Wick Patents (Class 122/366)
  • Patent number: 5360058
    Abstract: A heat pipe has at least one liquid flow channel and one vapor flow channel for the movement of the heat carrier fluid from the evaporator end to the condenser end and vice versa. The liquid flow channel is so constructed that the capillary radius of its cross-sectional area increases from the evaporator end to the condenser end of the heat pipe, preferably in a continuous manner. Further, the evaporator end of the pipe is provided with a closure member for communicating the liquid flow channel with the vapor flow channel for replenishing the liquid in the evaporating end if necessary. Opening of the closure member also permits gas and/or vapor bubbles that have been collected in the liquid flow channel to pass into the vapor channel. The closure member may be operated by an electromagnetic valve.
    Type: Grant
    Filed: July 8, 1993
    Date of Patent: November 1, 1994
    Assignee: ERNO Raumfahrttechnik GmbH
    Inventors: Alois Koeppl, Robert Mueller
  • Patent number: 5358033
    Abstract: A heat pipe structure, especially for cooling in a spacecraft, is equipped with a main heat pipe and at least one smaller diameter auxiliary heat pipe arranged so that the main and auxiliary pipes are in thermal contact with each other at the evaporator end of the main heat pipe. The condenser end of the auxiliary heat pipe, or pipes, is connected in a heat exchange manner with an auxiliary radiator or heat exchanger which is smaller than and thermally insulated from a main heat exchanger, the latter being in thermal contact with the condenser end of the main heat pipe. The auxiliary heat pipe, or pipes, super cools a bubble trap in the main heat pipe for removing of gas and/or vapor bubbles from the liquid flow path of the main heat pipe.
    Type: Grant
    Filed: November 29, 1993
    Date of Patent: October 25, 1994
    Assignee: ERNO Raumfahrttechnik GmbH
    Inventor: Reinhard Schlitt
  • Patent number: 5346000
    Abstract: A heat pipe is equipped with a bubble trap. Such bubble trap takes the form of a baffle that restricts the liquid flow in the liquid flow channel of the heat pipe to divide the two-phase flow in the liquid channel into a liquid flow and into a bubble and liquid flow. A cage of wire mesh is positioned downstream of the baffle to entrap the bubbles. In another embodiment the bubble trapping cage is a chamber that extends all the way into the evaporating end of the pipe while the baffle is arranged upstream of such a chamber which is additionally connected through perforations to the liquid flow channels.
    Type: Grant
    Filed: November 29, 1993
    Date of Patent: September 13, 1994
    Assignee: Erno Raumfahrttechnik GmbH
    Inventor: Reinhard Schlitt
  • Patent number: 5335720
    Abstract: A heat pipe comprising a hermetic shell tube, a heat conveying fluid within the shell tube and a plurality of capillary circumferential or axial grooves provided entirely of an inner surface of the shell. A capillary axial channel structure which includes axially extending plates defining a U-shaped or V-shaped channels therebetween circumferential grooves and having an opening defining therein a meniscus of the heat conveying fluid in the liquid phase at least in the evaporator section and the condenser section. The capillary axial channel structure may comprise an inner tube for defining a tubular, axially extending capillary space therebetween. The inner tube has open ends disposed within the evaporation and condensation sections for allowing the heat conveying fluid to flow therethrough.
    Type: Grant
    Filed: August 6, 1992
    Date of Patent: August 9, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Tetsurou Ogushi, Masaaki Murakami, Kazuyoshi Yabuchi, Akira Yao
  • Patent number: 5314011
    Abstract: A heat pipe is divided longitudinally by a divider wall into a vapor channel and into a liquid channel. The divider wall is provided, preferably at uniform axial spacings with bulges that form a restriction in the flow cross-sectional area of the vapor channel and an increase in the flow cross-sectional area of the liquid channel. A small diameter through bore is positioned at the peak of each bulge to connect the liquid channel with the vapor channel at this point. The reduced pressure at the restriction in the vapor channel is sufficient to suck gas or vapor bubbles collected under the bulge into the vapor channel, but insufficient to pull liquid into the vapor channel. The cross-sectional flow area of the liquid channel increases steadily toward each bulge, either from a point centrally between two bulges or from a point directly downstream of a bulge toward the next bulge as viewed in the flow direction of the liquid.
    Type: Grant
    Filed: June 17, 1993
    Date of Patent: May 24, 1994
    Assignee: ERNO Raumfahrttechnik GmbH
    Inventors: Bernhard Leidinger, Ruediger Meyer, Klaus P. Nickel
  • Patent number: 5309986
    Abstract: A heat pipe includes an air tight elongated container and a heat carrier sealed in the container. The elongated container has a flat bottom wall serving as a heat receiving portion and a top wall serving as a heat dissipating portion. A liquid passage for moving condensed heat carrier in a slanted direction and parallel directions with respect to the longitudinal axis by capillary action is provided on the inner wall surfaces of the container. The heat carrier which has been condensed into liquid flows along the liquid passage to be distributed entirely over the bottom wall surface where it efficiently absorbs heat to be evaporated again.
