Abstract: According to certain embodiments, an electronic device comprises: a housing including a first support member; a cover member coupled with and facing the first support member; a second support member coupled with and facing the first support member; a printed circuit board assembly disposed to face the first support member, the printed circuit board assembly having a part disposed between the first support member and the cover member and another part disposed between the first support member and the second support member; wherein the printed circuit board assembly comprises: a first circuit board including a first part disposed between the first support member and the cover member, and a second part disposed between the first support member and the second support member; a second circuit board disposed to at least partially face the first part and disposed between the first circuit board and the cover member; and an interposer board disposed to correspond to at least a part of an edge of the second circuit boa

Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<1/2×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.

Abstract: An optical transceiver includes a housing, a mother board, an optical communication module and a daughter board. The mother board is accommodated in the housing. The optical communication module is disposed on a top surface of the mother board, and the optical communication module includes a first electrical interface. The daughter board is disposed on the top surface of the mother board, and the daughter board includes a second electrical interface electrically connected with the first electrical interface. The optical communication module is disposed on a flat region of the top surface of the mother board.

Abstract: Embodiments may include inductors with embedded magnetic cores and methods of making such inductors. In an embodiment, an integrated circuit package may include an integrated circuit die with a multi-phase voltage regulator electrically coupled to the integrated circuit die. In such embodiments, the multi-phase voltage regulator may include a substrate core and a plurality of inductors. The inductors may include a conductive through-hole disposed through the substrate core and a plugging layer comprising a dielectric material surrounding the conductive through-hole. In an embodiment, a magnetic sheath is formed around the plugging layer. In an embodiment, the magnetic sheath is separated from the plated through hole by the plugging layer. Additionally, a first layer comprising a dielectric material may be disposed over a first surface of the magnetic sheath, and a second layer comprising a dielectric material may be disposed over a second surface of the magnetic sheath.

Abstract: One aspect of the invention provides an interconnect between a stretchable electronic element and a circuit on a rigid or flexible printed circuit board (PCB Circuit), the stretchable electronic element is operable to be mechanically coupled to a substrate which deforms, and the stretchable electronic element will deform with the substrate and may or may not change an electrical characteristic as a result, the stretchable electronic element comprising one or more electrical pathways; the PCB Circuit configured to communicate electronically with the stretchable electronic element and comprising at least one circuit board extending from the stretchable electronic element to an electrical circuit on the PCB Circuit; wherein the interconnect comprises an electrical coupling between the electrical pathways of the stretchable electronic element and the PCB Circuit; and wherein the interconnect simultaneously prevents the connection between the stretchable electronic element from failing when the stretchable substra

Abstract: A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.

Abstract: The present invention relates to continuous etching system for copper etching in manufacturing of Printed Circuit Boards (PCB). The present invention more particularly relates to continuous etching system provides zero undercut, zero residue copper and non-corrosive surfaces on PCB with environmentally safe and efficient manner. The present invention provides continuous copper etching system in manufacturing of PCBs without pump or any machine force for flowing of etchant.

Abstract: A method of fabricating a circuit board includes forming a conductive layer on a surface of a substrate, and patterning the conductive layer to define a plurality of plating regions and a plurality of plating lines. The plating regions have at least two different sizes, a first group of the plating regions are interconnected by a first plating line of the plating lines, and a second group of the plating regions are interconnected by a second plating line of the plating lines. A ratio of a total area of the first group of the plating regions to a total area of the second group of the plating regions is from about 1 to about 5. A solder mask is formed on the surface of the substrate to cover the plating lines and partially expose the plating regions. At least one metal layer is electroplated on the exposed plating regions.

Abstract: Glass ceramic components for electronic devices are disclosed, as are components including a glass ceramic material. A cover member including a glass ceramic material may be positioned over one or more device components such as an optical module or a component of a wireless communication or charging system. The cover member may have optical properties, electrical properties, magnetic properties, and/or mechanical properties compatible with the requirements of the one or more device components.

