Abstract: A method for forming a low k dielectric constant material over a substrate. According to one embodiment, the method includes combining, in a mixing apparatus fluidly coupled to a solution applicator, an organo silicate glass (OSG) precursor, a solvent and a surfactant with water and an acid catalyst to form a coating solution; aging the coating solution in the mixing apparatus to form an aged coating solution; transporting the aged coating solution to the solution applicator; and then applying the aged coating solution to the substrate with the applicator.

Abstract: An apparatus for coating photoreceptor devices comprises a manifold forming a conduit, the conduit having a length with an input at one end. Multiple diptanks for applying photoreceptor coating solution to devices dipped therein are mounted on an upper portion of the manifold and distributed along the length. The conduit is arranged so that photoreceptor coating solution supplied to the input flows to the diptanks, thus forming a photoreceptor coating solution flow in each diptank. The conduit becomes increasingly narrower as the photoreceptor coating solution flows along the length successively from one diptank to the next diptank. As a result, the photoreceptor coating solution flow speed in each diptank is substantially the same.

Abstract: An apparatus including: (a) a vessel for a solution having a bottom end and an open top end, and defining a vertical axis perpendicular to the bottom end; (b) an insert device having a bottom surface and a top surface and nested within the vessel, wherein the insert device defines a passageway dimensioned for a substrate which is parallel to the vertical axis and extending through the insert device, and wherein the insert device also defines at least one bypass channel extending through the insert to allow solution within the vessel to flow to the top surface of the insert device; and (c) an overflow container positioned adjacent the vessel to catch solution runoff from the top surface of the insert device.

Abstract: An improved anode, cup and conductor assembly for a reactor vessel includes an anode assembly supported within a cup which holds a supply of process fluid. The cup is supported around its perimeter within the reactor vessel. The anode assembly has an anode shield carrying an anode. The anode shield and the anode are supported from below by a delivery tube which also serves to deliver process fluid to the cup. A bayonet connection is provided between a top portion of the delivery tube and the anode assembly. The fluid delivery tube has a fixed height within the vessel. The anode elevation is adjusted by the interposing of a spacer of desired thickness between the anode and the tube. An electrical conductor is connected to the anode, and passes through the tube to be electrically accessible outside the vessel. The conductor is connected to the anode with a plug-in connection which is completed when the tube is coupled to the anode by the bayonet connection.

Abstract: A method and apparatus for plating a substrate is provided, wherein fine pits formed in the substrate, such as fine channels for wiring, are filled with a copper, copper alloy, or other material with low electrical resistance. The method is performed on a wafer W having fine pits (10) to fill the fine pits with a metal (13) and includes performing a first plating process (11) by immersing the wafer in a first plating solution having a composition superior in throwing power; and performing a second plating process (12) by immersing the substrate in a second plating solution having a composition superior in leveling ability.

Abstract: A device for providing a coating on a surface includes a capillary slot that is open at the bottom and is filled via a supply chamber with coating medium. A substrate is conducted below the opening of the slot with the surface to be coated facing up. The capillary slot is not only determined by the intermolecular binding forces but can be actively fixed. As a result, high coating rates, e.g., between 30 and 100 mm/s, can be achieved. An especially reliable filling of the coating chamber results by providing an overflow container that communicates via a gravity-feed line with the capillary slot. The overflow container is preferably mounted so that it can be adjusted in height above the capillary slot, thereby effecting an adjustable flow of medium through the capillary slot, and an adjustable coat thickness.

Abstract: An apparatus, method and control system involve treating articles in one or more of a plurality of liquid treatment bath chambers. The apparatus includes one or more article raising and lowering devices and a plurality of treatment bath chambers, preferably having separate heaters, temperature and level monitors, filling and draining devices, and devices for keeping treatment bath components in suspension. The method preferably includes treating articles, preferably eyeglass lenses, by supporting the articles on an arm and dipping them into one or more of the plurality of treatment bath chambers, which may separately contain assorted coating liquids such as tint coatings, UV protection coatings, scratch resistance coatings, neutralizing liquids for removing tinting, and rinsing liquids.

