Abstract: The invention relates to a production method of the powders composed of spherical heavy metal particles utilizing an ultrasonic atomization, where these powders can be applied in industrial applications, like additive manufacturing and several other.

Abstract: An atomizer nozzle includes: a molten metal nozzle extending in a vertical direction and which allows a molten metal to flow downward from a lower end thereof; and a gas nozzle including a chamber having an inner peripheral surface surrounding an outer periphery of the molten metal nozzle, a blow portion which introduces a gas to the chamber toward a circumferential direction of the molten metal nozzle, and a cover extending from the chamber to a position below the lower end of the molten metal nozzle while surrounding the molten metal nozzle, wherein the cover is provided with a tapered inner peripheral surface connected to the inner peripheral surface of the chamber and of which diameter is decreased as close to a lower end portion of the tapered inner peripheral surface.

Abstract: Disclosed is a silver powder preparation method including a silver salt reduction step. The silver salt reduction step includes a reaction solution preparation step for preparing a first reaction solution and a second reaction solution and a precipitation step for allowing reaction between the first reaction solution and the second reaction solution to precipitate silver particles. The first reaction solution contains silver ions, ammonia, an alkali metal salt of an organic acid, and a phosphorous compound, and the second reaction solution contains a reducing agent. The content of the phosphorous compound and the reaction temperature of the precipitation step are adjusted so that the shrinkage rate of the silver powder is adjusted within a range of 5% to 20% at 500° C. when the reaction temperature is heated to 800° C. at a heating rate of 50° C./min.

Abstract: A cutting tool, including: a base; and a coating disposed on the base, wherein the coating includes a first layer, the first layer is composed of an alternate layer in which a first unit layer and a second unit layer are alternately stacked, the first unit layer has a hexagonal crystal structure, the first unit layer is composed of W(C1-aNa)x, a represents 0.3 or more and 0.8 or less, x represents 0.8 or more and 1.2 or less, the second unit layer is composed of AlcV1-cN, and c represents 0.40 or more and 0.80 or less.

Abstract: Chip discharge during high-feed machining and low-feed machining particularly in a high-depth-of-cut state or the like is improved so as to provide adaptability to a wide range of cutting conditions during low depth and high depth cutting and during low-feed and high-feed machining and allow so-called freedom of feed during cutting to be improved. A cutting insert includes a cutting edge body and a substrate to which the cutting edge body is joined. The cutting edge body has a prismatic shape having a longitudinal direction and a lateral direction perpendicular to the longitudinal direction and includes a cutting edge formed on an intersecting edge between a peripheral side surface and an upper surface of the cutting edge body having the prismatic shape and a recessed part formed at a position on the upper surface of the cutting edge body which is more distant from the intersecting edge than from the cutting edge.

Abstract: According to one implementation, a tool driving device includes a drill chuck, a motor, a casing and a vibrating mechanism. The drill chuck holds a drill. The motor is configured to rotate the drill chuck. The casing houses the motor. The vibrating mechanism is configured to periodically reciprocate the drill chuck relatively to the casing in a tool axis direction during rotation of the drill chuck. The vibrating mechanism is configured to distance the drill chuck from the casing at a first speed smaller than a second speed for bringing the drill chuck close to the casing.

Abstract: The present disclosure provides a deburring apparatus and a deburring method that does not require a positioning engagement part that is engaged with a fixed part of a machine tool. The deburring apparatus (10) includes a housing (1) with a shank (11), a transmission rod (3), a recovery rod (5), a tilting shaft (4), a spring (6), a holder (7), and a rotary-to-rectilinear motion conversion mechanism (9) with a plunger (8). The spring forces the recovery rod toward the tilting shaft. The holder for fixing the cutter (101) is arranged on the tilting shaft in a manner rotatable through a predetermined rotation angle. The rotary-to-rectilinear motion conversion mechanism separates the first flange portion from the second flange portion and brings the plunger into contact with the recovery rod on the tilting axis (43) when the holder rotates in a direction opposite to the rotation direction of the shank (11).

Abstract: A power tool with a rotatable tool designed as a saw blade or a milling cutter, including a sensor device for detecting a mechanical quantity, the mechanical quantity having a force, an acceleration, a velocity, a deflection, a deformation and/or a mechanical stress, and the mechanical quantity being dependent on a force emanating from the tool, and a control device communicatively coupled to the sensor device, which control device is adapted to recognize a kickback event based on the detected mechanical quantity, where the control device is adapted to selectively determine a first recognition function or a second recognition function different from the first recognition function based on a function determination information, and to perform the recognition of the kickback event based on the detected mechanical quantity using the determined recognition function.