    Type: Grant
    Filed: November 30, 1992
    Date of Patent: May 10, 1994
    Inventor: Satomi Itoh
  • Patent number: 5303768
    Abstract: An improved capillary pumped loop evaporator includes circumferential grooves formed in the outer heat exchanger portion of the evaporator. The grooves open to the interface existing between the heat exchanger and a centrally positioned tubular wick. Axially extending vapor channels are formed in the wick and also open onto the interface. The circumferential grooves continuously communicate with the interface and provide a vapor escape to the vapor channels which direct vapor passage from the evaporator. By shortening the vapor path from the interface, a thinner vapor barrier is possible at the interface which results in more efficient heat transfer.
    Type: Grant
    Filed: February 17, 1993
    Date of Patent: April 19, 1994
    Assignee: Grumman Aerospace Corporation
    Inventors: Joseph P. Alario, Fred Edelstein, Robert L. Kosson, Maria Liandris
  • Patent number: 5289871
    Abstract: An evaporation heat exchanger having at least one active circulating circuit for a coolant liquid to be cooled, is constructed for removing heat in a spacecraft under a gravity-free operating condition and under different acceleration conditions. For this purpose, a housing encloses an evaporating space provided with at least one inlet valve for controlling the admission of a medium to be evaporated. The produced vapor or steam is discharged through a respective outlet port. A plurality of cooling tubes interconnected in a meandering shape form a number of tube panels in which the individual tubes are arranged with a different spacing from one another in a direction from the inlet valve to the outlet port. Preferably, these spacings increase in the flow direction from the inlet port to the outlet port to establish a constant flow speed for the evaporating medium. The tubes forming a panel may be arranged in a zig-zag pattern within the panel.
    Type: Grant
    Filed: November 3, 1992
    Date of Patent: March 1, 1994
    Assignee: Erno Raumfahrttechnik GmbH
    Inventor: Bernhard Leidinger
  • Patent number: 5275232
    Abstract: An improved evaporator section for a dual manifold heat pipe. Both the upper and lower manifolds can have surfaces exposed to the heat source which evaporate the working fluid. The tubes in the tube bank between the manifolds have openings in their lower extensions into the lower manifold to provide for the transport of evaporated working fluid from the lower manifold into the tubes and from there on into the upper manifold and on to the condenser portion of the heat pipe. A wick structure lining the inner walls of the evaporator tubes extends into both the upper and lower manifolds. At least some of the tubes also have overflow tubes contained within them to carry condensed working fluid from the upper manifold to pass to the lower without spilling down the inside walls of the tubes.
    Type: Grant
    Filed: March 15, 1993
    Date of Patent: January 4, 1994
    Assignee: Sandia National Laboratories
    Inventors: Douglas R. Adkins, K. Scott Rawlinson
  • Patent number: 5267611
    Abstract: The invention is a cooling structure for a high power density surface. Liquid is pumped along interconnected and continuous multiple channels on the backside of a sintered metal wick bonded to the cooled surface. The channels are located within a liquid delivery layer which also includes multiple liquid outlet holes, so that each outlet hole is surrounded by interconnected channels. The outlet holes are connected to a manifold to collect the pumped liquid. The input channels which surround each outlet hole are fed from manifolds at the edges of the panels, and the proximity of input channels to the outlet holes assures that liquid flow resistance within the sintered metal wick is minimized by the multiple short, wide paths.
    Type: Grant
    Filed: January 8, 1993
    Date of Patent: December 7, 1993
    Assignee: Thermacore, Inc.
    Inventor: John H. Rosenfeld
  • Patent number: 5219021
    Abstract: A re-entrant groove heat pipe provides capillary channel fin surfaces which are smooth, continuous, and offer a large radius of curvature upon which an extended thin film of working liquid may develop. Superior formation of thin films of the working fluid allows heat to be conducted more readily between the surface of the heat pipe and the surface of the fluid where evaporation and condensation takes place.
    Type: Grant
    Filed: October 17, 1991
    Date of Patent: June 15, 1993
    Assignee: Grumman Aerospace Corporation
    Inventors: Fred Edelstein, Robert L. Kosson
  • Patent number: 5076352
    Abstract: A high permeability wick structure for heat pipes. A thin capillary liquid transport structure is encased within relatively thick sections of a plastic bonded aluminum powder wick. The capillary structure is formed of two layers of fine mesh screen separated only by small, randomly located, powdered metal granules. The capillary liquid transport structure can be built in numerous cross sectional configurations, including annular rings or spoke like radial sections.
    Type: Grant
    Filed: February 8, 1991
    Date of Patent: December 31, 1991
    Assignee: Thermacore, Inc.