Abstract: Present invention refers to a motorized mechanism, for control panel which allows said control panel to move from a working position to a resting position, such that a fixed frame is found static and coupled to a household appliance such as a stove or an oven, while a mobile frame partially protrudes from said fixed frame to allow for a better view of said control panel.

Abstract: The present disclosure relates to an inverter module which can be coupled to another inverter module, the inverter module comprising: a main PCB having a main substrate on which a plurality of circuits are printed; a plurality of sub-PCBs coupled to the main PCB and each having one end exposed through the main PCB; and a case for receiving the main PCB and the sub-PCBs, wherein when the inverter module is coupled to another inverter module, the ends of the sub-PCBs exposed to the outside of the case are coupled to the another adjacent inverter module. According to the present disclosure, a plurality of inverter modules can be connected and used as one inverter system, and thus an inverter system having a required capacity can be easily implemented.

Abstract: A protection device for an electrical cabinet is divided into a plurality of compartments, the protection device including a rain guard and an air manifold formed as an integral unit. The rain guard is designed to cover a section of an electrical cabinet and thus prevent water from falling on it. The air manifold includes at least one first pipe fluidically connected to a second pipe. Each first pipe intended to be connected to a corresponding air-circulation opening of a compartment, and the second pipe being intended to be connected to an air-circulation means in order thus to allow air to be circulated in the plurality of compartments. A cabinet is provided with such a protection device.

Abstract: Electronic devices and accessory devices designed for communication with electronic devices are disclosed. An accessory device suitable for use with an electronic device can receive the electronic device. Subject to authentication, the electronic device can read information stored on the accessory device through respective wireless communication circuitry of the electronic device and the accessory device. For example, the accessory device can store information related to the material makeup of the accessory device, dimensional information of the accessory device, and other integrated features. This information can be read and received by the electronic device. As a result, the electronic device can adjust a control system (that regulates thermal energy generation) by increasing a set point temperature that allows one or more processors to operate in a manner consistent with additional thermal energy generation.

Abstract: Provided is an anti-collision device for LED screen, comprising a box body (1), a telescopic rotating mechanism, an anti-collision sheet (4) and a display module (2); the peripheral side of the box body (1) is provided with a mounting hole (12) and a receiving groove (11); the telescopic rotating mechanism is embedded in the mounting hole (12) and movably connected with the box body (1); the anti-collision sheet (4) is fixedly connected with the telescopic rotating mechanism. When the telescopic rotating mechanism is not subjected to external force, the telescopic rotating mechanism enables the anti-collision sheet (4) to shield the peripheral side of the display module (2) outside the receiving groove (11); when the telescopic rotating mechanism is subjected to external force, the telescopic rotating mechanism drives the anti-collision sheet (4) to retract and rotate to be embedded in the receiving groove (11).

Abstract: An electronic device is provided.

Abstract: An electronic device is provided.

Abstract: A deformable display device and a deformation control method therefor are provided. The deformable display device includes a flexible display screen and a deformation control structure configured to drive the flexible display screen to deform. The deformable display device has a first mode and a second mode. A first distance between a first point of the flexible display screen and a reference point in the first mode is not equal to a second distance between the first point and the reference point in the second mode. The reference point is a point on the deformation control structure. A position of the reference point remains unchanged when the deformable display device is switched from the first mode to the second mode. A display surface, on which the first point is located, of the flexible display screen intersects a line connecting the first point with the reference point.

Abstract: A display device includes a head including a display panel, a stand supporting the head, and a moving assembly coupled to the head and to the stand, the moving assembly including a rotational assembly for rotating the head and a tilt assembly for allowing the head to be inclined, the rotational assembly includes a base and a rotating plate rotatably disposed at the base, the tilt assembly includes a holder fixed to the stand, a rotating body coupled to the base and rotatably coupled to the holder, the rotating body having a rotational axis intersecting a rotational axis of the rotating plate, and an elastic member disposed between the holder and the rotating body, wherein a first end of the elastic member is coupled to the holder, and wherein the rotating body is supported by the elastic member at a position adjacent to a second end of the elastic member.