Abstract: An easily operated dispenser for a flexible web typically a cellulosic web is provided that can be operated at a user option to provide a dry web or provide a liquid treated web. The liquid treatment can comprise an antimicrobial liquid treatment suitable for personal contact. The liquid treatment can comprise a cleaner, a soothing lotion, a protective coating, a pharmaceutical treatment, or any other liquid that can provide a beneficial property to a skin surface. The dispenser operates by having a first position from which it provides a dry web. The dispenser can also have a second position which contacts the web with a liquid treatment producing a web containing the liquid treatment composition. The user can interact with the dispenser and place the dispenser in the second position or the first position depending on the user's need for either a wet or dry web. This is a self-contained unit which can be designed to be either a disposable or nondisposable unit.

Abstract: A method and apparatus is disclosed for sequential processing of integrated circuits, particularly for conductively passivating a contact pad with a material which resists formation of resistive oxides. In particular, a tank is divided into three compartments, each holding a different solution: a lower compartment and two upper compartments divided by a barrier, which extends across and partway down the tank. The solutions have different densities and therefore separate into different layers. In the illustrated embodiment, integrated circuits with patterned contact pads are passed through one of the upper compartments, in which oxide is removed from the contact pads. Continuing downward into the lower compartment and laterally beneath the barrier, a protective layer is selectively formed on the insulating layer surrounding the contact pads. As the integrated circuits are moved upwardly into the second upper compartment, a conducting monomer selectively forms on the contact pads prior to any exposure to air.

Abstract: A movable trough is taught for establishing a uniform wetting line on the rear face of a curtain coating hopper lip. The trough can be pivoted or moved linearly into a position such that the hopper lip resides in or proximate to the movable trough. The curtain coating apparatus is then started and the coating solution leaving the hopper lip is intercepted by the trough. The coating solution flowing over the lip fills and floods the movable trough. The flooding of the trough forces the coating solution to substantially wet (to a height on the back side of the lip significantly higher than that of natural product flow) the back side of the hopper lip. The movable trough is then retracted from its position immediately beneath the hopper lip and intercepting the coating solution exiting the hopper lip to thereby allow the free-falling curtain to form and begin impingement on the moving support web to be coated.

Abstract: A method for applying a viscous material to a lead frame element. A method of the invention includes positioning the lead frame facing downward and bringing the lead fingers into contact with a pool of adhesive material. The contact of the lead fingers to the adhesive material results in a portion of the lead fingers receiving a portion of the adhesive material from the pool of adhesive material. The gravitational forces on the adhesive material on the downward facing lead frame maintain the shape and boundary definition of the adhesive material.

Abstract: An apparatus for hot-dip coating a steel strip, comprising: (a) an annealing furnace for continuously annealing the steel strip, the annealing furnace having an entrance side and an exit side; (b) a coating pot having a molten metal coating bath for coating the annealed steel strip; (c) a snout through which the annealed steel strip is introduced into the molten metal coating bath, one end of the snout being connected to the annealing furnace and the other end being immersed into the molten metal coating bath; (d) a seal device for sealing between the annealing furnace and the snout, the seal device being disposed at the exit side of the annealing furnace; and (e) a discharge device for discharging a gas containing a metal vapor from the snout to outside of the snout, the metal vapor being evaporated from the molten metal coating bath in the snout.

Abstract: There is provided an electrodeposition coating apparatus for dipping a body into an electrodeposition coating liquid filled in an electrodeposition tank, which includes a first circulation system for causing a flow direction of the coating liquid in a surface area and an intermediate area through which the body passes in the electrodeposition tank to be opposite to a moving direction of the body, and a second circulation system for causing a flow direction of the coating liquid in a bottom area in the electrodeposition tank to be equal to the moving direction of the body.

Abstract: An apparatus and related process for immersing a moving wire within a both of molten metal is applicable to wire forming processes. A flat-bottomed tray has at one end a nozzle for dispersing molten metal across the floor of the tray, from a first end to a second end, in a sheetlike flow. The nozzle preferably includes a slot-like opening, and is associated with a chamber for receiving a supply of pressurized molten metal for discharge through the slot. The metal is discharged with sufficient velocity to create a hydraulic jump or standing wave, whereby the crest of the wave is elevated above the tray end walls. Within the wave, molten metal experiences a turbulent flow in a direction against the travel of the wire array. The wire array passes through the wave, thereby experiencing immersion while being drawn through the apparatus in a straight path without substantial declination.