    Inventors: John H. Rosenfeld, Robert F. Keller
  • Patent number: 5046553
    Abstract: In order to improve a heat pipe comprising a housing containing a heat-transporting medium, this housing having an evaporation region and a condensation region, such that the heat pipe operates in an optimum manner with respect to its transfer capacity, it is suggested that a vapor channel be provided in the housing, that an unwettable porous structure be arranged between the vapor channel and the condensation region, this structure being impermeable for the condensate due to its pore size, and that a condensate channel be provided for guiding the condensate from the condensation region to the evaporation region.
    Type: Grant
    Filed: August 28, 1990
    Date of Patent: September 10, 1991
    Assignee: Deutsche Forschungsanstalt fuer Luft- und Raumfahrt e.V.
    Inventor: Friedrich Lindner
  • Patent number: 5044429
    Abstract: A wick layer is attached and fixed to one surface of a metal tape without forming a gap with the metal surface, and thereafter, the tape is rolled so that the surface having the wick layer serves as an inner surface, thus forming a pipe shape, then the pipe wall is corrugated. According to the above process, the wick layer is completely and uniformly attached to the inner surface of the heat pipe.
    Type: Grant
    Filed: December 5, 1990
    Date of Patent: September 3, 1991
    Assignee: Fujikura Ltd.
    Inventors: Masuji Sakaya, Ryuichi Okiai, Masataka Mochizuki, Kouichi Mashiko
  • Patent number: 5010951
    Abstract: A heat pipe and chemical etching technique is described for providing longitudinally extending capillary grooves of variable cross-sectional dimension on the interior surface of the heat pipe.
    Type: Grant
    Filed: August 3, 1989
    Date of Patent: April 30, 1991
    Assignee: Lockhead Missiles & Space Company, Inc.
    Inventors: Michael R. Kapolnek, Alexander R. Feild, Robert T. Hartle, Hillard R. Holmes
  • Patent number: 4947789
    Abstract: An evaporator chamber has an entry end with a conduit connected to the output of a mass flow regulator, an exit end connected to a vacuum, and a wall surface extending therebetween. A body having capillary action is disposed in the chamber and has one end connected to the conduit and a free surface spaced from the wall surface in line of sight thereof. Heating means for the wall surface heats the body radiantly and causes monomer carried thereby to evaporate.
    Type: Grant
    Filed: November 4, 1988
    Date of Patent: August 14, 1990
    Assignee: Leybold Aktiengesellschaft
    Inventors: Ingo Hussla, Jochen Ritter
  • Patent number: 4934160
    Abstract: An evaporator for discharging waste heat, for example from a space craft, uses at least one working fluid that is changed from its liquid state to its vapor state. The evaporator has at least one, preferably several, evaporator elements forming a unit. Each element has a liquid space separated from a vapor space by a tubular capillary separation member. The vapor space is divided into primary channels extending in parallel to the separation member. Secondary channels are formed in wall surfaces of the vapor space facing the separation member. The primary and secondary channels communicate with each other and extend approximately perpendicularly to each other. The secondary channels have a cross-sectional flow area which is substantially smaller than the cross-sectional flow area of the primary channels.
    Type: Grant
    Filed: March 14, 1989
    Date of Patent: June 19, 1990
    Assignee: Erno Raumfahrttechnik GmbH
    Inventor: Robert Mueller
  • Patent number: 4917173
    Abstract: A liquid supply control is disclosed for a heat transfer system which transports heat by liquid-vapor phase change of a working fluid. An assembly (10) of monogroove heat pipe legs (15) can be operated automatically as either heat acquisition devices or heat discharge sources. The liquid channels (27) of the heat pipe legs (15) are connected to a reservoir (35) which is filled and drained by respective filling and draining valves (30, 32). Information from liquid level sensors (50, 51) on the reservoir (35) is combined (60) with temperature information (55) from the liquid heat exchanger (12) and temperature information (56) from the assembly vapor conduit (42) to regulate filling and draining of the reservoir (35), so that the reservoir (35) in turn serves the liquid supply/drain needs of the heat pipe legs (15), on demand, by passive capillary action (20, 28).
    Type: Grant
    Filed: November 15, 1988
    Date of Patent: April 17, 1990
    Assignee: The United States of America as represented by the National Aeronautics and Space Administration
    Inventors: Richard F. Brown, Fred Edelstein
  • Patent number: 4917177
    Abstract: An artery vapor trap. A heat pipe artery is constructed with an extension protruding from the evaporator end of the heat pipe beyond the active area of the evaporator. The vapor migrates into the artery extension because of gravity or liquid displacement, and cooling the extension condenses the vapor to liquid, thus preventing vapor lock in the working portion of the artery by removing vapor from within the active artery. The condensed liquid is then transported back to the evaporator by the capillary action of the artery extension itself or by wick located within the extension.
    Type: Grant
    Filed: September 21, 1989
    Date of Patent: April 17, 1990
    Assignee: Thermacore, Inc.
