Abstract: An inline apparatus and method for processing an unworked masonry article to produce a decorative masonry article having pitched face edges located in a non-parallel relationship to each other. The inline apparatus includes a conveyor line for carrying the masonry article, a pitching machine for pitching at least one of the frontal face edges of the masonry article, a flipping machine for repositioning the masonry article while the masonry article is in the conveying line and a second pitching machine for processing at least one additional face edge which is located in a non-parallel condition to the face edge of masonry article that has been pitched.

Abstract: A fracturable tile for making tesserae or fillets has on the fixing face a pre-fracture regular grid (14) consisting in two series of parallel and equally spaced pre-fracture lines (2) which extend from an edge to the opposed one of the tile and each of these latter includes first grooves (10). The pre-fracture grid (14) delimits portions (3, 4, 5) of the tile in order to allow its split in tesserae or listels.

Abstract: A semiconductor wafer saw for dicing semiconductor wafers comprises variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: An attachment for a percussive tool comprises a plurality of parallel rows of teeth (10) formed along the edges of planar chisel blades (9) arranged to form a shape having rotational symmetry. The attachment is connected to a percussive tool and placed in contact with a wall (12). The tool causes percussive action of the attachment such that the chisel blades (9) form a plurality of parallel grooves (13) and ridges in the wall. The tool and attachment are then rotated through an angle and placed in contact with the wall (12) in a position overlaying the plurality of parallel grooves (13). This breaks up the ridges forming a hole (15) of a substantially uniform depth. The attachment is used to produce square holes suitable for installing wall boxes for light switches or power points.

Abstract: A concrete stone texturing machine, method and a stone having an irregular rough surface resembling a real stone face is described. The machine conveys concrete stones having opposed flat surfaces to a pitching station having at least one pair of opposed pitching blade assembles aligned in a common plane on a respective side of the pitching station. The pitching blade assemblies are displaced towards and away from one another a predetermined distance. Each assembly has a plurality of pitching blades secured in side-by-side aligned relationship. Each of the pitching blades has a forward projecting cutting edge and a securing body portion. A first group of the pitching blades has their cutting edges aligned along a first straight cutting axis which is offset from the cutting edges of the second group of pitching blades aligned along a second straight cutting axis. The cutting axes are parallel to one another.

Abstract: A concrete stone texturing machine, method and a stone having an irregular rough surface resembling a real stone face is described. The machine conveys concrete stones having opposed flat surfaces to a pitching station having at least one pair of opposed pitching blade assembles aligned in a common plane on a respective side of the pitching station. The pitching blade assemblies are displaced towards and away from one another a predetermined distance. Each assembly has a plurality of pitching blades secured in side-by-side aligned relationship. Each of the pitching blades has a forward projecting cutting edge and a securing body portion. A first group of the pitching blades has their cutting edges aligned along a first straight cutting axis which is offset from the cutting edges of the second group of pitching blades aligned along a second straight cutting axis. The cutting axes are parallel to one another.

Abstract: A cutting apparatus comprising a rotary shaft which is detachably fitted with a rotary tool including a cutting blade. The rotary tool itself or a storage case storing the rotary tool has an indicator which may be a bar code and shows the characteristic properties of the cutting blade. A reading means such as a bar code reader for reading the above indicator showing the characteristic properties of the cutting blade is installed on the cutting apparatus.

Abstract: A method is disclosed for constructing non-seamed stone corners for use on outside edges formed by joining thin stone walls at right angles. Thin stone is used to lay the field of the walls. Then first and second cuts are made in a building stone, removing a residual piece and leaving a corner stone with sides ½ inch to 3 inch thick to match the thickness of the thin stone on the field of the walls. These corner stones are laid on the corner formed by the right angle joint between the walls, giving the illusion of a thick building stone wall with nearly the low cost and easy laying of thin stone. Where the residual piece is large enough, it is used to cut a second corner stone in the same manner.