Abstract: A laser reflow method includes preparing a workpiece including a board and semiconductor chips each having one or more bumps formed on one surface thereof, the semiconductor chips being placed on the board with the bumps interposed therebetween. An inclination detection step captures an image of one semiconductor chip and detects an inclination of the semiconductor chip within the captured image. A laser beam irradiation step irradiates each semiconductor chip with a laser beam from another surface side opposite to the one surface to reflow the bumps formed within an irradiated range of the workpiece. A phase pattern displayed by a spatial light modulator is rotated in such a manner as to agree with the inclination of the detected semiconductor chip, to thereby rotate an irradiation range of the laser beam within an irradiated surface of the workpiece, before the semiconductor chips are irradiated with the laser beam.

Abstract: A copper-ceramic joint body having high joint strength is provided. The copper-ceramic joint body includes: a copper member made of Cu or Cu alloy; a ceramic member joined to the copper member and made of nitride of Si or Al; and a joint layer formed on joint surfaces of the copper member and the ceramic member, and containing Cu and Mg and further containing at least one type of active metal elements selected from a group of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Ca, Y, Ce, La, Sm, Yb, Nd, Gd and Er, and shear strength of the joint layer is equal to or higher than 10 MPa.

Abstract: The present disclosure provides a system for printing at least a portion of a three-dimensional (3D) object. The system may comprise a source of at least one feedstock, a support for supporting at least a portion of the 3D object, a feeder for directing at least one feedstock from the source towards the support, and a power supply for supplying electrical current. The system may comprise a controller operatively coupled to the power supply. The controller may receive a computational representation of the 3D object. The controller may direct the at least one feedstock through a feeder towards the support and may direct electrical current through the at least one feedstock and into the support. The controller may subject such feedstock to Joule heating such that at least a portion of such feedstock may deposit adjacent to the support, thereby printing the 3D object in accordance with the computational representation.

Abstract: An electrically assisted pressure joining apparatus and an electrically assisted pressure joining method join a first metal member and a second metal member together, and includes an electrode portion, an intermediate portion including a plurality of micropores and inserted between a first metal member and a second metal member, and a pressure portion connected to the electrode portion to receive a current from the electrode portion and transfer the current to the first metal member and the second metal member to apply a pressure to the first metal member such that the first metal member and the second metal member are joined together by the intermediate portion.

Abstract: A method of securing a first component part and a second component part together, the method comprising providing an electrically conductive member between a first surface of the first component part and a facing first surface of the second component part and securing the first and second components together by passing a current through the electrically conductive member. The electrically conductive member may comprise a first portion connectable to a source of current and a second portion electrically connected to the first portion and comprising a plurality of sub-conductive members. The electrically conductive member may be distributed across at least 50% of the surface area of the first surface of the first component part.

Abstract: The invention discloses an arrangement for mechanically and electrically contacting a glow wire of a thermal radiation source, comprising a glow wire made of refractory metal having at least one flat connection surface to be contacted, a contact surface on which the glow wire is contacted, and a contacting means which connects the glow wire to the contact surface. The invention also relates to a method for producing the contact according to the invention.

Abstract: A component of a rotary machine formed from a blank, the component includes a center, a boundary surface, and at least one inner passage extending from the center up to the boundary surface and being at least partly closed. The inner passage is formed by a first subtractive machining in which a part of the passage that at least includes an opening of the passage into the boundary surface as well as a cut-out in the top surface is manufactured by machining production, and subsequently the passage is completed by a build-up production on the blank.

Abstract: A laser processing apparatus and a laser processing method that can effectively prevent a processing time for one semiconductor film from increasing are provided. A laser processing apparatus (1) according to an embodiment includes a laser light source (2) configured to irradiate a semiconductor film (M1) with a laser beam, a film state measuring instrument (5) configured to measure a state of the semiconductor film after the semiconductor film (M1) is irradiated with the laser beam, and a laser light adjusting mechanism configured to adjust a timing at which the semiconductor film (M1) is irradiated with a next laser beam and intensity of the laser beam according to the state of the semiconductor film (M1) measured by the film state measuring instrument (5).