    Inventor: Nelson J. Gernert
  • Patent number: 4903761
    Abstract: A two-phase closed-loop heat transfer system comprises a capillary-type evaporator 10, a condenser 11 (preferably also of the capillary-type), and a vapor conduit 17 through which heat-laden working fluid in vapor phase is driven adiabatically from the evaporator 10 to the condenser 11. The evaporator 10 comprises a plurality of tubes 12 connected in parallel. A helically threaded capillary channel 39 is formed on the cylindrical interior surface of each tube 12, and a wick assembly 33 is positioned longitudinally within each tube 12. Each wick assembly 33 comprises a high-permeability wick 36 within which are embedded a first tubule 34 and a second tubule 35. The first and second tubules 34 and 35 are of low permeability, and have one closed end and one open end. The open end of the first tubule 34 is connected to a feed line 16 through which liquid-phase working fluid is delivered into the first tubule 34.
    Type: Grant
    Filed: June 3, 1987
    Date of Patent: February 27, 1990
    Assignee: Lockheed Missiles & Space Company, Inc.
    Inventor: Richard M. Cima
  • Patent number: 4897997
    Abstract: An improved conduit assembly for coupling a heat pipe evaporator with a Stirling engine heat exchanger. The conduit assembly features a cylindrical main tube section connected to a flared shell joining the heat exchanger of the Stirling engine. The flared shell provides an increasing cross-sectional area which reduces the velocity of vaporized heat pipe working fluid flowing from the heat pipe evaporator to the heat exchanger. Such reduced velocity has been found to minimize entrainment of liquid within the transmitted vapor. The conduit assembly further includes an internal small diameter liquid return duct which provides additional isolation of the liquid and vapor phases of the heat pipe working fluid as a means of further reducing entrainment. Surface tension breakers are provided which communicate the heat exchanger to the inlet end of the liquid return duct to wick away liquid working fluid from the heat exchanger.
    Type: Grant
    Filed: August 19, 1988
    Date of Patent: February 6, 1990
    Assignee: Stirling Thermal Motors, Inc.
    Inventors: Roelf J. Meijer, Robert P. Verhey
  • Patent number: 4892064
    Abstract: A liquid heating tank is disclosed which has low conductivity walls and a high conductivity plate in a opening in the bottom. A fibrous blanket or wick covers the plate and the inner wall of the tank. The plate is heated by a heat source to heat the liquid.
    Type: Grant
    Filed: May 26, 1989
    Date of Patent: January 9, 1990
    Inventor: Joseph M. Zappia
  • Patent number: 4884627
    Abstract: An omni-directional heat pipe for cooling a local heat area, such as in electronic circuitry, including a sealed cavity for containment of multiple capillary-like coolant paths which may be inter-connectable or otherwise disposed in order to facilitate wide angle heat transfer dispersion. Said sealed cavity may be compressed as between said local heat areas and local cool areas. Said multiple capillary-like coolant paths comprising flexible tubing structured to permit ready flow of heat through evaporation at the hottest region, flow of the vapor to the cooler regions which is achieved as a result of inherently lower thermodynamic pressure, and the return of the condensate through a myriad of channels or capillaries acting as wick or surface tension induced flow, ready use as a thermal couple between respective high & low temperature regions.
    Type: Grant
    Filed: June 27, 1988
    Date of Patent: December 5, 1989
    Inventor: Amir Abtahi
  • Patent number: 4883116
    Abstract: A wick for use in a capillary loop pump heat pipe. The wick material is an essentially uniformly porous, permeable, open-cell, silicon dioxide/aluminum oxide inorganic ceramic foam having a silica fiber to alumina fiber ratio, by weight, of about 78 to 22, respectively, a density of 6 lbs/ft.sup.3, and an average pore size of less than 5 microns. A representative material having these characteristics is Lockheed Missiles and Space Company, Inc. HTP 6-22. This material is fully compatible with the FREONs and anhydrous ammonia and allows for the use of these very efficient working fluids, and others, in capillary loops.
    Type: Grant
    Filed: January 31, 1989
    Date of Patent: November 28, 1989
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Benjamin Seidenberg, Theodore D. Swanson
  • Patent number: 4877082
    Abstract: A surface-tension liquid pumping system is provided by one or more arrays of converging solid monofilament fibers or metal wires (strands) spaced apart at an input end to gather liquid, and gathered close together at the opposite end where menisci forms between wetted strands to force liquid in the direction of convergence of the strands. The liquid pumping system is independent of gravity. It is illustrated as being used in a heat pump having a heating box to vaporize liquid and a condensing chamber. Condensed liquid is returned by the pumping system to the heating box where it is again vaporized. A vapor tube carries the vapor to the condensing chamber. In that way, a closed system pumps heat from the heating box to the evaporating chamber and from there radiated to the atmosphere.