Abstract: Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, a the distance to the blade face is measured as the blade is rotated and a variance in this measured distance is determined. If the variance is no greater than a predetermined maximum, the blade may be used to cut the wafer. In one apparatus of the invention, a wafer saw include a blade and a sensor. The sensor is adapted to monitor a distance to a face of the rotating blade. A processor coupled to the sensor may indicate if the distance to the face of the blade as it rotates deviates too far from a baseline position of the blade face.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A V-cutter for use in forming V-shaped grooves (3) on a light guide panel (1) of the backlight unit for a liquid crystal display (LCD) is disclosed. The V-cutter may include a Z-axis lift piece (7) and a W-axis lift piece (8), each of which has a pin kit (10a, 10b) with a plurality of pins (9a, 9b) attached at the bottom thereof. The pins (9a, 9b) are preferably equal in number and spacing to the V-shaped grooves (3) to be formed. The lift pieces (7, 8) may be vertically actuated by a Z-axis controller (5) and a W-axis controller (6). The light guide panel (1) is preferably fixtured to a table (11). The lift pieces (7, 8) are configured to move with respect to the table (11) so that, through successive X-axis and Y-axis operations, the V-shaped grooves can be formed in perpendicular directions with only two reciprocating motions. As a result, the manufacturing cost of the light guide panels (1) is reduced.

Abstract: A method for cutting a liquid crystal display panel is disclosed in the present invention. The method includes forming a plurality of unit liquid crystal display panels on first and second mother substrates, wherein the unit liquid crystal display panels have at least two different sizes, forming a plurality of first scribing lines on a surface of the first mother substrate, rotating the first and second mother substrates by 90°, and forming a plurality of second scribing lines on the surface of the first mother substrate.

Abstract: The present invention provides a cutting method for hard, brittle materials that is capable of completely cutting through hard, brittle materials such as ceramic, glass, concrete, stone and single crystal materials without the occurrence of edge chipping and at high speed. The present invention is characterized by being a method for completely cutting through a hard, brittle material 1 using a disk-shaped rotary grindstone 2, wherein the cross-sectional shape of the outer peripheral edge 20 of rotary grindstone 2 has a V-shaped pointed shape.

Abstract: An inline apparatus and method for processing an unworked masonry article to produce a decorative masonry article having pitched face edges located in a non-parallel relationship to each other. The inline apparatus includes a conveyor line for carrying the masonry article, a pitching machine for pitching at least one of the frontal face edges of the masonry article, a flipping machine for repositioning the masonry article while the masonry article is in the conveying line and a second pitching machine for processing at least one additional face edge which is located in a non-parallel condition to the face edge of masonry article that has been pitched.

Abstract: A method for dividing a semiconductor wafer into chips according to the present invention is a method for dividing a semiconductor wafer into a large number of semiconductor chips, the semiconductor wafer having a semiconductor layer formed on a substrate. A first method includes the step of forming a blast-resistant mask on a surface of the semiconductor wafer, the blast-resistant mask having a pattern for leaving a grid-like exposed portion as it is and the step of blasting a fine particular blast material to thereby form dividing grooves reaching a predetermined depth of the substrate in the grid-like exposed portion.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A cutting machine of a type having bellows means disposed at least on one side of a chuck table to be reciprocated. A protective sheet covering the upper surface of the bellows means is disposed. One end of the protective sheet is reciprocated in accordance with the reciprocation of the chuck table, while the other end of the protective sheet is connected to winding means. When the chuck table is moved forward or backward, the protective sheet is gradually wound up by the winding means. When the chuck table is moved backward or forward, the protective sheet is gradually wound off from the winding means.

Abstract: An apparatus for splitting solid and hollow masonry materials is provided. The apparatus includes changeable support tables and upper splitting blades to accommodate various types of masonry materials. A hydraulic ram is operated via a foot pedal to increase the pressure in the ram to raise a lower cutting blade and spring-loaded support table to exert upward and downward pressure on the material, coming it to clearly split. The upper blade is height-adjustable and the support table can be fixed in a lowered position to facilitate the splitting process by eliminating overly repetitive operation of the hydraulic ram.

Abstract: A concrete block splitter including an anti-backdrive holding blade, a rigid cutting table, and a lower cutting blade. The present invention provides a masonry splitter that splits blocks or bricks starting from the bottom side of the block, which typically includes the most dense material, so that a resultant fracture propagates along a uniform plane through the block. The anti-backdrive holding blade firmly clamps the block onto the rigid table during a splitting operation in such a manner that the blade does not move relative to the rigid table. Accordingly, during a splitting operation, the block is prevented from moving and the blade is prevented from deflecting. The cutting blade contacts the bottom surface of the block with sufficient force to propagate a fracture through the block. In the preferred embodiment, the splitter is mounted on self-powered wheels for easy installation and removal from an automated block production line.

