Abstract: Exemplary electroplating apparatuses may include a system head operable to clamp a substrate. The system head may be operable to raise and lower the substrate between a plating bath, a first position above the plating bath, and a second position above the first position. The electroplating apparatuses may include a plating bath vessel adapted to hold the plating bath for electroplating on the substrate. The electroplating apparatuses may include a weir extending about the plating bath vessel. The electroplating apparatuses may include a first nozzle extending through the weir at a first radial position, and positioned to deliver fluid to the substrate at the first position above the plating bath. The electroplating apparatuses may include a second nozzle extending through the weir at a second radial position, and positioned to deliver fluid to the substrate at the second position above the plating bath.

Abstract: A non-transitory medium includes instructions to control a spin coating device to render a cleaning nozzle of the spin coating device below a base plate and out of optimal exposure to a substrate material placed on a spin chuck when the base plate is engaged with the spin chuck. In response to disengagement of a lid from the base plate, the non-transitory medium also includes instructions to disengage the base plate from the spin chuck to lower the base plate to a locking point whereupon a portion of the cleaning nozzle below the base plate passes through a hole in the base plate and emerges completely out of and above the base plate, and instructions to clean the bottom surface and/or the edges of the substrate material utilizing the cleaning nozzle based on an optimal exposure to the bottom surface and the edges of the substrate material.

Abstract: A media storing instructions that when executed by a processor of a robot effectuates operations including detecting an object in a line of sight of at least one sensor; adjusting a current path of the robot to include a detour path around the object, instructing the robot to resume along the current path after avoiding the object, discounting areas of overlap from a total area covered based on at least some data collected by sensors, inferring previously visited areas and unvisited areas, generating a planar representation of a workspace of the robot by stitching data collected by at least some sensors of the robot at overlapping points, and transmitting the planar representation and coverage statistics to an application of a communication device configured to display the information.

Abstract: The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps: a) Providing a substrate with a substrate surface comprising at least one recess, b) applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, c) applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and d) plating the recess.

Abstract: A slit nozzle is moved by a nozzle lifting/lowering mechanism and a nozzle sliding mechanism relative to substrates held in a substantially horizontal attitude by spin chucks. A development liquid is discharged on each substrate from a discharge port of the slit nozzle such that development processing for the substrate is performed. After the development liquid is discharged, the slit nozzle is moved to a waiting position excluding positions over the substrates held by the spin chucks. In waiting pods provided at the waiting positions, cleaning processing for the slit nozzle is performed by a cleaning liquid with gas bubbles mixed therein.

Abstract: An air-cooled heat exchanger (6) arranged in a gas processing facility for performing a liquefaction process of natural gas is configured to supply cooling air to a tube (63) through which a fluid to be cooled is caused to flow, to thereby cool the fluid to be cooled, and a mist supply section (7) is configured to supply mist obtained by spraying demineralized water, to thereby cool the cooling air. Further, the mist supply section (7) is configured to spray the demineralized water from a lateral position on an upstream side of an intake.

Abstract: Methods and apparatuses for applying liquid coatings are provided. A first roll (14), a second roll (16), and a nip (146) formed between the first and second rolls are provided. A coating liquid (22) is supplied to the nip. The coating liquid is smoothed, via the nip, into a substantially uniform layer (22a) of liquid coating which is transferred to a substrate (12). The second roll (16) includes a thin metal shell (40) and a resilient layer (30), the thin metal shell encases the resilient layer therebeneath, and the thin metal shell is capable of deflecting in unison with the resilient layer such that the thin metal shell is elastically deformable at the nip when in contact with the first roll (14).

Abstract: The present invention relates to an aqueous separation liquid comprising at least 49.9 wt. % water, 5 to 50 wt. % of at least one organic water-soluble polyol, based on the total weight of the aqueous separation liquid, and at least one low molecular weight cellulose derivative as rheology modifier, and to the use of this liquid in a process for removing paint overspray from a paint spray booth.

Abstract: There is provided a film forming apparatus for performing a film forming process on substrates by heating the substrates while the substrates are held in a shelf shape by a substrate holder in a vertical reaction container. The film forming apparatus includes: an exhaust part configured to evacuate the reaction container; a gas supply part configured to supply a film forming gas into the reaction container; a heat insulating member provided above or below an arrangement region of the substrates to overlap with the arrangement region and configured to thermally insulate the arrangement region from an upper region above the arrangement region or a lower region below the arrangement region; and a through-hole provided in the heat insulating member at a position overlapping with central portions of the substrates to adjust a temperature distribution in a plane of each substrate held near the heat insulating member.