    Type: Grant
    Filed: April 13, 1989
    Date of Patent: October 31, 1989
    Assignee: United States of America as represented by the Administrator, National Aeronautics and Space Administration
    Inventor: Earl R. Collins, Jr.
  • Patent number: 4854379
    Abstract: A vapor block resistant liquid artery structure for heat pipes. A solid tube artery with openings is encased in the sintered material of a heat pipe wick. The openings are limited to that side of the artery which is most remote from the heat source. The liquid in the artery can thus exit the artery through the openings and wet the sintered sheath, but vapor generated at the heat source is unlikely to move around the solid wall of the artery and reverse its direction in order to penetrate the artery through the openings. An alternate embodiment uses finer pore size wick material to resist vapor entry.
    Type: Grant
    Filed: February 15, 1989
    Date of Patent: August 8, 1989
    Assignee: Thermacore, Inc.
    Inventors: Robert M. Shaubach, Peter M. Dussinger, Matthew T. Buchko
  • Patent number: 4854378
    Abstract: An enclosed chamber filled with any fluid such as water, is formed by connecting a metal heater cap or plate to one end thereof and the entire inner chamber is lined with a thin fibrous and absorbent material. The lining of the cap or plate is the blanket and the lining of the inner chamber walls is the wick; a rope type wick may also be used. The heater cap or plate with its blanket is placed adjacent to a heat source, whereas the molecules of colder water are separated and held in suspension in said blanket, thus said molecules are heated at a very rapid rate in a superimposed manner and are ejected into the chamber with force. The layers of hotter molecules will quickly build up from the blanket, thus forcing the colder molecules thereabove to move effficiently by taking the path of least resistance, which is the wick, to return to the blanket in a superimposed manner for reheating, thus the heating cycle is completed quickly with great efficiency.
    Type: Grant
    Filed: October 27, 1986
    Date of Patent: August 8, 1989
    Inventor: Joseph M. Zappia
  • Patent number: 4846263
    Abstract: A heat pipe in accordance with the present invention includes an outer pipe and an inner pipe which is inserted to the outer pipe, coolant return routes with relatively large cross-sectional area are provided on the inner side of the outer pipe from the evaporation section to the condensation section, grooves with relatively small cross-sectional area are provided on the inner surface of the inner pipe from the evaporation section to the condensation section, and connective openings are provided on the inner pipe for connecting through the grooves to the coolant return routes.
    Type: Grant
    Filed: December 1, 1988
    Date of Patent: July 11, 1989
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshio Miyazaki, Yuji Ido
  • Patent number: 4830097
    Abstract: A space vehicle thermal heat rejection system 10 utilizing separate optimized heat pipe components for the functions of heat acquisition, heat transport, and heat rejection. A honeycomb panel heat pipe evaporator section 20 performs the function of heat acquisition, and forms a closed thermodynamic system with a dual channel heat pipe transport section 30, which performs the function of heat transport. A plurality of truss or channel core heat pipe rejection fins 41 form the condenser section 40, which performs the function of heat rejection. A common wall 32 separates the condenser section 40 from the transport section 30. Using the above heat pipe components and having efficient interfacing between them results in high performance factors for the overall system.
    Type: Grant
    Filed: July 15, 1987
    Date of Patent: May 16, 1989
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Herbert J. Tanzer
  • Patent number: 4825814
    Abstract: A combination gas combustor and heat pipe evaporator comprised of elongated cylindrical tubes which overfit one another to create a number of longitudinal gas flow passages. A burner disposed at one end of the device creates hot flue gases which travel initially through an annular passage where heat is conducted to the working fluid of a heat pipe evaporator chamber. The flue gas flow is then reversed in direction to heat the radially outer surface of the tubes making up the heat pipe evaporator, and thereafter flow through passages to warm inlet air to increase combustion efficiency. For both described embodiments, a bellows is provided to accommodate differences in thermal expansion between the tubes making up the heat pipe evaporator. In accordance with a first embodiment, the primary flue gas transport channel has a decreasing annular width with distance from the combuster which results in a lowering Reynolds number for flow which provides a more uniform heat flux along the length of the device.
    Type: Grant
    Filed: March 10, 1988
    Date of Patent: May 2, 1989
    Assignee: Stirling Thermal Motors, Inc.
    Inventor: Roelf J. Meijer
  • Patent number: 4819719
    Abstract: An enhanced capillary assisted evaporative surface for use in heat transfer devices; such as, 2-phase mounting plates, heat pipes and collectors. Rectangular grooves are cut in a conductive substrate and then plated by vapor deposition. The process produces a necked-down opening in the groove and a dendritic surface improving both capillary pumping and heat transfer coefficients.
