe that is connected to the cooling unit; and a fixation portion that is provided at a position at which stress from the connection pipe to the cooling unit is reduced, and that fixes the connection pipe.

Abstract: A cooling system including a cooling unit that cools a heat-generating component; a supply connection tube that is connected to the cooling unit and that supplies a cooling medium to the cooling unit; and a discharge connection tube that is connected to the cooling unit and that discharges the cooling medium from the cooling unit, wherein the supply connection tube and the discharge connection tube have different lengths.

Abstract: The invention belongs to the technical field of water cooling radiators, and relates to a water cooling head, a water cooling radiator and an electronic equipment. The water cooling head includes a center module, a first water pump, a second water pump, and a heat exchange module. The center module is provided with a first water inlet channel, a second water inlet channel, a first water outlet channel, a second water outlet channel, a water inlet and a water outlet. The first water cavity is enclosed between the first water pump and the center module, and a second water cavity is enclosed between the second water pump and the center module, and a third water cavity is enclosed between the heat exchange module and the center module. The heat exchanging module is used for heat exchanging of the cooling liquid flowing through the third water cavity.

Abstract: Embodiments include semiconductor packages. A semiconductor package includes dies on a package substrate, an integrated heat spreader (IHS) with a lid and sidewalls over the dies and package substrate, and a heatsink and a thermal interface material respectively on the IHS. The semiconductor package includes a vapor chamber defined by a surface of the package substrate and surfaces of the lid and sidewalls, and a wick layer in the vapor chamber. The wick layer is on the dies, package substrate, and IHS, where the vapor chamber has a vapor space defined by surfaces of the wick layer and lid of the IHS. The sidewalls are coupled to the package substrate with a sealant that hermetically seals the vapor chamber with the surfaces of the package substrate and the sidewalls and lid. The wick layer has a uniform or non-uniform thickness, and has porous materials including metals, powders, or graphite.

Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.

Abstract: A heat dissipation assembly includes a bottom plate, an outer cover, a heat guiding base, a flow-acceleration unit and two side cover sets. The bottom loads a heat-generating source. The outer cover includes a cover body and two slots. The cover body covers the bottom plate to define an accommodation space therebetween, and the slots are oppositely formed on the cover body and connected to the accommodation space. The heat guiding base thermally contacts the heat-generating source and the cover body, and is formed with voids arranged alongside, each of the voids is communication with the slots respectively. The side cover sets are disposed within the slots, respectively, and detachably connected to the cover body and the heat guiding base. The flow-acceleration unit is disposed in one of the side cover sets to lead a fluid to the other through the voids.

Abstract: A Distribution Point Unit (DPU) (10) having improved thermal management and electrical isolation, wherein a first mechanical fastener (200) engages with a first heat sink (50) and is configured to draw the first heat sink (50) towards the interior surface of a housing (31) in response to tightening of the first mechanical fastener (200) such that the first heat sink (50) becomes substantially flush with the interior surface of the housing (31); and wherein a first thermal pad (90) is electrically insulative to electrically isolate the first heat sink (50).

Abstract: An assembly includes a lower sub-assembly containing a first fan, a middle sub-assembly supported above the lower sub-assembly, a bottom air flow control plane supported in the middle sub-assembly and having openings sized to fit multiple computers having vertical cooling air paths, and a top air flow control plane supported in the middle sub-assembly above the bottom air flow control plane and having openings sized to fit the multiple computers such that air is forced through the vertical cooling air paths.

Abstract: The invention relates to an equipment cabinet for receiving information-technology (IT) and communication-technology components which generate waste heat during operation. Here, the IT and communication-technology components draw in cooling air from the front side of the equipment cabinet for cooling and discharge this air into a hot-air region after having been heated. The air is guided out of the hot-air region and cooled by a cooling device comprising fans. Furthermore, sensors are provided for determining the pressure differential between the pressure in the hot-air region and in the surroundings of the equipment cabinet. In addition, a method is described for regulating a cooling device in an equipment cabinet of this kind.