Abstract: A method for processing cardboard includes the steps of irradiating a surface of a cardboard blank with a first laser in order to remove material from the cardboard blank according to a first pattern. The first laser is irradiated with a first laser power and with a laser beam thereof being scanned with a first scanning speed. The first laser power is greater than or equal to 0.5 kW. The first scanning speed is greater than or equal to 2000 mm/s and less than or equal to 25000 mm/s. The method also includes the step of irradiating the surface of the cardboard blank with the first laser in order to remove material from the cardboard blank according to the first pattern and is carried out while the cardboard blank is being conveyed.

Abstract: A rotary laser engraving device for retaining and rotating an object to be engraved is provided and includes a frame, a first support assembly and a second support assembly mounted on the frame. The first support assembly includes a first set of rollers for supporting a first end of the object to be engraved. The second support assembly includes a second set of rollers for supporting a second end of the object to be engraved. The first set of rollers and the second set of rollers are offset diagonally from the frame. At least one longitudinal adjustment mechanism and at least one vertical adjustment mechanism are carried by the frame and allow to adjust the longitudinal and vertical separation, respectively, between the first and second sets of rollers. A motor assembly is provided to rotate one of the first and second sets of rollers to rotate the object to be engraved.

Abstract: A distributor plate for a fluid treatment tank such as a water softener pressure vessel separates the resin bed from a lower end of the resin tank. The outer peripheral surface of the distributor plate is laser-welded to an inner peripheral surface of the tank. The outer peripheral surface of the distributor plate may have a biasing mechanism that biases the outer peripheral surface of the distributor plate against the inner peripheral surface of the tank. The biasing mechanism may include a plurality of peripherally-spaced resilient fingers extending axially and radially away from a circular base of an outer ring of the distributor plate into engagement with the inner peripheral surface of the tank liner, each of the fingers having a base connected to the base of the ring and having a free end. Also disclosed is a method of making a fluid treatment tank.

Abstract: A laser slicing apparatus for dividing a workpiece with a laser beam, including: a light shielding area detection section that detects light shielding areas existing on a side of a first surface of the workpiece; and a control section that radiates a first laser beam from the side of the first surface so as to scan across a whole area of the first surface of the workpiece and form a first modified layer in a to-be-sliced plane inside the workpiece, and that radiates a second laser beam to the light shielding areas of the workpiece from a second surface on an opposite side of the first surface and form a second modified layer in such a manner that the second modified layer is continuous with the first modified layer in the to-be-sliced plane.

Abstract: Irradiation conditions for a laser beam to respective ones of a plurality of regions included in the upper surface of an ingot are set according to the numbers of photons of fluorescence occurring when excitation light is irradiated to the respective regions. Here, it is to be understood that the number of the photons of the fluorescence occurring from a region of an ingot depends on the concentration of an impurity doped in the ingot. A separation layer can therefore be formed at a uniform depth from the upper surface of the ingot even if regions of different impurity concentrations are included in the ingot. It is hence possible to reduce a kerf loss when wafers are sliced from an ingot.

Abstract: A method for processing a micro-channel of a micro-fluidic chip using multi-focus ultrafast laser, in which an array-type multi-focus femtosecond laser is used to perform fractional ablation on the micro-fluidic chip, and then pulse laser is used to perform secondary ablation on the micro-fluidic chip. Ultrasonic-assisted hydrofluoric acid etching is performed on the micro-fluidic chip after ablation to obtain a true three-dimensional micro-channel on the micro-fluidic chip. A device for processing a micro-channel of a micro-fluidic chip using multi-focus ultrafast laser is also provided.

Abstract: A device for soldering, in particular for reflow soldering, of at least one assembly, having a process chamber arrangement, comprises at least two process chambers for preparing a soldering method and/or for carrying out a soldering method and/or for post-processing a soldering method, wherein the at least two process chambers are arranged above one another, in particular in a stack-like manner.

Abstract: There is provided an Al bonding wire which can provide a sufficient bonding reliability of bonded parts of the bonding wire under a high temperature state where a semiconductor device using the Al bonding wire is operated. The bonding wire is composed of Al or Al alloy, and is characterized in that an average crystal grain size in a cross-section of a core wire in a direction perpendicular to a wire axis of the bonding wire is 0.01 to 50 ?m, and when measuring crystal orientations on the cross-section of the core wire in the direction perpendicular to the wire axis of the bonding wire, a crystal orientation <111> angled at 15 degrees or less to a wire longitudinal direction has a proportion of 30 to 90% among crystal orientations in the wire longitudinal direction.

Abstract: A SnAgCuSbBi-based Pb-free solder alloy is disclosed. The disclosed solder alloy is particularly suitable for, but not limited to, producing solder joints, in the form of solder preforms, solder balls, solder powder, or solder paste (a mixture of solder powder and flux), for harsh environment electronics.