Abstract: An apparatus for removing tiebars of a lead frame after one or more semiconductor components have been molded to form a package body includes first and second removing stations. The second removing station is provided for removing scraps that may be left in between the leads after the tiebars have been removed in the first removing station. In the second removing station, the lead frame is positioned in place on a die. A scrap-cutting punch is moved relative to the die so that the projections of the punch are fitted into the corresponding holes of the die, thereby pushing the possible scraps out of the leads to the holes.

Abstract: A cutting machine comprising a chuck table for holding a workpiece, a spindle unit having a rotary spindle for mounting a cutting blade which cuts the workpiece held on the chuck table, and a spindle unit support mechanism for supporting the spindle unit in such a manner that it can move in a cutting direction, wherein the spindle unit support mechanism comprises a movable base, a guide rail which is provided on the movable base and has a predetermined curvature radius, a spindle unit support member which is movably disposed along the guide rail and mounts the spindle unit, and an angle adjustment mechanism for moving the spindle unit support member along the guide rail to adjust the angle.

Abstract: A tool for shell or slab-splitting rocks or for wedging rocks in tunnels comprising a hydraulic/pneumatic cylinder (2) with an internal first piston (3), said first piston (3) being provided with a hydraulic/pneumatic pressure by supplying a fluid, preferably oil, through a supply conduit (1), and the power from the piston (3) is transferred to a wedging device comprising a wedge (10) which may be displaced between wedge holders (11, 12) being located in a drilled hole (13), the piston (3) being connected to a piston rod (7) which runs to a second internal piston (8) being located in a piston housing (6), the power from the first piston (3) being transferred to the piston (8), for thereby pressing the wedge holders (11,12) towards the surrounding rock, and creating a crack therein at the appropriate pressure wherein the wedge (10) is located parallel to the lengthwise axis and peripherally in relation to the hydraulic/pneumatic cylinder (2) is disclosed.

Abstract: The invention provides a semiconductor wafer cleaving method and apparatus which are used to obtain an ideal vertical cleaved plane of semiconductor wafers. A semiconductor wafer (1) having a scribing mark (2) inscribed on the surface is set on fulcrum members (6a and 6b). The fulcrum members (6a and 6b) are left-right symmetrical centering around the scribing mark (2) and parallel to the scribing mark (2). Fulcrum members (4a and 4b) are disposed left-right symmetrically centering around the scribing mark (2) and in parallel to the scribing mark (2) on the upper side of the semiconductor wafer (1). The fulcrum members (4a and 4b) are disposed outside the fulcrum members (6a and 6b). Load is applied from the fulcrum members (4a and 4b) side, wherein fulcrum forces are caused to operate from the respective fulcrum members (4a, 4b, 6a and 6b) onto the semiconductor wafer (1).

Abstract: A rock splitter of oil hydraulic piston type includes a housing having a plurality of cylinder chambers on the upper portion and first and second paths communicated with the cylinder chambers for supplying and discharging oil; a piston in the cylinder chamber of the housing; and a cap capable of a vertical movement, the cap being connected to the upper surface of the housing in such a manner that the inner surface thereof is in contact with the upper surface of the housing. The cap moves vertically depending on the movement of the piston. The rock splitter further comprises: a cylinder detachably mounted inside the cylinder chamber of the housing; a collapsible member having a locking member detachably mounted in the cylinder chamber, a plurality of extension members capable of a vertical extension; and an elastic member supporting the lower end of a central extension member. The entire front surface area of the cap touches the rock to maximize the power applied to the rock.

Abstract: Alignment method and apparatus for aligning a cutting blade with a selected street on a semiconductor wafer. It has square chip areas defined by crossing streets and alignment spots formed on its surface. Two street lines with at least one street intervening therebetween are selected, and linear functions ƒ(x) and g(x) are determined on the basis of the coordinates of their alignment spots according to the least squares method. The linear functions ƒ(x) and g(x) run among the alignment spots at the closest distances thereto to represent the two selected streets. Another linear functions ƒ′(x) and g′(x) are determined by putting the linear functions f(x) and g(x) into parallelism with the X-axis.