    Type: Grant
    Filed: January 20, 1987
    Date of Patent: April 11, 1989
    Assignee: McDonnell Douglas Corporation
    Inventors: Michael G. Grote, John A. Stark, Edward C. Tefft, III
  • Patent number: 4815528
    Abstract: A vapor block resistant liquid artery structure for heat pipes. A solid tube artery with openings is encased in the sintered material of a heat pipe wick. The openings are limited to that side of the artery which is most remote from the heat source. The liquid in the artery can thus exit the artery through the openings and wet the sintered sheath, but vapor generated at the heat source is unlikely to move around the solid wall of the artery and reverse its direction in order to penetrate the artery through the openings. An alternate embodiment uses finer pore size wick material to resist vapor entry.
    Type: Grant
    Filed: September 25, 1987
    Date of Patent: March 28, 1989
    Assignee: Thermacore, Inc.
    Inventors: Robert M. Shaubach, Peter M. Dussinger, Matthew T. Buchko
  • Patent number: 4815529
    Abstract: A heat pipe in accordance with the present invention includes an outer pipe and an inner pipe which is inserted to the outer pipe, coolant return routes with relatively large cross-sectional area are provided on the inner side of the outer pipe from the evaporation section to the condensation section, grooves with relatively small cross-sectional area are provided on the inner surface of the inner pipe from the evaporation section to the condensation section, and connective openings are provided on the inner pipe for connecting through the grooves to the coolant return routes.
    Type: Grant
    Filed: May 13, 1988
    Date of Patent: March 28, 1989
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshio Miyazaki, Yuji Ido
  • Patent number: 4807697
    Abstract: An improved heat pipe with an external artery. The longitudinal slot in the heat pipe wall which interconnects the heat pipe vapor space with the external artery is completely filled with sintered wick material and the wall of the external artery is also covered with sintered wick material. This added wick structure assures that the external artery will continue to feed liquid to the heat pipe evaporator even if a vapor bubble forms within and would otherwise block the liquid transport function of the external artery.
    Type: Grant
    Filed: February 18, 1988
    Date of Patent: February 28, 1989
    Assignee: Thermacore, Inc.
    Inventors: Nelson J. Gernert, Donald M. Ernst, Robert M. Shaubach
  • Patent number: 4789026
    Abstract: Capillary grooves in a heat pipe which are specifically constructed to suppress boiling. Conventionally shaped grooves are constructed with highly polished surfaces. The high polish discourages vapor bubbles which otherwise interfere with the liqud transport function of the arteries. A method of constructing the highly polished grooves by vapor deposition onto matching mandrels is also disclosed.
    Type: Grant
    Filed: June 26, 1987
    Date of Patent: December 6, 1988
    Assignee: Thermacore, Inc.
    Inventors: Brian E. Shank, Robert M. Shaubach
  • Patent number: 4785875
    Abstract: A heat pipe system particularly adapted for use with finned evaporators. In accordance with this invention, a separate liquid working fluid return conduit is provided which communicates with a liquid working fluid distribution means for distributing working fluid uniformly to all of the evaporator fins. Means are also provided in accordance with this invention for storing excess liquid working fluid either as a column of liquid within the liquid return pipe which is developed by a flow restrictor, or by selecting a distribution wick from a material having low capillary pressure which enables it to become saturated with liquid working fluid.
    Type: Grant
    Filed: November 12, 1987
    Date of Patent: November 22, 1988
    Assignee: Stirling Thermal Motors, Inc.
    Inventors: Roelf L. Meijer, Robert P. Verhey, Benjamin Ziph
  • Patent number: 4770238
    Abstract: A passive heat transporting and fluid management apparatus including a housing in the form of an extruded body member having flat upper and lower surfaces is disclosed. A main liquid channel and at least two vapor channels extend longitudinally through the housing from a heat input end to a heat output end. The vapor channels have sintered powdered metal fused about the peripheries to form a porous capillary wick structure. A substantial number of liquid arteries extend transversely through the wicks adjacent the respective upper and lower surfaces of the housing, the arteries extending through walls of the housing between the vapor channels and the main liquid channel and open into the main liquid channel. Liquid from the main channel enters the artery at the heat input end, wets the wick and is vaporized. When the vapor is cooled at the heat output end, the condensed vapor refills the wick and the liquid reenters the main liquid channel.
    Type: Grant
    Filed: June 30, 1987
    Date of Patent: September 13, 1988
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: James W. Owen
  • Patent number: 4765396
    Abstract: A wick for use in a capillary loop pump heat pipe. The wick material is an essentially uniformly porous, permeable, open-cell, polyethylene thermoplastic foam having an ultra high average molecular weight of from approximately 1,000,000 to 5,000,000, and an average pore size of about 10 to 12 microns. A representative material having these characteristics is POREX UF which has an average molecular weight of about 3,000,000. This material is fully compatible with the FREONs and anhydrous ammonia and allows for the use of these very efficient working fluids in capillary loops.