Abstract: In a dip coating apparatus including a jig having a function of generating a stream of air flowing downward toward the surface of a coating liquid stored in a bath, and causing the jig to hold a base to be coated and dip it in the coating liquid, the bath includes a lid having an opening whose inside diameter is equal to or greater than the inside diameter of the opening of the bath. The apparatus is capable of forming a uniform film free from roughness on the surface of a desired base, e.g., a photoconductive element for electrophotography.

Abstract: A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit.

Abstract: An optical fiber resin coating apparatus including: a nipple including a nipple hole, and a resin reserving chamber for reserving resin, a meniscus-shaped portion being positioned at an end of the nipple hole; a resin coating die including a tapered-hole and a land portion continued to the tapered-hole and defining a hole of a diameter which defines a diameter of a resin coated optical fiber; and an intermediate die provided between the nipple and the resin coating die, including a hole communicating the meniscus-shaped portion and the second tapered-hole, a hole communicating to the resin reserving chamber. A first resin flow path is defined at a boundary portion of the nipple and the intermediate die. A second resin flow path is defined at a boundary portion of the intermediate die and the resin coating die.

Abstract: The present invention provides a technique for removing air remaining on the peripheral edge of a surface to be plated in a conventional wafer plating apparatus, and to provide a wafer plating apparatus capable of performing a more uniform plating up to the peripheral edge of the surface to be plated, and which is further capable of performing plating even with respect to a wafer coated with a seed metal. This wafer plating apparatus includes a wafer clamp 6 for holding a wafer 4, a wafer support member 7 for supporting the periphery of the surface 5 to be plated of the wafer 4, and a plating tank 2 for circulating a plating solution while making the plating solution overflow from an upper opening of the tank. The wafer plating apparatus is arranged so as to perform plating, while the surface 5 to be plated is laid face down, being in contact with the surface of the plating solution, in a state in which the wafer 4 is clamped by the wafer clamp 6 and the wafer support member 7.

Abstract: The described invention provides a method and apparatus for coating uniform films on substrates and curing the coatings on the surface. Within an enclosed chamber the object to be coated is positioned and a sufficient amount of liquid material is provided into the chamber to cover the surface of the object to be coated. The excess liquid material is then evacuated from the chamber at a controlled rate to leave a coating of material on the surface of the object.

Abstract: A cross-head die which is comprised of a die body with a flow chamber, a plurality of die cavities, die elements within the die cavities, communication between the die cavities and the flow chamber, a means for individual flow adjustment to each die cavity, and a means for axial motion of the filamentary member(s) through the die elements. The single flow chamber communicates to a plurality of die cavities through individual radial flow ports. The flow chamber is open at one end and closed at the other except for a cleaning hole. Within each of the radial flow ports resides a device for adjusting flow restriction. Within each die cavity is a cylindrical die piston. A gap created between the die piston and the die cavity defines a path for resin flow. The resin flow path is tapered to a point at which the filamentary member exits from a smaller cylindrical bore through the center of the die piston.

Abstract: The present invention relates to a method for coating a medical implant, wherein the implant is submersed in an aqueous solution of magnesium, calcium and phosphate ions through which a gaseous weak acid is passed, the solution is degassed, and the coating is allowed to precipitate onto the implant. The invention further relates to a medical implant coated in said method and to a device for use in said method.

Abstract: It is an object of the present invention to provide a technology capable of plating satisfactorily even when wafers with a seed metal is plated in sequence by utilizing a cup-type plating apparatus. Plating solution adhered on a support 2 is removed between an initial and a subsequent plating processes by a cleaning apparatus 5 for a support 2 on a cup-type plating tank. The cleaning apparatus 5 comprises a first arm 9 of which distal end is positionable at the center of an upper portion of an opening of a plating tank 1, and a second aim 12 which is mounted at one end thereof to the distal end of the first arm 9, is provided at the other end thereof with a cleaner 11 and is pivotal about the distal end of the first arm 9.