Abstract: Disclosed is a dicing machine for cutting a CSP plate into pellets and for transferring and putting them in a transport tray. The pick-up-and-transport means picks a selected pellet from a diced CSP plate to carry and put the so selected pellet in an allotted cell in a transport tray. On the way to the transport tray storage area, there is cleaning means for wiping and removing minute pieces of debris if any from the rear side of each pellet. The cleaning means includes a wiper in the form of rotary sponge roll, which is wet with washing liquid, and is rotated to expose its clean surface to each pellet all the time.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A method for producing a semiconductor element comprises the steps of: forming a plurality of grooves on a first surface of a semiconductor multi-layer structure along a first direction: forming a plurality of multi-element bars by cleaving the semiconductor multi-layer structure along a second direction; placing at least one of the plurality of multi-element bars on a support stage; and cleaving the at least one of the plurality of multi-element bars along the plurality of grooves by moving a pressure member in a longitudinal direction of the at least one of the plurality of multi-element bars while a constant load is applied by the pressure member to a second surface of the at least one of the plurality of multi-element bars, the second surface being opposite a third surface corresponding to the first surface of the at least one of the plurality of multi-element bars.

Abstract: The present invention involves a system and method of delaminating a layered silicate to provide improved mechanical properties to select materials such as polymers. The method includes providing particles of the layered silicate and a supercritical fluid. The method further includes contacting the layered silicate particles with the supercritical fluid to define contacted layered silicate particles and catastrophically depressurizing the contacted layered silicate particles to exfoliate the layered particles so that the layered particles are substantially dispersed, defining treated silicate particles.

Abstract: A known stone cutter having an upper jaw powered for a guillotine type cut has a transverse bar in the upper jaw. A series of cube shaped cutter units are mounted side by side along the transverse bar. An isostatic manifold connects all the cutter units for contouring the cutter jaws to the irregular rock surface. At cut time each cutter unit is hydraulically isolated via a shuttle valve from the isostatic manifold so as not to transmit huge cutting pressures to the isostatic manifold and unused cutter units in that cut.

Abstract: The invention relates to a device for cutting slabs or tiles, comprising a frame which has a support surface for the slabs or tiles and a cutting mechanism which is displaceably mounted on the frame, above the support surface, in order to produce a point of break in the surface of the slab or tile. According to the invention, guiding elements are provided for guiding the cutting mechanism along a curved path while it is displaced on the frame.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A masonry block that is produced from a workpiece that is split in a block splitting assembly which uses any of a variety of projections to supplement or replace the action of the splitting blade in splitting and dressing the workpiece. The resulting masonry block has features that provide the masonry block with a weathered appearance.

Abstract: A method of cutting a wafer of a semiconductor material, including breaking the wafer along cutting paths using a knife hitting a sheet supporting the wafer in a frame. The method includes using knives of different lengths according to the wafer region in which the cutting path is located using a tool block including apparatus for receiving at least two knives of different lengths and for rotating step-by-step around an axis to change the knife that is active in the wafer cutting.

Abstract: Devices and methods for cutting fiber-cement materials, such as planks, panels, boards, backing substrates and other materials. A fiber-cement siding cutting tool in accordance with one embodiment of the invention can have an actuator including a driver that moves along a stroke path between a release position and a cutting position. The fiber-cement siding cutting tool can also have a pair of cutting blades including a first cutting blade having a first cutting edge and a second cutting blade having a second edge. The first cutting blade is coupled to the driver to move along the stroke path between the release position and the cutting position. The second cutting blade can be positioned along the stroke path such that the first cutting edge faces the second cutting edge. The fiber-cement siding cutting machine can also include a workpiece support assembly having a first support member on a first side of the stroke path and a second support member on a second side of the stroke path.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A foldable and transportable stone cutting system has been invented for cutting and shaping stones in a field, construction sites and the like, among others. The stone cutter system is so designed that a major cutting portion, e.g., the upper guillotine element, may be folded down during a transportation process. This improved stone cutter system has made a remote or on-site construction work more feasible and at the same time has enhanced its safety during its transportation because of its foldability. This foldable and transportable stone cutting system possesses the towable characteristics needed and the needed safety features. Relevant methods and other disclosures on how the system works and how the unique design has achieved folding capability and towability are also discussed.