Abstract: The invention below relates to a doctor blade device with an elongated doctor blade intended to operate continuously against a roll surface (2) and/or a cylinder surface (20) during scraping or wiping off material (IB) on the surface (20), which doctor blade device (5) comprises a carrier beam (10) adapted to the length of the roll surface or cylinder surface, which carrier beam has a clamping arrangement (4) for the positioning of a carrier part (3), arranged, in a groove in the longitudinal direction, to slidably carry the doctor blade (6), wherein the carrier part (3) comprises a carrier blade (30), a lip means (14) arranged at the carrier blade (30) and a spacer element (12) arranged between the lip means (14) and the carrier blade, wherein the carrier blade (30), the lip means (14), and the spacer element (12) are arranged, along a first long side edge of the carrier blade (30) between them, to form said groove (15) for slidable positioning in the longitudinal direction of the doctor blade (6) by support

Abstract: A substrate processing apparatus including: a first valve provided between a gas supply source and an air-water separation tank, the first valve opening and closing a flow path of a gas supplied from the gas supply source; a second valve that opens and closes a flow path of liquid discharged from a discharge port of the air-water separation tank; and a control unit that controls the first valve and the second valve. The discharge port of the air-water separation tank communicates with a discharge port of a cleaning chamber that cleans the substrate, and the control unit controls to close the first valve after preset gas supply time elapses from when the first valve is opened and gas can no longer be discharged from the air-water separation tank and controls to close the second valve after the first valve is closed.

Abstract: A latch assembly is provided according to the present application, which includes a latch body and a guiding plate. The latch body is provided with a latch end configured to connect a device, and the guiding plate is provided with multiple positioning holes, the latch body is provided with multiple convex embedding blocks matching with the multiple positioning holes respectively, the latch body is further provided with a clamper, and after the multiple embedding blocks of the latch body are inserted into the multiple positioning holes respectively, the clamper clamps the guiding plate to achieve the connection. The latch assembly has a simple and compact structure, occupies a small volume, can be assembled and disassembled conveniently with a high efficiency, saves operation time and operation efforts.

Abstract: A powder coating booth includes booth walls and a roof which can be lowered between the booth walls, wherein a gap is provided between the roof and the booth walls. The roof has compressed air nozzles for spraying the booth walls. In addition, a supporting device is provided, which supports the roof. In at least one of the booth walls a vertical slot is provided through which the supporting device protrudes into the booth and in which the supporting device is movable. In addition, the booth includes a bottom (19) with a suction, which is connectable with the suction inlet of a cyclone separator via a suction pipe.

Abstract: A plating method has an electroless plating step for forming a conductive coating on a non-conductive substrate and an electrolytic plating step for forming a metallic coating on the conductive coating by using an auxiliary electrode. In the electroless plating step, with the position of the auxiliary electrode adjusted in relation to the non-conductive substrate, the non-conductive substrate and the auxiliary electrode are both immersed in an electroless plating solution to form the conductive coating. In the electrolytic plating step, with the position of the auxiliary electrode adjusted in relation to the non-conductive substrate, the non-conductive substrate and the auxiliary electrode are both immersed in an electrolytic plating solution to form the metallic coating. In the electroless plating step, electric current is applied by using the auxiliary electrode as an anode and a conductive member immersed in the electroless plating solution as a cathode.

Abstract: A cleaning device, which is included in a process cartridge and an image forming apparatus, includes a cleaning blade configured to remove a material attached to a surface of an image bearer, a cleaning case configured to contain the material removed by the cleaning blade, and a removed material receiver configured to receive the material failed to enter into the cleaning case when the material is removed by the cleaning blade, the removed material receiver having a first range at both ends in a width direction of the cleaning blade and a second range at a center in the width direction of the cleaning blade. A volume per unit length in a width direction of the first range is greater than a volume per unit length in a width direction of the second range.

Abstract: Various embodiments of a system for coating removal are provided. In one embodiment, a system for removing a coating material from another material is provided, the system comprising: a staging hopper; a second elevator operatively connecting the staging hopper to the decoating mill; a decoating mill having a decoating mill tank and at least one rotary blade oriented within the decoating mill tank, wherein the at least one rotary blade can translate horizontally and vertically; a screen station having a dump hopper and a recovery tank; a washer; a dryer; an aspirator; a large waste water filter press; at least one process water filter press; a sanitary water filter; a staging tank; a water heater; and a process chemical feed system.