Abstract: An apparatus is disclosed for coating fibers with a thermoplastic material. The apparatus includes a housing which defines a reservoir and having an open top open to the reservoir. A lid is selectively movable between an open and a closed position so that, in its open position, the lid exposes the reservoir and in its closed position, the lid overlies the open top of the housing and forms a slot between the lid and the housing at opposed ends of the housing. An elongated wiper is secured to the lid and this wiper extends into the reservoir when the lid is in its closed position. At least one infeed guide bar is secured to the housing between the wiper and one of the opposed ends of the housing and, similarly, at least one outfeed guide bar is secured to the housing between the wiper and the other of the opposed ends of the housing.

Abstract: A method and a system for cooling a steel strip are disclosed. A high water volume mist cooler and a low water volume mist cooler are disposed along a direction in which the steel strip travels. The high water volume mist cooler sprays high water volume mists onto the surfaces of the steel strip to cool the steel strip, and then the low water volume mist cooler sprays low water volume mists onto the surfaces of the steel strip to cool the steel strip, thereby cooling the steel strip while suppressing the influence of transition boiling, to prevent the steel strip from having a temperature-nonuniform portion.

Abstract: The invention relates to a method for treating a denture, comprising passing the denture through the air interface of an aqueous composition comprising a polymeric coating agent, especially a silicone polymer, having a weight average molecular weight of 1,000 or greater.

Abstract: A material handling system for dip coating at least a first drum having a first predetermined length in a first coating cycle and a second drum of a second different predetermined length in a different coating cycle including a carrier device for carrying at least one drum, a coating bath container for depositing a layer of coating material onto at least one drum, a mechanism for raising and lowering the coating bath container between at least a first position and a second position higher than the first position, and a transport device for vertically transporting the carrier device a first predetermined distance from a home position for the first drum and a second predetermined different distance from the home position for the second drum, the first predetermined distance from a home position for the first drum and the second predetermined different distance from the home position for the second drum being sufficient to at least partially insert the first drum and second drum, respectively, into the coating b

Abstract: An automated system for electroless metallization of optical glass fibers, includes a plurality of spaced apart plating stations having different solutions for electroless metallization of optical fibers. A motor-driven fiber transport and dipping apparatus is used in the system for shuttling optical glass fibers to the plating stations and immersing the optical glass fibers in the solutions. A programmable controller directs the transport and dipping apparatus to the plating stations in a selected order and at selected time intervals, and directs the apparatus at each of the stations to immerse the fibers into the solutions at a selected entry rate, for a selected duration, and at a selected withdrawal rate.

Abstract: A porous body 4 and a first immersing solution 6 are put in a vessel 5 in proportions such that the whole of the porous body 4 is immersed in the immersing solution, and the immersing is conducted for an arbitrary period of time. The vessel 5 is formed so as to have a depth greater than the height of the porous body 4. A vessel-capacity changing device 7 is inserted in the vessel 5. The first immersing solution 6 overflows from the interstice between the vessel-capacity changing device 7 and the vessel 5. A second immersing solution 8 is poured through a charging port, and simultaneously the vessel-capacity changing device 7 is lifted to thereby remove the same from the immersing solution. Thus, the porous body 4 is immersed in the second immersing solution 8 without being exposed to the outside air to thereby complete solution replacement. The immersing of the porous body can be effected safely, securely and at a lowered cost without damaging the porous body.

Abstract: A solid imaging apparatus and method produces an integral three-dimensional object from a multiplicity of cross sectional portions of the object by selectively exposing successive layers of a liquid photoformable composition to actinic radiation. The apparatus includes a vessel for containing the composition so as to present a free surface, and a movable platform disposed within the vessel below the free surface. Part of the composition is transferred above the free surface by lowering and raising a dispenser at predetermined positions located away from the platform. A doctor blade contacts the composition transferred above the free surface, and then moves over the platform to form a substantially uniform layer of the composition.