    Type: Grant
    Filed: December 16, 1986
    Date of Patent: August 23, 1988
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Benjamin Seidenberg
  • Patent number: 4753072
    Abstract: A heating system for improving the efficiency of a hot gas engine comprises a "heat pipe" type evaporator and condenser configuration forming a closed system for a condensing medium, such as sodium. The sodium is heated in the evaporator and vaporized. It flows through a conduit to the condenser where it condenses onto tubes which carry the hot working as for the engine, thereby heating the working gas. The condensed liquid sodium flows back through the conduit into the evaporator where it is again vaporized. This is a continuous cycle whereby a thermal power flow from the evaporator to the condenser is continuously induced by the heating of the sodium in the evaporator. The condenser comprises an outer cylindrical walled tube surrounding tubes which carry the hot working gas. These latter tubes are S-shaped and arranged in a bundle.
    Type: Grant
    Filed: February 11, 1987
    Date of Patent: June 28, 1988
    Assignee: Stirling Power Systems Corporation
    Inventors: Lennart N. Johansson, William H. Houtman, Worth H. Percival
  • Patent number: 4745965
    Abstract: A separate type heat exchanger characterized in that the evaporation section heated by the hot fluid is formed by fitting a plurality of the evaporation pipes horizontally between the vapor header pipe and the condensed liquid header pipe, the condensation section cooled by the cold fluid is formed above said evaporation section by fitting a plurality of the condensation pipes between the vapor header pipe and the condensed liquid header pipe, both vapor header pipes are connected through the vapor pipe and both condensed liquid header pipes are connected through the condensed liquid pipe to form a circulation path, and said path contains the working fluid is sealed within said path which circulates by evaporating at the evaporation section and condensing at the condensation section.
    Type: Grant
    Filed: August 11, 1986
    Date of Patent: May 24, 1988
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Akiji Katsura, Shiro Endo, Tatsuya Koizumi, Junji Sotani, Yuichi Kimura
  • Patent number: 4616699
    Abstract: A wick-fin heat pipe for increasing the performance of heat pipe evaporators and condensers having extended areas with high thermal conductivity material which increase the heat transfer and decrease the temperature drop. The wick-fin heat pipe provides transporting large amounts of heat with small temperature drop and is capable of accommodating large heat fluxes.
    Type: Grant
    Filed: January 5, 1984
    Date of Patent: October 14, 1986
    Assignee: McDonnell Douglas Corporation
    Inventor: Michael G. Grote
  • Patent number: 4602679
    Abstract: A thermal management system using heat pipe principles and incorporating capillary-pumped equipment mounting panels such that a heat transport loop without moving parts is provided. The panels can function to either absorb heat or to reject heat and can interface with heat generating equipment or heat radiators. Each panel comprises a pair of coextensive flat plates bonded together with a thin, fine-pore sheet wick interposed therebetween. A network of liquid grooves in one plate is in fluid communication with the sheet wick which covers the grooves and most of the plate and a separate liquid line connecting the panels. A network of vapor channels in the other plate is in fluid communication with the wick and with a separate vapor line connecting the panels. The vapor channel networks of the panels and the liquid groove networks of the panels are connected such that the panels are arranged in parallel in the fluid circuit or loop.
    Type: Grant
    Filed: March 22, 1982
    Date of Patent: July 29, 1986
    Assignee: Grumman Aerospace Corporation
    Inventors: Fred Edelstein, Robert A. Haslett, Robert L. Kosson, William Harwell
  • Patent number: 4583587
    Abstract: A monogroove high capacity heat pipe has compact evaporator section 30 formed of a plurality of parallel legs 32 which are in fluid communication with a manifold 36 which is in fluid communication with the condensor section 40 encased in a heat radiating fin 42.
    Type: Grant
    Filed: May 31, 1984
    Date of Patent: April 22, 1986
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Joseph P. Alario, Robert A. Haslett
  • Patent number: 4583582
    Abstract: A system for transferring heat from a first (inner) surface through a second (outer) surface. The system includes at least two adjacent porous and thermally conductive layers between the first surface and the second surface. The innermost layer is characterized by a relatively high porosity and the outermost layer is characterized by a relatively low porosity. The innermost layer houses a fluid coolant. The pores of the innermost and outermost layers are coupled, permitting coolant flow therebetween. A vapor chamber is positioned between the outer surface and an outer member. A controller is adapted to control the vapor pressure in the vapor chamber whereby the coolant has a liquid vapor phase transition in the outermost layer.
    Type: Grant
    Filed: August 2, 1984
    Date of Patent: April 22, 1986
    Assignee: The Charles Stark Draper Laboratory, Inc.
    Inventor: Arthur Grossman
  • Patent number: 4545427
    Abstract: A sealed heat pipe of uniform cross sectional profile from evaporator to condenser which includes a plurality of capillary channels communicating with a central channel by means of narrow re-entrant groove openings having convergent entrances. A two step method of fabrication includes extruding the re-entrant grooves, then drawing a mandrel through the virgin extrusion.