Abstract: A sludge recycling treatment system of an urban sewage plant includes solar sludge drying and sludge roasting and activated carbon manufacturing devices. The solar sludge drying device has a sealing box, flat plate conveyor belts, and a conveyor belt traction device. The sludge roasting and activated carbon manufacturing device has a rotary kiln and feeding, conveyor, discharging, and flue gas recycling apparatuses. The flat plate conveyor belts are stepped and concave-convex manufactured from stainless or anti-corrosion carbon steel. Sludge roasting and activated carbon manufacturing is implemented mainly by a rotary kiln to heat a rotary drum wall therein to heat materials. The kiln has automatic feeding and discharging apparatuses. Harmless treatment and resource utilization of urban sludge converts the sludge from waste to wealth, and fully utilizes solar energy to reduce energy consumption during sludge treatment.

Abstract: A slit nozzle is moved by a nozzle lifting/lowering mechanism and a nozzle sliding mechanism relative to substrates held in a substantially horizontal attitude by spin chucks. A development liquid is discharged on each substrate from a discharge port of the slit nozzle such that development processing for the substrate is performed. After the development liquid is discharged, the slit nozzle is moved to a waiting position excluding positions over the substrates held by the spin chucks. In waiting pods provided at the waiting positions, cleaning processing for the slit nozzle is performed by a cleaning liquid with gas bubbles mixed therein.

Abstract: A method of cleaning a thin film forming apparatus wherein a process for supplying a film forming gas into a reaction tube of the thin film forming apparatus to form a thin film on an object to be processed is repeated more than one time and then a cleaning gas is supplied into the reaction tube to remove extraneous particles attached to an interior of the apparatus, the method comprising: a first cleaning process including supplying a first cleaning gas into the reaction tube to remove the extraneous particles attached to the interior of the apparatus when a first cleaning start conditions is satisfied; and a second cleaning process including performing a cleaning process that is different from the first cleaning process when a second cleaning start condition that is different from the first cleaning start condition is satisfied.

Abstract: A container cleaning device includes a mounting plate shaped for accommodating a wafer; and a nozzle assembly disposed on the mounting plate and including a base and a shell complimentarily disposed on the base. The shell includes an inlet and at least one outlet member disposed on an edge. The base includes a recess communicating with the inlet, and at least one outlet element each being inclined at a predetermined angle with respect to the shell. Each outlet member of the shell is adjacent to and communicates with the corresponding outlet element of the base.

Abstract: The present invention relates to a method and an apparatus for the photopolymerization and the washing in series of digital printing plates for flexography. The method according to the present invention is characterized in that it implements in series the exposure and washing steps of the printing plate, which is continuously moved. The present invention further concerns an apparatus adapted to implementing said method.

Abstract: A plating apparatus includes a vessel for holding a bath of plating liquid. A head is adapted to hold a work piece, such as a silicon wafer, in the vessel, with a seal on the head sealing against the work piece. A component cleaner assembly may be used to automatically clean a component of the plating apparatus, such as a seal or a contact ring. The cleaner assembly has a component contactor, such as a brush, on an arm. An arm actuator is linked to the arm for moving the arm from a retracted position, to a deployed position, where the contactor is in physical contact with the component. A method for cleaning a component of a plating apparatus includes moving a scrubber or contactor into contact with the component and applying a cleaning liquid onto the component adjacent to the contactor.

Abstract: A cleaning arrangement for a coater that has a plate cylinder, the cleaning arrangement having a cleaning web, a tangential moving mechanism configured to controllably move the cleaning web in at least one direction in a plane defined by the cleaning web, a radial moving mechanism configured to controllably move the cleaning web in at least one direction out of the plane, and a controller coupled to the tangential and radial moving mechanisms which is configured to control the moving of the cleaning web into and out of contact with the plate cylinder in conformity with input signals received by the controller.

Abstract: A disclosed film deposition apparatus includes a susceptor provided rotatably in a chamber; a substrate receiving portion provided in one surface of the susceptor, for receiving a substrate; a reaction gas supplying member configured to supply a reaction gas to the one surface of the susceptor; a cleaning member including: a first concave member that is provided above the susceptor and open toward the one surface, thereby defining a space of an inverted concave shape, a second concave member provided over the first concave member to define a gas passage between the first concave member and the second concave member, a cleaning gas supplying portion configured to supply a cleaning gas to the space, and an evacuation pipe configured to be in gaseous communication with the gas passage and extend out from the chamber; and an evacuation opening provided in the chamber in order to evacuate the chamber.

