Abstract: A system and method for aligning a probe, such as a wafer-level test probe, with wafer contacts is disclosed. An exemplary method includes receiving a wafer containing a plurality of alignment contacts and a probe card containing a plurality of probe points at a wafer test system. A historical offset correction is received. Based on the historical offset correct, an orientation value for the probe card relative to the wafer is determined. The probe card is aligned to the wafer using the orientation value in an attempt to bring a first probe point into contact with a first alignment contact. The connectivity of the first probe point and the first alignment contact is evaluated. An electrical test of the wafer is performed utilizing the aligned probe card, and the historical offset correction is updated based on the orientation value.

Abstract: A method and system for modifying functionality of a printer. The printer is provided with firmware and programming code that interfaces with the firmware for controlling printing operations. The programming code includes at least one place holder. Second programming code is provided that, when executed on a processor readable medium, programming code is executed as a function of the at least one placeholder.

Abstract: A system and method are defined for modifying functionality of a printer that is provided with firmware for controlling printing operations. First programming code is developed that, when executed on a computer readable medium, interfaces with the printer's firmware and modifies the functionality of the printer. The first programming code is written in a first programming language, such as the LUA programming language, and the firmware is written in a second programming language other than the first programming language. Thereafter, the first programming code is executed on the computer readable, and the functionality of the printer is modified as a function of the executed first programming code interfacing with the firmware. The firmware is not modified by the interfacing.

Abstract: Electrical interfaces, addressing schemes, and command protocols allow for communications with memory modules in computing devices such as imaging and printing devices. Memory modules may be assigned an address through a set of discrete voltages. One, multiple, or all of the memory modules may be addressed with a single command, which may be an increment counter command, a write command, a punch out bit field, or a cryptographic command. The commands may be transmitted using a broadcast scheme or a split transaction scheme. The status of the memory modules may be determined by sampling a single signal that may be at a low, high, or intermediate voltage level.