Abstract: A method of applying stitching to an interior component is provided herein. The interior component having only a single layer of a substrate layer. The method including the steps of: a) penetrating substrate layer with an awl of a sewing head to form a piercing therethrough; b) retracting the awl from the substrate layer; c) inserting a needle of the same sewing head through the piercing through the substrate layer to grasp a thread positioned on a show surface of the outer skin layer; d) pulling the thread through the substrate layer; e) looping the thread with a previous stitch passed through the substrate layer; f) advancing the sewing head to another position with respect to the interior component, wherein a backside of the substrate layer is free of obstructions; and g) repeating steps a-f until a predetermined amount of stitches are applied to the interior component.
Type:
Grant
Filed:
October 22, 2015
Date of Patent:
January 16, 2018
Assignee:
INTEVA PRODUCTS, LLC
Inventors:
Edward J. Wenzel, Ramez M. Habhab, Patrick Eckhout