Abstract: Slabbing machine for removing material M wound around a reel R, comprising a frame; a structure for holding the material M wound around the reel R; a beam connected to the frame and displaceable along the frame in a radial direction y; a blade holder connected to the beam and displaceable along the beam in a longitudinal direction x perpendicular to the radial direction y; a blade mounted on the blade holder for cutting the material M down to a cutting plane p perpendicular to the radial direction y and located at the farthest end of the blade in radial direction y; wherein one or several air outlets are mounted on the blade holder 1 and directed towards the cutting plane p for blowing air towards the cutting plane p.

Abstract: The invention relates to a method of measuring a cutting temperature for an apparatus for a cutting process, when the apparatus for a cutting process includes a shank and a tool jointed to the shank by means of silver solder, the shank being electrically conductive, the tool being electrically nonconductive. The method includes: connecting a first lead wire to the shank, connecting a second lead wire to the silver solder, and measuring thermal electromotive force that is generated between the first lead wire and the second lead wire.

Abstract: A hand-held drilling device, and method for drilling using the device, has a housing, a transducer within the housing, with the transducer effectively operating at ultrasonic frequencies, a rotating motor component within the housing and rigid cutting end-effector rotationally connected to the rotating motor component and vibrationally connected to the transducer. The hand-held drilling device of the present invention operates at a noise level of from about 50 decibels or less.

Abstract: A holding unit is provided to support an ingot in a semiconductor wafer sawing machine, which minimizes the instability of a blade during a sawing process. The holding unit is formed from substantially the same material as an ingot resting thereon. The holding unit includes a top surface for receiving an ingot, a bottom surface, a pair of side walls, and a cavity formed in the holding unit. The cavity forms a plurality of break points in the holding unit. When contacted by the blade, the holding unit fractures at the break points to minimize the chipping of the wafer.

Abstract: A method and apparatus for controlling a mounting pressure for semiconductor ingots provide appropriate mounting pressure so that a high quality bond is formed between a semiconductor ingot and a mounting beam. The pressure between the semiconductor ingot and the mounting beam can be directly determined, but other indications representative of the pressure can be also used to control the mounting pressure.

Abstract: An ingot mounting block consists of an attachment block, a horizontal rocking block and a vertical rocking block. The horizontal rocking block is provided in such a manner to rock horizontally with regard to the attachment block. The vertical rocking block is provided in such a manner to rock vertically with regard to the attachment block. A semiconductor ingot is positioned at the top of the vertical rocking block and is secured thereto. During an alignment of a crystal orientation, the horizontal rocking block and the vertical rocking block are previously inclined at a predetermined angle with regard to the attachment block, and then they are attached to a work feed table of a wire saw.

Abstract: The process and device (1) for positioning several single crystals (2) on a support (3) for their simultaneous cutting in directions well defined relative to the crystal structure of each single crystal; they avoid the adjustment in the machine and minimize the cutting time by providing a positioning outside the machine about angles of rotation (d,g) obtained mathematically from measured and/or given data and which position each geometric single crystal in a plane perpendicular to the cutting direction (z'") whilst bringing the cutting plane of each single crystal (2) parallel to the cutting direction of the machine. The device for practicing the process comprises a frame (5), a gripping device (8) mounted rotatably on the frame and carrying single crystals (2) and a rotatable plate (11) adapted to maintain the cutting support (3) belonging both to the positioning device (1) and to the cutting machine.

Abstract: A positioning process and device (1) for a single crystal (2) for cutting in predetermined directions avoids the adjustment of the cutting machine and minimizes the cutting time by positioning outside of the machine, according to rotational angles (d,g) obtained mathematically from measured and/or imposed data, and which positions the geometric single crystal in a plane perpendicular to the cutting direction (z'") while bringing the cutting plane of the single crystal (2) parallel to the direction of cutting of the machine. The device for practicing the method comprises a frame (5), two cylinders (8) mounted rotatably on the frame and supporting the single crystal (2) and a rotatable plate (12) adapted to maintain the cutting support (3) belonging both to the positioning device (1) and the cutting machine.

Abstract: The method according to the present invention, permits to smooth and polish automatically and semicontinuously slabs of marble, granite and stones of every type while improving substantially the uniformity of smoothing and polishing of the surfaces being worked on and also obtaining substantial increase in the hourly production.

Abstract: A cooling system for a wheeled saw for widening cracks in an asphalt or concrete surface is disclosed. The cooling system includes a compressor and a water reservoir which provide pressurized air and water to one or more mist forming nozzles or fluid directing blocks. The mist is directed unto the cutting blade to keep it cool. After enlarging a crack, foreign materials are blown from the crack allowing it to be immediately sealed.