Abstract: A fluid cooling system for an electronics package having a chassis is disclosed. The system includes an electronics package housed within a chassis, one or more mounting structures attached to the chassis, and a fluid cooling module interfaced with one or more electronics of the electronics package, the fluid cooling module housed within the chassis and mounted to the one or more mounting structures, where circulation of a fluid of the fluid cooling module cools the one or more electronics. A chassis fluid distribution manifold is used to connect with the chassis fluid inlet and outlet and to distribute fluid within the chassis.

Abstract: A module including a substrate; a cooling unit that cools a heat-generating component provided on the substrate; a connection terminal portion provided on the substrate; and a connection pipe that is connected to the cooling unit and that extends in a direction different from a direction of at least one of insertion and withdrawal of the connection terminal portion, wherein the connection pipe extends from a side towards the connection terminal portion.

Abstract: A disclosed example includes: a resource utilization analyzer to determine 1) first workloads of a first workload type deployed in a first server room in a data center, and 2) second workloads of a second workload type deployed in the first server room; a workload authorizer to determine that first virtual machines executing the first workloads and second virtual machines executing the second workloads cause a first server rack to generate an amount of heat; and a migrator to migrate the first virtual machines from the first server rack of the first server room to a second server rack of a second server room in the data center to reduce a temperature in the first server room based on the amount of heat, the migrator to migrate the first virtual machines to the second server rack without migrating the second virtual machines to the second server rack.

Abstract: The present disclosure relates to a cooling system for cooling an electronic component, the cooling system comprising a heat sink with a cooling channel for guiding a liquid. The heat sink comprises an external surface comprising at least one opening which partially exposes the cooling channel. The electronic component is mounted to the external surface such that the electronic component covers the opening. A sealing material is arranged between the electronic component and the external surface for at least partially sealing the electronic component against the liquid. The present disclosure further relates to a method for assembling a cooling system, the method comprising: forming at least one opening through an external surface of a heat sink; dispensing a sealing material in a liquid state over the external surface around the at least one opening for forming a molding; and pressing the electronic component onto the molding.

Abstract: Presented are electronic power module assemblies with direct-cooling vapor chamber systems, methods for making/using such power module assemblies, and vehicles equipped with such power module assemblies. A power module assembly includes an outer housing with an internal coolant chamber that circulates therethrough a coolant fluid. A power semiconductor switching device is mounted to the module's housing, separated from the coolant chamber and isolated from the coolant fluid. The power device selectively modifies electric current transmitted between a power source and an electrical load. A two-phase, heat-spreading vapor chamber device includes an outer casing with a casing segment that is mounted to the module housing, fluidly sealed to the internal coolant chamber and exposed to the coolant fluid.

Abstract: The present disclosure provides a frequency converter. The frequency converter includes a box body and a bottom box. A bottom portion of the box body is fixedly connected with a top portion of the bottom box. A top portion of a left side of the box body and a bottom portion of the left side of the box body are fixedly connected to a respective fan. A top portion of a left side of an inner wall of the box body and a top portion of the left side of the inner wall of the box body are fixedly connected to a respective annular plate. One end of an output shaft of each fan is fixedly connected to a rotating rod. One end of each rotating rod away from the fan passes through the box body and extends to an interior of the box body.

Abstract: An electronic assembly includes a PCB disposed on an end-face of a motor proximate to a first surface thereof and a thermal management assembly (TMA) thermally connected to the PCB. One or more switching semiconductor devices are disposed on the first surface. The TMA includes a cooling jacket disposed around a circumference of the motor, at least one jacket manifold formed through the cooling jacket, a thermal compensation base layer thermally coupled to the cooling jacket and the one or more switching semiconductor devices, and a cooling manifold disposed through the PCB to form a fluid flow path therethrough. The at least one jacket manifold has a fluid inlet and a fluid outlet. Two or more electrically insulated posts, each having a cooling channel, are disposed between the at least one jacket manifold and the cooling manifold and form a fluid circuit between the fluid inlet and the fluid outlet.