Abstract: A method and apparatus for cutting a fiber-cement material. An apparatus in accordance with one embodiment of the invention includes a blade assembly having an alignment member with a first finger portion and a spaced apart second finger portion. Each finger portion has a guide surface and the two guide surfaces define a guide plane. A reciprocating cutting member is pivotably coupled between the finger portions and is moveable relative to the finger portions transverse to the guide plane between a first position and a second position. The cutting member has a blade portion with outwardly facing side surfaces that have a first axial dimension when intersected by the guide plane with the blade in the first position and a second axial dimension, approximately equal to the first axial dimension, when intersected by the guide plane with the blade in the second position.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A cutting machine comprising cassette supporting means, disposed in a cassette bearing area, for supporting a cassette accommodating a plurality of workpieces; a chuck table disposed substantially horizontally movably between a chucking area and a cutting area; cleaning means disposed in a cleaning area; cutting means for cutting the workpiece chucked on the chuck table located in the cutting area; and workpiece transport means. The cassette bearing area, the chucking area, and the cleaning area are placed in this order on a first straight line extending in a predetermined direction. The chucking area and the cutting area are placed on a second straight line extending substantially perpendicularly to the first straight line.

Abstract: The invention is a block splitting machine which uses an assortment of protrusions to supplement or replace the action of the splitting blade in splitting and dressing masonry block.

Abstract: A singulation system for a BGA product is disclosed, which has a cutting mechanism with a cutting head, a conveyor belt arranged under the cutting head, a cutting table positioned to connect with the conveyor belt, a cleaning station positioned beside the cutting mechanism, a loading frame capable of moving up and down and positioned beside the cleaning station, a cassette storage containing multiple receiving cassettes (each having a BGA product contained therein) and positioned to abut one end of the loading frame, a gripping device arranged at the other end of the loading frame, and a revolving arm assembly arranged among the cutting table, the cleaning station and the loading frame and comprising three revolving arms each having a pivotal end and a distal end respectively extending above the cutting table, the cleaning station and the loading frame with each distal end having a suction device mounted thereon.

Abstract: A rock cutter for splitting stones is disclosed which shows a support surface for holding the rock and (a) a first blade and (b) a second blade which may be position to hold the rock between the first and second blades and on the support surface along with a means for moving the first blade towards the second blade. The means for moving comprises a hydraulicly driven piston having a piston arm to which the first blade is mounted. The invention also includes shock means for applying a sudden force to the first blade. The rock cutter also has a cover which is used in conjunction with a means for receiving pieces at an angle after the split.

Abstract: In a manufacturing method of a liquid jet recording head, an element substrate for the liquid jet recording head having an energy generating element for generating energy utilized to discharge a liquid from a discharge port, and a roof plate having a concave portion as a passage of the liquid communicated with the discharge port are joined to each other such that the energy generating element and the concave portion correspond to each other. The passage is formed by this joining. The element substrate is manufactured by including a process for cutting a substrate for cutting-out a plurality of the element substrates from its one face side by a cutting blade and forming a cutting groove in the substrate and a process for traveling a cutting blade so as to trace the cutting groove from the other face side of the substrate.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their elective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: An apparatus for cutting CSP plates into individual pellets to put them on carrier trays for transportation includes a jig rack for the storing of jigs for holding CSP plates. A taking-in and -out table takes a selected jig out from the jig rack to transport it to an area in which CSP plates are brought and laid. The apparatus also includes a cassette table on which a CSP plate cassette is put. The selected CSP plate is taken out from the cassette and is put on an associated jig, which is laid on the table. A first transport transports the CSP plate-and-jig combination from the taking-in and -out table to a working table. The CSP plate is cut with a cutting blade, while the CSP plate-and-jig combination is held on the working table. The CSP plate is cut into individual pellets. A second transport transports the jig holding the CSP plate from the working table to a washing table where the cut CSP plate-and-jig combination are washed.

Abstract: A splitter for splitting stone, concrete, wood and the like comprising a frame (21), a first splitter blade (24) moveable relative to the frame (21), a second splitter blade (23), and hydraulically actuatable means (26, 27) for pulling the first splitter blade (24) towards the second splitter blade (23) to effect said splitting. The hydraulically actuatable means (26, 27) preferably acts on end portions of the first blade (24) to provide increased leverage for the splitting operation. The first blade (24) is preferably provided with centering means (32, 28, 29, 31) for urging the first blade (24) into a central position when it has been moved to one side during the splitting operation.