Abstract: A welding apparatus includes a welding power source configured to output current between a consumable electrode and a workpiece; and circuitry. The circuitry is configured to control the welding power source to repeat a sequence including: outputting a positive peak current from the workpiece to the consumable electrode during a positive peak period; outputting a positive base current from the workpiece to the consumable electrode and subsequently outputting a negative base current from the consumable electrode to the workpiece during a first base period, an absolute value of the positive base current and the negative base current being less than the positive peak current; and outputting a negative peak current from the consumable electrode to the workpiece during a negative peak period following the first base period, an absolute value of the negative peak current being greater than the absolute value of the positive base current and the negative base current.

Abstract: Systems and methods are disclosed relating to welding sequence guidance using three-dimensional (3D) models. In some examples, a welding sequence program may use 3D models, rather than two-dimensional (2D) images, to guide operators through welding sequences. Since only one 3D model must be saved for each sequence, rather than potentially hundreds of 2D images, substantial memory space may be saved. Additionally, the same 3D model may be used for several welding sequences. Further, the 3D model may be animated to help the operator understand changes in perspective between steps of the welding sequence.

Abstract: Method for compensating an interfering influence on a welding current, provided by a welding power source (4) for welding a workpiece (3), from another welding power source (4?), comprising the steps of: (a) providing (SA) a compensation voltage (UKomp), which is calculated on the basis of a welding current progression provided by the other welding power source (4?); (b) subtracting (SB) the compensation voltage (UKomp) from a measured voltage (UMess), measured by a voltage measurement unit (8) of the welding power source (4), so as to determine a corrected measured voltage (U?Mess); and (c) regulating (SC) the welding current generated by the welding power source (4) as a function of the corrected measured voltage (U?Mess).

Abstract: A welding-type system includes a power supply configured to control preheating of an electrode wire. A controller is configured to receive a plurality of power values corresponding to a power output of the power supply and calculate an arc power value corresponding to an arc condition at the preheated electrode wire based on a rate of change of the plurality of power values. A target power output value is determined based on the calculated arc power value, and the power output is adjusted based on the determined target power value.

Abstract: The invention relates to an electric arc-welding welding head comprising a contact device and one or more wire feeder units, the contact device encompassing an electrode assembly, the electrode assembly comprising at least two fusible continuously-fed wire electrodes arranged in a contact device. An electrically insulated duct is provided for electric insulation of at least one of the electrodes so that the electrode is electrically insulated from other electrodes in the electrode assembly. The invention also relates to an electric arc-welding contact device and an electric arc-welding welding head assembly.

Abstract: Systems and methods for cleaning a wire electrode after a welding process has ended are described. During a welding process, a wire electrode may be fed forward from a wire feeder through a welding torch to create a molten weld pool. While, conventionally, feeding of the wire electrode stops when the welding process ends, the present disclosure contemplates instead continuing to feed the wire electrode forward after the welding process ends. More particularly, the present disclosure contemplates feeding the wire electrode into the weld pool so that the wire electrode can be “cleaned” in the molten weld pool created by the welding process. The “cleaned” wire electrode end can be more easily used to establish an electrical arc at the beginning of the next welding process.

Abstract: A method of forming a joint between a composite component and a metallic component is disclosed. The method includes forming a first groove in an outer surface of the metallic component on a first end of the metallic component. The first groove extends circumferentially on the outer surface relative to a center axis of the metallic component, and the first groove extends radially inward from the outer surface relative the center axis. The method further includes inserting the first end of the metallic component into a first end of the composite component. A second groove on the composite component over the first groove of the metallic component such that the composite component extends radially inward into the first groove of the metallic component. A composite hoop reinforcement is then applied in the second groove in a circumferential direction and the composite component, and the composite hoop reinforcement are solidified.

Abstract: A method to produce multi-component objects, including a first component and a second component assembled to it, provides to feed the first component to a loading station, to feed the second component to the same loading station and then to assemble them so as to produce the multi-component object.

Abstract: An automatic locking device for assembling a part to a workpiece is provided. The device includes a feeding mechanism, a fixture mechanism, a loading and unloading mechanism, a lifting mechanism, a rotating mechanism, and a locking mechanism. The feeding mechanism feeds the part to the fixture mechanism. The loading and unloading mechanism places the workpiece on the part. The lifting mechanism lifts up the fixture mechanism together with the part and the workpiece. The rotating mechanism rotates the fixture mechanism. The locking mechanism locks the part to the workpiece after the part and the workpiece are rotated by the rotating mechanism. The automatic locking device integrates multiple functions in a single station, reduces the number of the work stations and operatives, lowers the cost, and improves accuracy of the assembly. An assembling apparatus including the automatic locking device is also provided.