Abstract: Metal surfaces are contacted with a solution of a process bath (1), for example a phosphating or pickling solution, which comprises several components in aqueous solution, the composition of the process bath (1) being maintained within a given range by addition of solutions or gases, in particular air. The profitability is improved considerably if the solution of the process bath (1) is circulated via a first line (2) and a circulating pump (3) and the solution to be added and/or the gas to be added is fed to the process bath where, as a consequence of the ending of the line (2), vigorous thorough mixing prevails, or if the solution to be added or the gas to be added is fed to a suction pump (4), the solution to be added or the gas to be added mixing with the circulated solution.

Abstract: A hot dip coating system comprises a bath of molten coating metal contained in a vessel having a strip passage opening located below the top surface of the bath. A metal strip is directed along a path extending through the strip passage opening and through the bath of molten coating metal, to coat the strip. An electromagnet is employed to prevent the escape of the bulk of the molten coating metal from the bath through the strip passage opening while permitting the strip to move along its path. Expedients are provided to reduce leakage of molten coating metal through the strip passage opening.

Abstract: A wallpaper preparation device including a tray having a length and defining a reservoir for receiving a fluid for application to wallpaper. A roller rotatably carried by the tray and extending into the reservoir. A retaining member having opposing ends engagable with engagement features formed in opposing ends of the tray on a first side of the roller. The retaining member extends the length of the tray parallel to a surface of the roller with a gap therebetween, for holding the wallpaper against the roller. The retaining member is adjustable to increase and decrease the gap, thereby decreasing and increasing a frictional force between the wallpaper to be prepared and the roller.

Abstract: An alignment fixture for aligning components of a solder-wave machine during manufacturing processes of PCB assemblies and other electronic devices. In one embodiment, an alignment fixture has a calibration member that is adapted to be positioned at least in part over a solder-wave of the solder-wave machine. The calibration member may be positioned at a PCB elevation defined by the elevation at which PCB assemblies move over the solder-wave during processing. The calibration member may be an alignment bar or other device that has a solder indicator to indicate the height of the solder-wave relative to the PCB elevation. Additionally, the solder indicator may indicate the extent of deviations between the height of the solder-wave and the PCB elevation across at least a portion of the solder-wave.

Abstract: A hot dip coating pot (2) having a strip inlet passage (3) and electro-magnetic plugging means to prevent leakage of bath liquid form the pot through that passage, wherein: the plugging means comprises two magnetic field generator (7) disposed one on each side of the passage; each generator projects an oscillating magnetic field into the passage from at least two poles of opposite polarity that are adjacent the passage and spaced apart in the through direction of the passage; the said at least two poles of each generator are respectively in substantial alignment with the corresponding poles of the other in the transverse direction of the passage; the magnetic field projected by the generators have flux patterns which are substantially mirror images with reference to a plane of reflection coinciding with a centre plane of the passage; and both generators operate at a frequency of more than seven kiloHertz. When no strip is present the fields combine and extend transversely of the passage.

Abstract: A process serves for recoating a deactivated catalyst coating of a catalyst for converting harmful constituents from the exhaust gas of an internal combustion engine, particularly in a motor vehicle. In this process, washcoat and/or noble metal compounds are sprayed by means of an aerosol into the catalyst. The noble metal compounds are subsequently brought into their elemental state by means of a reducing medium flowing through the catalyst, after which the washcoat applied is dried by heat treatment or calcination. In an apparatus for carrying out the process, a first line for a carrier gas and a second line for the washcoat and/or the noble metal compounds are provided. The first line is arranged at least partly in a region before the catalyst within the second line and at its ends nearest the catalyst is provided with an atomization device.

Abstract: An electroless plating apparatus heats a plating bath solution with precise uniformity and avoids localized high temperatures within the bath. The electroless plating apparatus achieves this performance using two solution tanks included an inner tank nested inside an outer tank. A distributed heating element encases a plurality of surfaces of the outer tank, which contains an ethylene glycol solution. The inner tank contains a plating bath solution. A substrate is placed inside the inner tank for plating. Each of the outer tank and the inner tank include a device for evenly distributing the applied heat. In one embodiment, the outer tank heat distributing device is a pump which mixes the ethylene glycol solution. The inner tank heat distributing device is a pump which recirculates plating bath solution, applying returning solution via a sparger.