Abstract: A tool for harvesting polycrystalline silicon-coated rods from a chemical vapor deposition reactor includes a body including outer walls sized for enclosing the rods within the outer walls. Each outer wall includes a door for allowing access to at least one of the rods.

Abstract: The fluidized bed processor of the present invention includes an internal filter assembly with a rack and a cartridge-type filter supported at the lower end by a bracket. The rack includes an elongated rod extending through the filter. An end cap is provided on the lower end of the rod for normal sealing engagement with the filter bracket. During normal operation of the processor, the upper and lower ends of the filter are sealed. During or after cleaning of the filter, the rack is lowered, and a spring separates the filter and support bracket from the end cap so as to create a gap for drainage of cleaning fluid.

Abstract: The present invention has an object to provide a method for manufacturing a plurality of high quality cylindrical members. The method includes: vertically holding a mandrel so as to be coaxial with a central axis of an annular slit; and discharging a liquid coating through the slit to form a film of the coating on a surface of the mandrel while vertically moving up the mandrel. A circular cleaning blade is rotatably mounted around a lower holding shaft. The step includes the steps of: (1) forming a film of the coating up to a lower end of a coating region of the mandrel, and then stopping the discharge; and (2) moving up the lower holding shaft so that the cleaning blade passes through the annular slit to clean it, in this order. Then the cleaning blade is rotated to clean the cleaning blade.

Abstract: A substrate plating apparatus is disclosed. The apparatus includes a substrate holder; a plating bath configured to plate a surface of the substrate in a plating solution; a cleaning bath configured to clean the substrate holder and the substrate with a cleaning liquid; an inner shell disposed in the cleaning bath and configured to house the substrate holder holding the substrate therein; and a cleaning liquid supply conduit configured to supply a cleaning liquid into the inner shell to clean the substrate, together with the substrate holder, with the cleaning liquid. The inner shell has an inner surface having an uneven configuration that follows an uneven exterior configuration of the substrate holder holding the substrate.

Abstract: A chemical vapor deposition reactor and a method of wafer processing are provided. The reactor can include a reaction chamber having an interior and an entry port for insertion and removal of substrates, a gas inlet manifold communicating with the interior of the chamber for admitting process gasses to form a deposit on substrates held within the interior, a shutter mounted to the chamber, and one or more cleaning elements mounted within the chamber. The shutter can be movable between (i) a run position in which the cleaning elements are remote from the exhaust channel and (ii) a cleaning position in which the one or more cleaning elements engage with the shutter so that the cleaning elements remove deposited particles from the shutter upon movement of the shutter to the cleaning position.

Abstract: A method of cleaning a thin film forming apparatus wherein a process for supplying a film forming gas into a reaction tube of the thin film forming apparatus to form a thin film on an object to be processed is repeated more than one time and then a cleaning gas is supplied into the reaction tube to remove extraneous particles attached to an interior of the apparatus, the method comprising: a first cleaning process including supplying a first cleaning gas into the reaction tube to remove the extraneous particles attached to the interior of the apparatus when a first cleaning start conditions is satisfied; and a second cleaning process including performing a cleaning process that is different from the first cleaning process when a second cleaning start condition that is different from the first cleaning start condition is satisfied.

Abstract: In various embodiments multi-component systems for the protection of spray booth surfaces and the suppression of dust are provided. In certain embodiments the multi-component system for the temporary protection of a paint spray booth and the suppression of dust comprises a first component comprising a liquid that when applied to a surface of said paint booth dries to form a peelable film; and a second component comprising a liquid that when applied to a surface of said paint booth or to said film, forms a tacky coating that adheres dust particles. In certain embodiments the system further comprises a third component comprising a liquid that when applied to a surface of said paint booth or to said film, forms a tacky coating that adheres dust particles, wherein the composition of said third component is different than the composition of said second component. In certain embodiments the system further comprises a non-woven material configured for application to a floor of a spray booth.

Abstract: The present invention is a method and apparatus for cleaning a chemical vapor deposition (CVD) chamber using cleaning gas energized to a plasma in a gas mixing volume separated by an electrode from a reaction volume of the chamber. In one embodiment, a source of RF power is coupled to a lid of the chamber, while a switch is used to couple a showerhead to ground terminals or the source of RF power.