Abstract: A media device may include (i) a display device having a front side including a display surface, (ii) a support housing for supporting the display device in each of a plurality of alternative orientations on an external surface, the support housing extending from a back side of the display device between a mounting surface of the support housing abutting the back side of the display device and a distal end of the support housing, (iii) a coupling member disposed at the mounting surface of the support housing and mounted to the display device, and (iv) a battery power supply disposed within the support housing and electrically coupled to the display device via an electrical path extending through the coupling member. Various other systems, devices, assemblies, and methods are also disclosed.

Abstract: Disclosed is a method of manufacturing an antibacterial cover window. The method includes a first step of preparing a substrate, a second step of forming a mask pattern on the substrate through a patterning process, a third step of forming an antibacterial layer on the substrate on which the mask pattern is formed, and a fourth step of removing the mask pattern to obtain an antibacterial pattern formed on the substrate. Through the method, it is possible to produce a cover window with antibacterial patterns regularly and uniformly distributed over the entire area thereof. Thus, the cover window has long-lasting excellent antibacterial property over the entire area thereof.

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Abstract: A storage device assembly is provided. The storage device assembly includes a latch assembly having a body and a hook mounted on the body, the hook having elasticity and having distal ends thereof bend away from the body; and a storage device to be joined to the latch assembly. The storage device includes a memory module including a memory connector, and a first enclosure and a second enclosure that encase the memory module except for an opening through which the memory connector is accessible. The first enclosure includes fixing holes corresponding to the distal ends of the hook and configured to accommodate the distal ends of the hook in a configuration in which the storage device is joined to the latch assembly.

Abstract: An electronic component connector cooling device can include a base portion and a conduit portion extending from the base portion. The conduit portion can have a cooling channel. The electronic component connector cooling device can further include a housing coupling interface formed in the base portion and operable to facilitate coupling the electronic component connector cooling device to a housing that at least partially forms an enclosure about an electronic component. The electronic component connector cooling device can also include a connector coupling interface formed in the base portion and operable to facilitate coupling a connector to the electronic component connector cooling device. The connector can operably connect the electronic component to a component external to the enclosure. The electronic component connector cooling device can further include an inlet port formed in the conduit portion and in fluid communication with the cooling channel.

Abstract: A system and method for generating a heat sink for circuitry, such as a power module, that facilitates removal of heat from the circuitry. To improve power density of power modules, not only electrical but also thermal optimization may be carried out as the two subsystems closely interact with each other.

Abstract: A system includes a first slice and a second slice coupled to each other. Each slice includes a housing formed of an electrically-insulative material, a ceramic plate disposed at each end of the housing, and an end plate disposed over each of the ceramic plates. Each end plate is formed of a thermally-conductive material. The system also includes a backplane assembly coupled to the first slice and the second slice.

Abstract: A riser of an information handling system having an adjustable baffle that blocks air flowing through the riser from by-passing components of an expansion card, such as a PCIe card, installed in the riser. The baffle directs the flowing air across components of the expansion card to lower the operating temperature of the expansion card by convection. In some embodiments, part of the baffle is coupled to an angled slot of the riser body and another part of the baffle is coupled to a card holder so that movement of the card holder automatically adjusts the position of the baffle to direct otherwise by-passing air toward the components of the installed expansion card.

Abstract: Embodiments disclosed herein include heatsinks with transpiration cooling features. In an embodiment, a heatsink comprises a body with a first surface, a second surface, and a sidewall surface connecting the first surface to the second surface. In an embodiment, a first hole is formed into the first surface, where the first hole terminates before reaching the second surface. In an embodiment, the heatsink further comprises a second hole into the sidewall surface, where the second hole intersects the first hole.

