Abstract: A method for generating a electro spun fiber medical implant including determining dimensions of a portion of anatomy of a patient corresponding to the electro spun fiber medical implant via medical imaging, generating a model of the portion of the anatomy based on the dimensions, the model including one or more solid areas and one or more void areas encompassed within the one or more solid areas, inverting the model to generate a mandrel model, the mandrel model generated based on the one or more void areas, generating the mandrel based on the mandrel model, the mandrel including at least one electrically conductive material therein, and applying an electro-spinning process to the mandrel to generate the electro spun fiber medical implant which circumscribes the mandrel, wherein the mandrel is removable from within the electro spun fiber medical implant after a disassembly process.

Abstract: A formaldehyde-free aqueous adhesive composition comprising (a) soy protein and (b) magnesium oxide or a mixture of magnesium oxide and magnesium hydroxide, wherein components (a) and (b) together constitute at least 50 weight percent of the composition, excluding the weight of the water.

Abstract: A semiconductor device has a semiconductor wafer with a plurality of contact pads. A first insulating layer is formed over the semiconductor wafer and contact pads. A portion of the first insulating layer is removed, exposing a first portion of the contact pads, while leaving a second portion of the contact pads covered. An under bump metallization layer and a plurality of bumps is formed over the contact pads and the first insulating layer. A second insulating layer is formed over the first insulating layer, a sidewall of the under bump metallization layer, sidewall of the bumps, and upper surface of the bumps. A portion of the second insulating layer covering the upper surface of the bumps is removed, but the second insulating layer is maintained over the sidewall of the bumps and the sidewall of the under bump metallization layer.

Abstract: The present disclosure relates to protein-starch compositions. The disclosure also relates to processes for preparing the protein-starch compositions. Further, the disclosure relates to uses of the protein-starch compositions in the preparation of adhesives or binders. Further, the disclosure relates to adhesive formulations that include protein-starch containing compositions and to paper products resulting from the processes herein.

Abstract: A method for forming a composite structure, using a mandrel that is later removed from the composite structure, involves production of a mandrel by depositing a particulate mixture, including an aggregate and a binder, into a mold and removing the mandrel from the mold. The mandrel may be treated while still in the mold by heating, curing with an agent, microwave energy, or by some combination thereof. Once finished, the mandrel can be used in manufacturing polymer and/or composite components.

Abstract: There is disclosed a board and a board composition using clay and crushed vegetational materials, which is environment friendly and recirculative and can be also used as a natural basic material for articles of furniture or architectural interior/exterior materials, thereby being used as compost when being scrapped, and a manufacturing method thereof. The board is fabricated by forming a composition fabricated by mixing vegetational material, clay, a seaweed adhesive and a functional adhesive, and an auxiliary material at a ratio of 40˜65:40˜10:10˜20:10˜5 weight percent, and then throwing the composition into a hopper; withdrawing the composition received in the hopper so as to be passed between a pair of rollers and then molding the composition in a desired size; passing the composition between the rollers heated at a temperature of 100˜300° C.

Abstract: A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12) on a wafer (10); a step of providing a resin layer (14) as a stress relieving layer on the wafer (10), avoiding the electrodes (12); a step of forming a chromium layer (16) as wiring from electrodes (12) over the resin layer (14); a step of forming solder balls as external electrodes on the chromium layer (16) over the resin layer (14); and a step of cutting the wafer (10) into individual semiconductor chips; in the steps of forming the chromium layer (16) and solder balls, metal thin film fabrication technology is used during the wafer process.

Abstract: The present invention provides a recording medium comprising a substrate having a glossy coating thereon, wherein the glossy coating comprises a binder and first and second groups of particles, wherein: (a) the first group comprises metal oxide particles, wherein the metal oxide particles are aggregates of smaller, primary particles, (b) the mean diameter of the primary particles is less than about 100 nm, (c) the mean diameter of the aggregates is from about 100 nm to about 500 nm, (d) the mean diameter of the particles in the second group is less than about 50% of the mean diameter of the aggregates in the first group, and (e) the ratio of particles in the first group to particles in the second group is from about 0.1:1 to about 10:1 by weight. The glossy coating of the inventive recording medium has an excellent rate of liquid absorption, a relatively high liquid absorption capacity, excellent adhesiveness, and a non-brittle, crack-resistant, glossy surface.

Abstract: Aluminum silicate-containing cement slurries for cementing wellbores in deepwater and cold environments, or in wellbores susceptible to fluid intrusion. The aluminum silicate-containing slurries may also be used as high strength, low density cements for wellbore cementing applications under a variety of conditions. The cement slurries typically comprise a mixture of a reactive aluminum silicate and hydraulic cement, and may include one or more other additives. The cement slurries may optionally be foamed using a foaming agent and energizing phase.

Abstract: Geopolymer-modified gypsum construction materials. Compositions derived from combining geopolymer adhesives with conventional gypsum wallboard slurry formulations produce an interpenetrating network (IPN) which cures by loss of process water to a refractory solid having improved fire and water resistance. Geopolymer adhesive starting compositions includes soluble and insoluble silicates, buffers and salts, and a chemical setting agent in aqueous suspension.

Abstract: A composition for the production of an open-pore foam product from essentially inorganic components contains, in addition to known components, a rock-forming solid substance, a curing agent, a foaming additive, and an at least partly alkali-soluble protein to produce open pores. The rock-forming component is a reactive solid substance selected from the group consisting ofI finely dispersed oxide mixture containing amorphous silicon dioxide and aluminium oxide,II vitreous, amorphous electrofilter ash,III milled calcined bauxite,IV electrofilter ash from a brown coal power station,V undissolved amorphous silicon dioxide from an amorphous disperse powder-like, dehydrated or water-containing silicic acid or from high temperature processes (silica fume),VI metakaolin, andVII cement.The curing agent is an alkali metal silicate solution containing 1.2 to 2.5 mols of silicon dixoide per mol of potassium oxide and/or sodium oxide.