    Type: Grant
    Filed: April 2, 1984
    Date of Patent: October 8, 1985
    Assignee: Grumman Aerospace Corporation
    Inventors: Joseph P. Alario, Robert Kosson, Edward Leszak
  • Patent number: 4523636
    Abstract: An improved heat pipe comprising a duct having disposed at opposite ends thereof an evaporator with wick-lined hollow fins in the form of extended corrugations thereon, and operable to supply heat to the evaporator comprised of a gas combustor having an internal volume for containing the evaporator and combustion air for supply to a combustion chamber located therein; a wick capable of transporting liquid by capillary action lining substantially all internal surfaces of said heat pipe; an external heat sink operable to remove heat from the condenser; and a heat transport medium contained by said heat pipe. The evaporator is further comprised of a coarse porous material lining and completely filling the spaces within the hollow fins open to the evaporator for increased structural stiffness and ease of fabrication; and a porous mass completely filling the evaporator for increased compressive strength.
    Type: Grant
    Filed: September 20, 1982
    Date of Patent: June 18, 1985
    Assignee: Stirling Thermal Motors, Inc.
    Inventors: Roelf J. Meijer, Benjamin Ziph
  • Patent number: 4520865
    Abstract: A closed-loop arterial heat pipe comprises an evaporator domain (10) and a condenser domain (11) interconnected by a transition domain (12). An interior surface of the evaporator domain (10) defines an evaporation chamber, which has a helical channel (17) of capillary transverse dimension formed thereon. The transition domain (11) defines a conduit (13) through which vapor-phase working fluid is thermodynamically driven substantially adiabatically from the evaporator domain (10) to the condenser domain (11), and an artery (14) through which liquid-phase working fluid is returned from the condenser domain (11) to the evaporator domain (10) by capillary action. The artery (14) has a generally pyriform transverse cross-sectional configuration that converges to a throat portion adjacent a slot (16) of capillary transverse dimension on the surface of the evaporation chamber.
    Type: Grant
    Filed: June 25, 1984
    Date of Patent: June 4, 1985
    Assignee: Lockheed Missiles & Space Company, Inc.
    Inventor: Gary D. Bizzell
  • Patent number: 4515207
    Abstract: A screen mesh artery (50) supported concentrically within the evaporator section (20) of a heat pipe liquid channel (27) retains liquid (41) in the channel (27) and thereby assures continued and uniform liquid feed to the heat pipe evaporation section (20) during periods of excessive heat transfer.
    Type: Grant
    Filed: May 30, 1984
    Date of Patent: May 7, 1985
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Joseph P. Alario, Richard F. Brown, Robert L. Kosson
  • Patent number: 4492266
    Abstract: As illustrated in FIGS. 5A, 5B and 5C, a manifolded evaporator (60) comprises a closed evaporation chamber (61) and a delivery structure (62) through which liquid-phase working fluid is delivered into the evaporation chamber (61). One wall (63) of the evaporation chamber (61) is positioned to intercept a flux of heat from a heat source. A wick structure (64), such as a fine-mesh metallic screen, is secured adjacent the wall (63). The delivery structure (62) comprises an elongate supply phenum (65), an elongate recovery plenum (66), and a plurality of delivery conduits (67) connecting the supply plenum (65) to the recovery plenum (66). Each of the delivery conduits (67) is of generally U-shaped configuration with a transverse portion running inside the evaporation chamber (61) immediately adjacent the wick structure (64). A slot (68) along the transverse portion of each delivery conduit (67) allows liquid-phase working fluid to flow out of the delivery conduit (67 ) into the wick structure (64).
    Type: Grant
    Filed: December 22, 1983
    Date of Patent: January 8, 1985
    Assignee: Lockheed Missiles & Space Company, Inc.
    Inventors: Gary D. Bizzell, William F. Ekern
  • Patent number: 4477414
    Abstract: An apparatus for evaporating a solution in constant proportions of the ingredients, including:(a) a solution container having a neck that extends upward from the center;(b) an impregnation member to be impregnated with the solution which is made of a water-absorbing material;(c) an impregnation member support;(d) a cylindrical tubular member that is fitted over a cylindrical tube that projects upward from the center of said support to thereby define an enclosed space;(e) a feed pipe inserted through the hole made in the center of said support, the lower part of said pipe being immersed in the solution in the container and the upper part thereof being within said cylindrical tubular member; and(f) a hole or slit made in the container and the impregnation support member so as to provide a passage that communicates the atmosphere with the space formed in the container by mounting the impregnation member support on the container,the impregnation member support being in the form of a supporting plate from the cent
    Type: Grant
    Filed: May 14, 1982
    Date of Patent: October 16, 1984
    Assignee: Fumakilla Limited
    Inventors: Takayoshi Muramoto, Shingi Nishino, Toshiyuki Sasaki, Takanori Sasaki