Abstract: An industrial automation controller includes a housing with a forced convection chamber. First and second fans are releasably connected to the housing and are adapted to induce airflow through the forced convection chamber. The first and second fans are each connected to the housing by respective first and second latch systems that each include a primary latch and a secondary latch. The secondary latch imposes a time delay during removal and replacement of a fan to facilitate hot swapping of the fan with a replacement fan. A make-last/break-first contact system is provided for each fan such that the fan is shutdown in a controlled manner prior to removal of the fan from the housing. The controller monitors internal temperature and fan speed. The controller initiates, logs, and reports fault conditions based upon the monitored temperature and/or fan speed. The controller is shut down if the monitored temperature exceeds a select temperature level.

Abstract: An apparatus is described. The apparatus includes a particle collector to collect particles from an electrically insulating liquid that one or more electronic devices are to be immersed within. The particle collector having an input port to receive the electrically insulating liquid. The particle collector having an output port to emit the electrically insulating liquid. The particle collector having one or more phoretic force devices. The phoretic force devices to induce phoretic forces within the particle collector that cause the particles to collect within the particle collector. A structure is also described. The structure is to be immersed in electrically insulating liquid and mimic a boiling enhancement layer of a cooling assembly of a chip package disposed on an electronic circuit board that is also immersed in the electrically insulating liquid.

Abstract: A single-phase liquid-cooled cold plate for thermal management of heat dissipating electronic devices or assemblies. Within the cold plate are non-uniform nozzle arrangements that produce spatially-varying heat transfer to mitigate device hot spots. The cold plate is comprised of thermally-conductive and thermally-insulating materials to enhance heat transfer while suppressing parasitic losses within the cold plate.

Abstract: A thermal management system to cool one or more battery packs of a battery system may include a heat pipe arrangement that includes a plurality of heat pipes, having a planar configuration, in thermal contact with the one or more battery packs to draw heat therefrom, and a heat sink arrangement that includes a plurality of heat sinks, in thermal contact with two or more edges of the heat pipe arrangement, to dissipate heat away from the heat pipe arrangement.

Abstract: An electronic apparatus includes a flow rate control circuit that controls a plurality of flow rate adjusting mechanisms, based on desired flow rates of the coolant for a plurality of electronic circuits and information that indicates relationships between pressure losses and flow rates in a plurality of routes that include internal flow passages of the plurality of electronic circuits, a plurality of distribution pipes, a plurality of discharge pipes, and the plurality of flow rate adjusting mechanisms and in which the coolant flows between the first pipe and the second pipe.

Abstract: A cooling device includes a thermal conductor and a cooler. The thermal conductor includes a working medium, a wick, and a metallic housing. The housing includes an internal space to accommodate the working medium and the wick. The cooler includes an internal flow path through which a fluid can flow, and is connected to an end portion of the thermal conductor.

Abstract: Systems and methods for cooling a computer environment are disclosed. In at least one embodiment, a cooling assembly can be used to monitor and control fluid quality associated with one or more servers.

Abstract: A system includes a metering device to receive first electrical energy from a power source and provide at least a portion of the first electrical energy to a data center during a first time period. The system also includes an electrical-to-mechanical energy conversion device to convert air to a compressed or liquified state using at least the portion of the first electrical energy. The system also includes a storage container to receive the air and store the air in the compressed or liquified state. The system also includes a mechanical-to-electrical energy conversion device to: receive the air from the storage container in a gaseous, compressed state; generate second electrical energy for powering the data center; and exhaust cooled air for providing to the data center to cool the electronic devices.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an integrated power and coolant distribution unit (PCDU) comprises control logic to cause at least one power controller to provide a power response or to cause at least one flow controller to provide a coolant response from the PCDU upon a determined change in a power state or coolant state.

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package having a semiconductor chip therein. The semiconductor chip package to communicate a temperature of the semiconductor chip. The apparatus includes a heat sink that is thermally coupled to the semiconductor chip package. The heat sink has fins. The apparatus includes a fan. The apparatus includes a temperature sensing device. The temperature sensing device is to sense a temperature of an ambient before the ambient is warmed by the fins. A rotational speed of the fan is to be determined from the temperature of the semiconductor chip and the temperature of the ambient.