Abstract: Exemplary robots and corresponding exemplary operating methods for a painting system are disclosed. In one example, the robot is a handling robot for opening and closing doors or bonnets of motor vehicle bodies. A robot element of a handling robot that is susceptible to dirt retention, e.g., a handling tool, may be arranged away from the spray jet of a paint during the painting operation and is applied to the component that is to be painted. The robot may include a cleaning device for cleaning or for keeping the robot element of the handling robot that is susceptible to dirt retention clean from paint that is applied with spray jet in the painting operation.

Abstract: Semiconductor equipment is provided to include a reaction chamber, a movable frame, and at least one cleaning brush head. The cleaning brush head is configured to operate on at least one dirty portion to be cleaned within the reaction chamber. The movable frame is disposed within the reaction chamber. The movable frame is capable of carrying a susceptor. The cleaning brush head is capable of touching the dirty portion. The cleaning brush head is capable of moving relative to the dirty portion for removing the residue which is attached to the portion to be cleaned.

Abstract: A substrate treatment plant includes a process chamber delimited by chamber walls and in the process chamber a substrate conveying unit for the horizontal conveyance of slab-shaped substrates in one conveying plane and in one conveying direction. The substrate conveying unit includes an arrangement of rotatably mounted, cylindrical conveying rollers transversely arranged to the conveying direction, the topmost generatrices of the conveying rollers defining the conveying plane, and at least one substrate treatment unit, which is located above the conveying plane, and at least one gas inlet. In the region of the substrate treatment unit at least one additional heating unit is located below the conveying plane and a condensation unit is located under the substrate conveying unit.

Abstract: The fluidized bed processor of the present invention includes an internal filter assembly with a rack and a cartridge-type filter supported at the lower end by a bracket. The rack includes an elongated rod extending through the filter. An end cap is provided on the lower end of the rod for normal sealing engagement with the filter bracket. During normal operation of the processor, the upper and lower ends of the filter are sealed. During or after cleaning of the filter, the rack is lowered, and a spring separates the filter and support bracket from the end cap so as to create a gap for drainage of cleaning fluid.

Abstract: A treatment system for the surface treatment of workpieces, particularly vehicle bodies, includes a plurality of transport devices, on which at least one workpiece to be treated can be attached in a releasable manner. A conveying device moves the transport devices through the treatment system. At least one treatment bath is disposed in a first conveying plane of the treatment system and the transport devices with the workpieces arranged thereon are introduced into the treatment bath. At least one cleaning device, which is suitable and designed for cleaning the transport devices after the surface treatment of the workpieces, is disposed in a second conveying plane of the treatment system. The second conveying plane is offset in the vertical direction relative to the first conveying plane.

Abstract: Semiconductor equipment is provided to include a reaction chamber, a movable frame, and at least one cleaning brush head. The cleaning brush head is configured to operate on at least one dirty portion to be cleaned within the reaction chamber. The movable frame is disposed within the reaction chamber. The movable frame is capable of carrying a susceptor. The cleaning brush head is capable of touching the dirty portion. The cleaning brush head is capable of moving relative to the dirty portion for removing the residue which is attached to the portion to be cleaned.

Abstract: Semiconductor equipment is disclosed in this invention. The semiconductor equipment includes a reaction chamber, a wafer susceptor, and a liner device. The reaction chamber includes an opening and a circular inner wall. The wafer susceptor is capable of carrying at least one wafer. The liner device is disposed between the wafer susceptor and the circular inner wall of the reaction chamber. The liner device is capable of moving vertically between a first position and a second position. The liner device includes at least one venting opening, wherein the venting opening is connected with a venting device. Particles which are accumulated within the liner device can be removed by the venting device.

Abstract: A vacuum processing method using an apparatus including a processing chamber disposed in a vacuum reactor and having plasma formed thereon, a sample stage having a sample placed on the upper plane thereof, and a gas introducing mechanism, wherein the sample stage includes a gas supply port for introducing thermal conductance gas between the sample stage and the sample to be processed. The method includes placing a dummy sample on the sample stage, introducing dust removal gas between the sample stage and the dummy sample, and removing particles attached to the sample stage via the flow of dust removal gas.

Abstract: Provided are a coating device and an inkjet recording device capable of reliably removing liquid attached to a drum. A process liquid is coated by pressing a coating roller against a surface of paper to be transported by a process liquid coating drum. The process liquid attached to an outer peripheral surface of the process liquid coating drum is removed by a blade coming into contact with the outer peripheral surface of the process liquid coating drum. The blade is separated from the process liquid coating drum by an installation portion of a gripper. The process liquid remaining in the process liquid coating drum during separation is removed by air that is ejected from air nozzles.