Abstract: The present invention relates to an induction charging device (1) for a vehicle charging system (2) and to a method for limiting the thermal loading of a magnetic field conductor (3) of such an induction charging device (1). The present invention is based on the general idea of suppressing or at least reducing an impermissible thermal loading of the magnetic field conductor (3), in particular the development of impermissible temperature gradients in the magnetic field conductor (3).

Abstract: The present disclosure provides a display apparatus. The display apparatus includes a display module including a display panel and a guide plate, a flexible printed circuit board extending from the display panel, a source printed circuit board connected to the flexible printed circuit board and attached to the guide plate, at least one driving chip disposed on the source printed circuit board, and a protective member disposed to cover the flexible printed circuit board, the source printed circuit board, and the driving chip.

Abstract: The present invention relates to an enclosure and method of manufacture of an enclosure arranged to define a cavity for electromagnetic shielding of equipment to be housed within the cavity, the enclosure comprising: an aperture (16) arranged to allow access to the enclosure; a conductive membrane (18) arranged to close the aperture; and a waveguide element (20) arranged between the conductive membrane (18) and the cavity; wherein the waveguide element (20) and conductive membrane (18) are configured to attenuate electromagnetic radiation originating from the equipment to be housed within the enclosure (10) thereby to inhibit the transmission of electromagnetic radiation from the enclosure via the aperture (16).

Abstract: The present disclosure is drawn to an electronic device including a substrate, an electronic component carried by the substrate, an EMI protection film over-molded on the electronic component, and an adhesive layer directly adhering the EMI protection film to the electronic component. The EMI protection film includes a ferromagnetic material.

Abstract: A holder including syringe configured to move up and down as the lifting and lowering section moves up and down, a first displacement portion configured to move up and down with respect to the syringe and to which the component holding section is attached, and a second displacement portion provided separately from the first displacement portion and configured to move up and down with respect to the syringe and the first displacement portion. The second displacement portion includes an engaging portion configured to engage the first displacement portion urged downward by the first urging portion in a vertical direction, and a target detection portion coupled to the engaging portion and positioned above the syringe. The contact determination section determines that an electronic component has contacted the circuit board when displacement of the target detection portion is detected with the sensor.

Abstract: The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.

Abstract: An automatic exchanging device for moving in an arrangement direction of multiple component mounting machines alongside the front face of a component mounting line to set feeders to and/or remove feeders from a feeder setting base of each component mounting machine, and a control device for controlling the movement of the automatic exchanging device. The control device monitors the operational states of the multiple component mounting machines and, when an error requiring the work of the operator occurs in any one of the component mounting machines, sets a predetermined range including the component mounting machine to a movement prohibited area of the automatic exchanging device to move the automatic exchanging device out of the movement prohibited area until it is determined that the work is completed.

Abstract: A mounting device comprises: a mounting head having multiple pickup members configured to pick up components; a mounting control section configured to cause a second component to be picked up later when a first component, held by the mounting head at a predetermined height, and the second component, held by the mounting head at a lowered position lower than the predetermined height, are picked up with the mounting head; the mounting control section being configured to cause the second component to be released earlier when the mounting head, having picked up the first component and the second component, releases a component.

Abstract: Description and specifications of a new and distinct cultivar of blackberry plant named ‘A-2491T’ that resulted from a hand-pollinated cross of ‘APF-46’ (non-patented, unreleased genotype)בNatchez’ (U.S. Plant Pat. No. 20,891). This new cultivar of blackberry plant can be distinguished by its large berries with very good sub-acid fruit flavor, overall high fruit quality with excellent postharvest fruit-handling potential, early season ripening, consistent high yields, and excellent plant health.

Abstract: Description and specifications of a new and distinct cultivar of blackberry plant named ‘Caddo’ which originated from seed produced by a hand-pollinated cross of ‘APF-45’ (U.S. Plant Pat. No. 22,449) x Ark. ‘2108T’ (non-patented, unreleased genotype). This new cultivar of blackberry plant can be distinguished by its large berries with very good fruit flavor, overall high fruit quality with excellent postharvest fruit-handling potential, early season ripening, consistent high yields, and excellent plant health.