Abstract: Embodiments of this application disclose a heat dissipating element control method, including: obtaining a status parameter set and a detected temperature of a first device, where the status parameter set is associated with a running temperature of the first device; determining values of a first temperature parameter and a second temperature parameter in a target adjustment function based on the status parameter set; and determining the heat dissipating efficiency of the heat dissipating element based on the values of the first temperature parameter and the second temperature parameter and the detected temperature, and controlling running of the heat dissipating element. This resolves a problem that the heat dissipating efficiency is not adjusted in time because the detected temperature is unable to reflect an actual temperature in real time.

Abstract: A system for reducing a specific absorption rate includes a source field generation unit wound with a first cylindrical coil and accommodating a source material therein, and generating a source field by applying a periodic input signal to the first cylindrical coil; a physical property change unit wound with a second cylindrical coil disposed adjacent to the first cylindrical coil and accommodating a transfer target therein, and changing a physical property of the transfer target based on the generated source field; and a target field circuit unit controlling the transfer target to form a target field by a PCB substrate with a power supply interface connected to a power supply and an input of the power supply.

Abstract: An apparatus, system and method for placing components on a circuit board by a pick and place machine. The apparatus, system and method may include a rotational table suitable to receive and hold the circuit board for the pick and place machine; at least one sensor capable of sensing an off-center fiducial on the circuit board after association with the rotational table; and at least one processor connective with at least one computing memory having therein non-transitory computing code.

Abstract: A setup change task setting device includes a number-of-feeders acquisition section configured to acquire the number of feeders required to be replaced in a wheeled table on which multiple feeders supplying components are installed to be replaceable during a setup change in which a board on which the components are mounted is changed from a current board type to a next board type in a component mounter in which the wheeled table is provided to be exchangeable, a task comparing section configured to compare relative merits of multiple types of setup change tasks in the wheeled table provided in the component mounter based on an acquisition result from the number-of-feeders acquisition section, and a task setting section configured to set any of the multiple types of setup change tasks for the wheeled table based on a comparison result from the task comparing section.

Abstract: The new blueberry plant variety ‘FCM14-031’ is provided. ‘FCM14-031’ is a commercial variety intended for the hand harvest fresh market. The new blueberry plant originated from a cross of ‘FL00-180’ (female parent, not patented) and ‘FL01-06’ (male parent, not patented). ‘FCM14-031’ forms round medium vigor bush growth habit, displays well branched habit, produces early to mid-season fruit, and exhibits fruit that is large with a flat bottom and an open upright calyx that has a mildly aromatic flavor that has a balance between sweet and acidity.

Abstract: A new and distinct Asclepias subulata named ‘Butterfly Magic’ is characterized by uniform growth habit and plant form, Slightly thicker stems than typical for the species, improved growth and survival in cultivation, greater stem numerical density, faster growth with ultimately increased plant size and improved cold hardiness and survivability

Abstract: A new and distinct Sansevieria plant having grey leaves with stacked, dark green horizontal lines.

Abstract: A new and distinct Sansevieria plant having leaves with two vertical yellow lines delimited by a green border on the margins and separated in the center by a strip of light greyish green.

Abstract: A new and distinct Sansevieria plant having leaves with a central vertical strip of grey and green, which is defined by a yellow strip on both sides and is in turn delimited by a dark green border with veins in a more intense green color.

Abstract: A new and distinct Sansevieria plant having light grey leaves with stacked, dark green horizontal lines and light yellow parallel lines in the center.

Abstract: A new and distinct Sansevieria plant having leaves with an intense yellow center area, delimited by a dark green border with some irregular grey tones.

Abstract: A new and distinct Sansevieria plant having intense dark green leaves with a vertical striping pattern and no speckling present.

Abstract: A new and distinct Sansevieria plant having leaves with grey-green and green stacked horizontal lines in the central portion and a yellow lateral border on both sides.