Abstract: A six-degree-of-freedom air-floating moving apparatus comprises a base platform, a floating platform is provided above the base platform, a micromotion platform is provided above the floating platform, the base platform is provided with an X-axis moving assembly, the floating platform is provided with a Y-axis moving assembly, the X-axis moving assembly drives the floating platform to move, the Y-axis moving assembly drives the micromotion platform to move, a damping assembly for reducing shaking is connected to a bottom of the micromotion platform, the X-axis moving assembly comprises an X-axis linear motor and an X-axis bearing platform, the X-axis linear motor is connected to each of two sides of the floating platform, the X-axis bearing platform is provided at each of two sides below the floating platform, an air bearing is provided at a bottom of the floating platform, and the air bearing is matched with the X-axis bearing platform.

Abstract: A dust collection cup allows a bit tip to be viewable without being detached or replaced. A dust collection cup is attachable to a front cylindrical portion of a hammer drill. The dust collection cup in an attached state allows a bit attached to the front cylindrical portion to extend through the dust collection cup. The dust collection cup includes an attachment attachable to the front cylindrical portion, and a body connectable to the attachment. The body includes an extendable unit including at least a portion in an axial direction retaining a predetermined length.

Abstract: A power tool comprising a power tool housing and a motor within the power tool housing. The motor including a rotor and a stator, the rotor coupled to a motor shaft to produce a rotational output. The power tool further includes a sensor within the power tool housing, the sensor configured to sense a free fall of the power tool, generate an output signal related to the sensed free fall. The power tool further includes a controller including a processor and a memory, the controller configured to receive the output signal from the sensor, detect the free fall of the power tool based on the output signal from the sensor, and brake the motor when the free fall of the power tool is detected.

Abstract: A control device generates, for each command cycle on the basis of machining line information expressing a plane machining line with a function displayed by a prescribed parameter and tangential line information showing a tangential line direction at respective positions of the machining line, a position command on a rotational axis and two linear axes with a position on the machining line obtained when the parameter is changed by a prescribed amount set as a machining position. The position command generated by the control device includes a command on a position of the rotational axis at which the tangential line at the machining position forms a prescribed angle set in advance with respect to any one of the linear axes and a command on the position of the two linear axes at which a tool is set at the machining position when the rotational axis is located at the position of the rotational axis.

Abstract: An indexing device includes a drive transmission mechanism, a fixing mechanism. The drive transmission mechanism includes an intermediate gear which includes an intermediate shaft being inserted at an end portion into an accommodation hole formed in a frame, and the intermediate shaft includes an accommodating concave portion and a plurality of through-holes. The fixing mechanism includes a cylindrical pressing member, steel balls and a screw member. There is a gap between the pressing member and a bottom surface of the pressing member in a state in which the pressing member is accommodated in the accommodating concave portion and the steel ball accommodated in each through-hole is in contact with a tapered surface and an inner peripheral surface of the accommodation hole.

Abstract: A horizontal five-axis turning plate type machining center includes a support base, a lathe bed arranged on the support base and a column arranged on the support base, wherein the lathe bed and the column are fixedly connected through a connecting arm, a turning plate device is arranged on the support base, an X-direction sliding plate capable of sliding in an X direction on the lathe bed is arranged on a side, facing the column, of the lathe bed, and a third driving unit capable of driving a workbench to perform position conversion between a turning plate and the X-direction sliding plate is arranged on the turning plate.

Abstract: A control device for a machine tool comprises a control section controlling the relative rotation and feeding of a cutting tool and a material, performing cutting with vibration of the cutting tool relative to the material by combining a forward feed movement in the machining direction, and a return movement in the counter-machining direction. A return movement setting section sets a pulse-like signal including a command for moving a cutting tool in the machining direction and a command for the return movement. A forward feed setting section makes the cutting tool reach a change point by combining the movement in the machining direction on the basis of the return movement setting section and the forward feed movement. A pulse-like signal is formed in sine waveform with an inflection point, and a phase of the inflection point is set to a value different from a phase of the change point.