Abstract: The invention relates to a machine for wave soldering or tinning comprisinga solder reservoir (9);means that can form at least one solder wave with a so-called laminar form (8b);a conveyor system (2) that can bring a piece (1) to be soldered or tinned into contact with said laminar wave; andmeans for injecting (12) a gas in the vicinity of the wave;characterized in that the said injection means includes an injector located in a position adjacent to and downstream from the wave and provided with a wall (17) facing the solder wave, wherein the wall of the injector has at least a first group (15) of openings positioned so as to provide a first gas jet directed toward the flat surface of the solder wave.

Abstract: The claimed multi-tank gel developing apparatus and method comprises of two inner tanks within one outer tank to develop multiple electrophoresis gels simultaneously. The two inner tanks have openings along the edges of the walls to allow free circulation of solutions between the inner and outer tanks. The solution maybe exchanged by lifting out the inner tanks which retains the gels inside while the solution drains out. Once the solution in the outer tank has been exchanged, the inner tanks can be re-immersed into the outer tank. Furthermore, the inner tanks have detachable bases to facilitate transfer of the gels after development. This claimed apparatus allows for efficient development of electrophoresis gels by minimizing the direct handling of the gels thereby avoiding unwanted damages often incurred by conventional manually developing methods and apparatuses. The multi-tank apparatus can accommodate various gel compositions and sizes.

Abstract: A sealant applicator is used with a sealant container and has a frame, a plug contained within the frame, a wiper connected with a first frame end, a biasing member connected between the frame and the plug, and a coupler that couples the sealant applicator with the sealant container. The frame has first and second opposing frame ends and defines a pathway between the opposing frame ends. The plug slides between the opposing frame ends along the pathway. The wiper wipes a portion of the plug when the plug slides to the first frame end. The biasing member biases or urges the plug toward the first frame end. The sealant applicator extends within the sealant container when coupled with the container. In other aspects, the plug further includes a tip and an opposing base, the plug is oriented with the base facing the second frame end, and the tip includes at least one of a group that includes a convex surface and a concave surface.

Abstract: A chamber includes a door which opens to introduce a workpiece into the chamber and which closes to enclose the workpiece within the chamber. A workpiece support is located within said chamber and supports the workpiece such that a coated surface of the workpiece faces in a given direction. A liquid supply mechanism floods the chamber with a liquid to immerse the workpiece support. A pressure pulse supply mechanism applies a pulse of pressure to the liquid such that the pulse of pressure is transmitted through the liquid in a direction opposite the given direction. The pulse of pressure is incident via the liquid on the coated surface of the workpiece supported by the workpiece support.

Abstract: A tip coating system for use with scanning tunneling microscope (STM) tips. The tip coating system includes a tip holder, a plate having a slot for receiving the tip and for holding a coating material, a heater for heating the coating material into a molten blob, a micropositioner for displacing the plate to and from the tip and for moving the tip within the slot so that selected portions of the tip contact the molten blob of coating material. The tip coating system is preferably controlled by electronic controllers, including a temperature controller for the heater. The tip coating system is used to insulate the tips with soft polymer coating material to ensure very low tip leakage current (on the order of about 1 pA typical).

Abstract: A dip coating method, in which a cylindrical member is dipped in a coating solution in a coating solution tank and the coating solution is coated on an outer peripheral surface of the cylindrical member by the cylindrical member being raised, includes the steps of: making the coating solution always overflow from the coating solution tank; dipping the cylindrical member into the coating solution through an opening portion of a cover which is provided above a surface of the coating solution in the coating solution tank, and which has the opening portion through which the cylindrical member can pass, and which has a plurality of plates which are disposed at intervals in a vertical direction; and raising the cylindrical member.

Abstract: An inversion casting vessel includes a melt-filled container with a hole in the floor through which a metal strip is drawn. As the strip is drawn through the container, crystallization of the melt on the metal strip occurs, thereby forming a metal strand. The hole in the floor is a slit shaped channel through which the strip is run in a low-contact manner. The container also includes a cooling device for cooling the melt in the area of the slit shaped channel. The cooling device maintains the temperature of the melt around the channel to create a two-phase field of the melt, one of the phases being crystal, making up 50%-90% of the two phase field. The metal strip first contacts the melt at the two-phase field of the melt as the strip is run through the melt container.

