Abstract: A stencil for contact printing paste solder onto lead and component pads of the leaded substrate of a SIP is a plate having holes therethrough in the pattern of the pads, a first recess in the solder side of the plate over the area of the plate having component holes, and a second recess in the substrate side of the plate adjacent lead holes that are connected to the second recess by narrow slots dimensioned to receive portions of associated leads. The second recess and lead holes are dimensioned for receiving the lead frame and tines on lead pads. In a printing application, the padded side of the substrate contacts the substrate side of the plate with lead tines on lead pads located in associated lead holes, the thickness of the plate adjacent lead holes being slightly greater than the height that lead tines project above the substrate. The depth of the first recess is selected to make paste solder in component holes adhere to associated component pads when the plate and substrate are separated.