Abstract: A powder coating apparatus is provided with: a coating booth, wherein a work to be coated is moved by a conveyer in the coating booth; and a coating gun that sprays powder coating material to the moving work. In the powder coating apparatus, the coating booth includes a movable wall on at least one of a side wall and a ceiling wall of the coating booth. The movable wall is configured to move in accordance with the work passing the coating booth.

Abstract: A cleaning system which can be integrated into a coater track system for use in the production of semiconductor devices and methods for its use are provided. The cleaning system can include a series of nozzles having assorted configurations and features which provide uniform and efficient rinsing of excess material.

Abstract: A plasma treatment apparatus has a reaction vessel (11) provided with a top electrode (13) and a bottom electrode (14), and the first electrode is supplied with a VHF band high frequency power from a VHF band high frequency power source (32), while the bottom electrode on which a substrate (12) is loaded and is moved by a vertical movement mechanism. The plasma treatment system has a controller (36) which, at the time of a cleaning process after forming a film on the substrate (12), controls a vertical movement mechanism to move the bottom electrode to narrow the gap between the top electrode and bottom electrode and form a narrow space and starts cleaning by a predetermined high density plasma in that narrow space. In the cleaning process, step cleaning is performed. Due to this, the efficiency of utilization of the cleaning gas is increased, the amount of exhaust gas is cut, and the cleaning speed is raised. Further, the amount of the process gas used is cut and the process cost is reduced.

Abstract: A method for using a film formation apparatus includes performing film formation of a product film selected from the group consisting of a silicon nitride film and a silicon oxynitride film on a target substrate within a reaction chamber of the film formation apparatus; and unloading the target substrate from the reaction chamber. Thereafter, the method includes first heating an inner surface of the reaction chamber at a post process temperature while supplying a post process gas for nitridation into the reaction chamber, thereby performing nitridation of a by-product film deposited on the inner surface of the reaction chamber; then rapidly cooling the inner surface of the reaction chamber, thereby cracking the by-product film by a thermal stress; and then forcibly exhausting gas from inside the reaction chamber to carry the by-product film, thus peeled off from the inner surface.

Abstract: Exemplary robots and corresponding exemplary operating methods for a painting system are disclosed. In one example, the robot is a handling robot for opening and closing doors or bonnets of motor vehicle bodies. A robot element of a handling robot that is susceptible to dirt retention, e.g., a handling tool, may be arranged away from the spray jet of a paint during the painting operation and is applied to the component that is to be painted. The robot may include a cleaning device for cleaning or for keeping the robot element of the handling robot that is susceptible to dirt retention clean from paint that is applied with spray jet in the painting operation.

Abstract: A treatment system for the surface treatment of workpieces, particularly vehicle bodies, includes a plurality of transport devices, on which at least one workpiece to be treated can be attached in a releasable manner. A conveying device moves the transport devices through the treatment system. At least one treatment bath is disposed in a first conveying plane of the treatment system and the transport devices with the workpieces arranged thereon are introduced into the treatment bath. At least one cleaning device, which is suitable and designed for cleaning the transport devices after the surface treatment of the workpieces, is disposed in a second conveying plane of the treatment system. The second conveying plane is offset in the vertical direction relative to the first conveying plane.

Abstract: A coating device includes a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of a substrate while rotating the substrate; and an adjusting mechanism which adjusts the coating state of the liquid material at the outer periphery of the substrate; wherein the adjusting mechanism includes a dip portion which dips the outer periphery of the substrate in a solution while rotating the substrate and dissolves; and a suction portion which suctions the vicinity of the outer periphery of the substrate after dipping in the solution.

Abstract: The present invention provides a method for manufacturing a magnetic recording medium by mounting a substrate for film formation on a carrier, sequentially transporting said substrate into a plurality of connected chambers, and forming at least a magnetic film and a carbon protective film on said substrate for film formation within said chambers, wherein said method comprises a step of conducting ashing to remove an accumulated carbon protective film adhered to a carrier surface, which is performed following a step of removing a magnetic recording medium from said carrier following film formation, but prior to a step of mounting a substrate for film formation on said carrier.

Abstract: Use, as adhesion promoter intended for application to the surface of a substrate S1 made of thermoplastic elastomer polymer TPE which comprises a chain formed of an alteration of hard segments and of soft segments, for the purpose of the adhesive assembly of the said substrate S1 with another substrate S2, of at least one solvent of the hard segments and/or of the soft segments of the said thermoplastic elastomer polymer TPE.