Abstract: The film coating apparatus comprising a mounting table for holding an LCD substrate substantially horizontally, a nozzle having a slit-form liquid discharge port extending from one end to the other end of the substrate, coating solution supply mechanism for supplying a resist solution to the nozzle, and moving means for moving the nozzle in parallel to the substrate in the direction perpendicular to the longitudinal direction of the liquid discharge port in such a manner that the liquid discharge port keeps a constant clearance with the substrate.

Abstract: The present invention relates to a system and a method for using the system to provide a dross-free zinc bath for hot-dip galvanizing of steel strip or wire. The system includes the operation and apparatus for carrying out the operation of directing a zinc solution directly against both sides of a steel strip, along at least 50% of the processing length of the strip.

Abstract: A buffer tank and pre-wetting apparatus prevent a liquid chemical waste from crystalizing on the inside walls of a drain pipe that carries the waste to a waste tank. The pre-wetting apparatus includes a pre-wetting tank with an overflow pipe that leads to the waste tank drain pipe. A water supply is connected to fill the pre-wetting tank to the rim of the overflow pipe and then overflow to wet the inside walls of the drain pipe before waste from the buffer tank is transferred through the overflow pipe and to the drain pipe and the waste tank.

Abstract: An apparatus for housing a plurality of applicators in a hygienic cavity and dispensing said plurality of applicators from said cavity. The apparatus includes a container for holding said plurality of applicators, a support structure for the plurality of applicators, a reservoir in fluid communication with the hygienic cavity, said reservoir being situated to facilitate wetting said plurality of applicators with said fluid during said dispensing; an aperture generally adjacent to said reservoir; said plurality of applicators traversing said aperture during said dispensing; and a dispenser structure actuable by a user from outside said container to engage at least one applicator of said plurality of applicators for causing advancement of said at least one applicator through said aperture to effect said dispensing.

Abstract: An apparatus for treating a cord for use in a power transmission belt. The apparatus has a guide system for guiding a cord in a predetermined path and a processing liquid application system including a receptacle for a discrete amount of a processing liquid. A container defines a reservoir for a supply of processing liquid. There is a discharge opening on the first container for communicating processing liquid from a supply of processing liquid in the first container reservoir to the receptacle. With a first predetermined amount of processing liquid in the receptacle, the predetermined path extends through the processing liquid in the receptacle. With the discharge opening blocked, the first container reservoir is air tight. A first structure is provided for mounting the first container in an operative position on the apparatus wherein processing liquid in the first container reservoir flows by gravity to the discharge opening.

Abstract: An electroless plating apparatus heats a plating bath solution with precise uniformity and avoids localized high temperatures within the bath. The electroless plating apparatus achieves this performance using two solution tanks included an inner tank nested inside an outer tank. A distributed heating element encases a plurality of surfaces of the outer tank, which contains an ethylene glycol solution. The inner tank contains a plating bath solution. A substrate is placed inside the inner tank for plating. Each of the outer tank and the inner tank include a device for evenly distributing the applied heat. In one embodiment, the outer tank heat distributing device is a pump which mixes the ethylene glycol solution. The inner tank heat distributing device is a pump which recirculates plating bath solution, applying returning solution via a sparger.

Abstract: An automatic wafer plating equipment for automatically plating wafers and more particularly, for automatically plating a small lot of wafers is disclosed. The automatic wafer plating equipment includes a transfer robot provided with a holding arm for pivoting, vertical movement, extending and extracting, a load stage, an orientation stage, a plating stage, a recovery stage, and a cleaning stage. The transfer robot carries out a series of the following operations for plating process. The wafers are picked up one by one from a supply cassette loaded to the load stage. The wafer is then fed to the orientation stage. The wafer orientated at the orientation stage is conveyed to the plating stage. The plated wafer is transferred from the plating stage to the recovery stage. When residue of a plating liquid has been recovered at the recovery stage, the wafer is conveyed to the cleaning stage.