Abstract: A machining center equipped with a device for mounting on a clamp parts to be worked or which have been worked, such as profiles, which has a supporting frame for supporting a turntable with two or more stepped positions or placements or workstations, an loading basket and an unloading basket. The machining center comprises a robot configured to remove or to associate, with each one of said two or more stepped positions or placements or workstations, the parts or the profiles to be worked and which have been worked at a plurality of fixed RPS or reference points and mobile mechanical components, according to a single positioning that is adapted to allow access by machining devices to any zone in the space of the profiles to be worked by modifying only the condition that the two or more stepped positions or placements or workstations are in.

Abstract: A glassware polishing system includes a base and a wall extending upward from the base. The wall circumscribes and defines a chamber within an inner side of the wall. A first polishing head having a first spindle extends upward from the base within the chamber and has a polishing material disposed about the first spindle. A second polishing head having a second spindle extends upward from the base within the chamber and has a polishing material disposed about the second spindle. At least one motor is disposed in the base and is configured to rotate the polishing heads about vertical axes of rotation defined by the spindles. The polishing heads may simultaneously polish internal and external surfaces of the glassware when the first polishing heads are rotated by the at least one motor.

Abstract: A method of training a neural network includes obtaining two ground truth thickness profiles a test substrate, obtaining two thickness profiles for the test substrate as measured by an in-situ monitoring system while the test substrate is on polishing pads of different thicknesses, generating an estimated thickness profile for another thickness value that is between the two thickness values by interpolating between the two profiles, and training a neural network using the estimated thickness profile.

Abstract: Exemplary substrate electrochemical planarization apparatuses may include a chuck body defining a substrate support surface. The apparatuses may include a retaining wall extending from the chuck body. The apparatuses may include an electrolyte delivery port disposed radially inward of the retaining wall. The apparatuses may include a spindle that is positionable over the chuck body. The apparatuses may include an end effector coupled with a lower end of the spindle. The end effector may be conductive. The apparatuses may include an electric contact extending from the chuck body or retaining wall. The apparatuses may include a current source. The current source may be configured to provide an electric current to an electrolyte within an open interior defined by the retaining wall.

Abstract: An apparatus for manufacturing a display device includes a moving part including a belt that circulates, a roller that circulates the belt, and at least one meandering prevention portion that moves in a first direction parallel to a direction of a rotation shaft of the roller and prevents meandering of the belt, and a polishing head disposed corresponding to the moving part, the polishing head polishing a surface of a base material disposed on a first surface of the belt. A part of the at least one meandering prevention portion faces a second surface of the belt, the second surface being a side surface of the belt.

Abstract: A device includes a rotator assembly configured to control a rotational kinetic energy of a wafer-platen based on an electrical energy input. The device further includes a controller configured to control the rotational kinetic energy of the wafer-platen, wherein a rotational velocity of the wafer-platen is either increased or decreased. The device further includes a converter configured to generate an electrical energy output of the rotator assembly based on decreased rotational kinetic energy of the wafer-platen. The device further includes an energy storage device configured to store the electrical energy outputted by the rotator assembly based on the decreased rotational kinetic energy of the wafer-platen.

Abstract: A system for polishing an outer surface of a specimen, the system including a motor and a rotatable shaft extending from a first end of the motor, wherein the specimen is removably attachable to the rotatable shaft, a safety cover configured to at least partially surround at least a portion of the rotatable shaft, wherein the safety cover includes a top panel, a first side panel and a second side panel spaced from each other across a width of the safety cover and extending downwardly from the top panel, and at least one aperture extending through at least one of the first and second side panels. The system further includes an abrasive material insertable through the at least one aperture so that the abrasive material is positionable to contact the outer surface of the specimen.

Abstract: A shot peening apparatus includes a first tank. The first tank includes a swirl flow generating mechanism and a suction port. The swirl flow generating mechanism swirls a waste liquid in the circumferential direction. The suction port is disposed at the axial center of the first tank. The suction port opens toward a bottom wall and suctions the waste liquid. A plurality of blade members are provided inside the first tank. The plurality of blade members hinders the waste liquid from swirling in the first tank.

Abstract: A grinding wheel with excellent grinding performance and providing stable grinding over a long period of time is provided. A glass filler-containing metal bond grinding wheel (10) includes a metal bond layer (14) including abrasive grains (11), a metal bond (12), and a glass filler (13). The glass filler-containing metal bond grinding wheel (10) has abrasive grains (11) that are diamonds and/or cubic boron nitrides, the metal bond (12) is a metal containing Cu, the ratio of the glass filler (13) volume to the metal bond (12) volume is 0.025 or more to 1.0 or less, and the metal bond (12) and the glass filler (13) are mutually diffused.